Energy conditioning structure

• US 7,042,703 B2
• Filed: 05/12/2003
• Issued: 05/09/2006
• Est. Priority Date: 03/22/2000
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, Anthony, Anthony, William
• Primary Examiner(s): Dinkins, Anthony
• Assistant Examiner(s): Ha, Nguyen T.
• Application Number:
  US10/435,199
• Publication Number:
  US 20030231456A1
• Time in Patent Office: 1,093 Days
• Field of Search: 361/302, 361/303, 361/305, 361/301.2, 361/301.4, 361/309, 361/306.3, 361/321.1, 361/311, 361/313, 361/328, 332/182, 332/184, 332/185
• US Class Current: 361/302
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 9/0018 with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

An energy conditioning structure comprised of any combination of multilayer or monolithic energy conditioners with operable conductors, all selectively arranged and shielded for attachment to at least a conductive substrate.

Claims

1. An energy conditioning structure, comprising:

a shunt structure;

a first conditioner; and

a second conditioner;

wherein said first conditioner and said second conditioner are mutually oriented in a complementary position to one another relative to a position of said shunt structure; and

wherein said first conditioner, said second conditioner, and said shunt structure are electrically isolated from one another.

2. The energy conditioning structure of claim 1, in which said first conditioner defines a capacitor structure and said second conditioner defines a capacitor structure.

3. The energy conditioning structure of claim 1, in which said first conditioner and said second conditioner are shielded and isolated from each other by said shunt structure.

4. A circuit comprising the energy conditioning structure of claim 1.

28. The structure of claim 1 wherein said shunt structure includes a shunt structure adjacent region, said shunt structure adjacent region being adjacent said first conditioner and said second conditioner, said shunt structure adjacent region defining a shunt structure adjacent region upper surface and a shunt structure adjacent region lower surface.

29. The structure of claim 28 wherein:

said first conditioner comprises a first capacitive structure including a first capacitive structure conductive element, and a conductive path that electrically contacts said first capacitive structure conductive element to a location on said shunt structure adjacent region upper surface, there being no conductive path from said first capacitive structure conductive element to said shunt structure adjacent region lower surface that does no pass through said location on said shunt structure adjacent region upper surface; and

said second conditioner comprises a second capacitive structure including a second capacitive structure conductive element, and a conductive path that electrically contacts said second capacitive structure conductive element to a location on said shunt structure adjacent region lower surface, there being no conductive path from said second capacitive structure conductive element to said shunt structure adjacent region upper surface that does no pass through said location on said shunt structure adjacent region lower surface.

5. An energy conditioning network, comprising:

an energy source;

a load;

a conductive shield structure;

a plurality of capacitors;

wherein each capacitor of said plurality of capacitors has at least a first portion, a second portion, and a third portion;

wherein a first capacitor and a second capacitor of said plurality of capacitors are oppositely positioned complementary from one another;

wherein said first capacitor and said second capacitor are electrically coupled to said shield structure; and

wherein said first portion of said first capacitor and said first portion of said of second capacitor are electrically isolated and shielded from one another.

6. The energy conditioning network of claim 5, in which each capacitor of said plurality of capacitors is multi-layered.

7. The energy conditioning network of claim 5, in which said energy conditioning network is structured to provide the functions of both energy filtering and surge protection.

8. The energy conditioning network of claim 5, in which said energy conditioning network comprises at least two capacitors connected in a circuit between a line and a ground and at least one capacitor connected between two lines of said circuit.

9. The energy conditioning network of claim 5, in which said energy conditioning network comprises a plurality of bypass capacitors.

10. The energy conditioning network of claim 5, in which said energy conditioning network is in a connector.

11. The energy conditioning network of claim 5, structured to operate as part of an energized power line circuit.

12. The energy conditioning network of claim 10, structured to operate as part of an energized power line circuit;

and

wherein said energy conditioning network is in a voltage divider.

13. An energy conditioning structure, comprising:

an energy shunt;

a first conditioner; and

a second conditioner;

wherein said first conditioner and said second conditioner are mutually oriented in a complementary position to one another relative to a position of said energy shunt; and

wherein said first conditioner, said second conditioner, and said energy shunt are electrically isolated from one another.

14. The energy conditioning structure of claim 13, in which said first conditioner and said second conditioner function to provide a substantial capacitance.

15. The energy conditioning structure of claim 13, in which said first conditioner and said second conditioner are shielded and isolated from each other by said energy shunt.

16. A circuit comprising the energy conditioning structure of claim 13.

17. An energy conditioning network comprising:

an energy source;

a load;

a conductor for shielding capacitors from one another;

a plurality of capacitors;

wherein each capacitor of said plurality has at least a first portion, a second portion, and a third portion;

wherein a first capacitor and a second capacitor of said plurality of capacitors are oppositely positioned complementary from one another;

wherein said first and said second capacitor are electrically coupled to said conductor; and

wherein said first portion of said first capacitor and said first portion of said of second capacitor are electrically isolated and shielded from one another.

18. The energy conditioning network of claim 17, in which each capacitor of said plurality of capacitors is multi-layered.

19. The energy conditioning network of claim 17, in which said energy conditioning network comprises an energy filter and a surge protector.

20. A circuit comprising the energy conditioning network of claim 17, in which said energy conditioning network comprises at least two capacitors each of which is connected between a line and a ground, and said energy conditioning network comprises at least a third capacitor connected between two lines.

21. The energy conditioning network of claim 17, in which said energy conditioning network comprises a plurality of bypass capacitors.

22. The energy conditioning network of claim 17, in which said energy conditioning network comprises a connector.

23. The energy conditioning network of claim 17, in which said energy conditioning network is structured so that it is operable as part of an energized power line circuit.

24. The energy conditioning network of claim 22, in which said energy conditioning network is structured so that it is operable as of an energized power line circuit;

and

wherein said energy conditioning network is in a voltage divider.

25. A method of using an energy conditioning structure, comprising:

shunting energy with an energy shunt;

orienting a first conditioner and a second conditioner mutually in a complementary position to one another relative to a position of said energy shunt; and

wherein said first conditioner, said second conditioner, and said energy shunt are electrically isolated in said energy conditioning structure from one another.

26. A method of energy conditioning, comprising:

providing a source and a load;

providing a plurality of capacitors;

shielding at least a first portion of a first one of said plurality of capacitors from a first portion of a second one of said plurality of capacitors with a conductive shield structure;

wherein said first portion of said first one of said plurality of capacitor is electrically isolated from said first portion of said second one of said plurality of capacitors.

27. An energy conditioning structure, comprising:

a means for shunting energy;

a first conditioner and a second conditioner mutually oriented in a complementary position to one another relative to a position of said means for shunting energy; and

wherein the first conditioner, the second conditioner, and the means for shunting energy are electrically isolated from one another.

30. An energy conditioning structure, comprising:

a shunt structure having a shunt structure adjacent region, said shunt structure adjacent region having a shunt structure adjacent region upper surface and a shunt structure adjacent region lower surface;

a first conditioner having a first conductive path passing through said shunt structure adjacent region;

a second conditioner having a second conductive path passing through said shunt structure adjacent region;

said first conditioner comprising a first conditioner first capacitive structure and a first conditioner conductive path;

wherein said first capacitive structure includes a first capacitive structure conductive element;

wherein said first conditioner conductive path electrically contacts said first capacitive structure conductive element to a location on said shunt structure adjacent region upper surface, and there is no conductive path from said first capacitive structure conductive element to said shunt structure adjacent region lower surface that does not pass through said location on said shunt structure adjacent region upper surface;

said second conditioner comprising a second conditioner second capacitive structure and a second conditioner conductive path;

wherein said second capacitive structure includes a second capacitive structure conductive element; and

wherein said second conditioner conductive path electrically contacts said second capacitive structure conductive element to a location on said shunt structure adjacent region lower surface, and there is no conductive path from said second capacitive structure conductive element to said shunt structure adjacent region upper surface that does not pass through said location on said shunt structure adjacent region lower surface.

31. A method of making an energy conditioning structure, comprising:

providing a shunt structure having a shunt structure adjacent region, said shunt structure adjacent region having a shunt structure adjacent region upper surface and a shunt structure adjacent region lower surface;

providing a first conditioner having a first conductive path passing through said shunt structure adjacent region;

providing a second conditioner having a second conductive path passing through said shunt structure adjacent region;

said first conditioner comprising a first conditioner first capacitive structure and a first conditioner conductive path;

wherein said first capacitive structure includes a first capacitive structure conductive element;

wherein said first conditioner conductive path electrically contacts said first capacitive structure conductive element to a location on said shunt structure adjacent region upper surface, and there is no conductive path from said first capacitive structure conductive element to said shunt structure adjacent region lower surface that does not pass through said location on said shunt structure adjacent region upper surface;

said second conditioner comprising a second conditioner second capacitive structure and a second conditioner conductive path;

wherein said second capacitive structure includes a second capacitive structure conductive element; and

wherein said second conditioner conductive path electrically contacts said second capacitive structure conductive element to a location on said shunt structure adjacent region lower surface, and there is no conductive path from said second capacitive structure conductive element to said shunt structure adjacent region upper surface that does not pass through said location on said shunt structure adjacent region lower surface.

32. A method of using an energy conditioning structure, said energy conditioning structure comprising:

a shunt structure having a shunt structure adjacent region, said shunt structure adjacent region having a shunt structure adjacent region upper surface and a shunt structure adjacent region lower surface;

a first conditioner having a first conductive path passing through said shunt structure adjacent region;

a second conditioner having a second conductive path passing through said shunt structure adjacent region;

said first conditioner comprising a first conditioner first capacitive structure and a first conditioner conductive path;

wherein said first capacitive structure includes a first capacitive structure conductive element;

wherein said first conditioner conductive path electrically contacts said first capacitive structure conductive element to a location on said shunt structure adjacent region upper surface, and there is no conductive path from said first capacitive structure conductive element to said shunt structure adjacent region lower surface that does not pass through said location on said shunt structure adjacent region upper surface;

said second conditioner comprising a second conditioner second capacitive structure and a second conditioner conductive path;

wherein said second capacitive structure includes a second capacitive structure conductive element; and

wherein said second conditioner conductive path electrically contacts said second capacitive structure conductive element to a location on said shunt structure adjacent region lower surface, and there is no conductive path from said second capacitive structure conductive element to said shunt structure adjacent region upper surface that does not pass through said location on said shunt structure adjacent region lower surface, said method comprising;

conditioning energy with said energy conditioning structure.