Optical ready wafers
First Claim
1. An article of manufacture comprising an optical ready substrate made at least in part of a first semiconductor material and having a front side and a backside, said front side having a top surface into which fabrication of microelectronic circuitry has not yet begun and being of sufficient quality to permit microelectronic circuitry to be fabricated therein at a later time by using semiconductor fabrication processing techniques, said optical ready substrate including a first layer region on the front side of the substrate and an optical signal distribution circuit fabricated in the substrate beneath the first layer region, said optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuitry to be fabricated therein at a later time.
1 Assignment
0 Petitions
Accused Products
Abstract
An optical ready substrate made at least in part of a first semiconductor material and having a front side and a backside, the front side having a top surface that is of sufficient quality to permit microelectronic circuitry to be fabricated thereon using semiconductor fabrication processing techniques. The optical ready substrate includes an optical signal distribution circuit fabricated on the front side of the substrate in a first layer region beneath the top surface of the substrate. The optical signal distribution circuit is made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuitry to be fabricated thereon.
329 Citations
31 Claims
- 1. An article of manufacture comprising an optical ready substrate made at least in part of a first semiconductor material and having a front side and a backside, said front side having a top surface into which fabrication of microelectronic circuitry has not yet begun and being of sufficient quality to permit microelectronic circuitry to be fabricated therein at a later time by using semiconductor fabrication processing techniques, said optical ready substrate including a first layer region on the front side of the substrate and an optical signal distribution circuit fabricated in the substrate beneath the first layer region, said optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuitry to be fabricated therein at a later time.
- 29. An article of manufacture comprising an optical ready substrate including a carrier substrate made at least in part of a first semiconductor material, an insulator layer on top of the carrier substrate, and a layer of second semiconductor material on top of the insulator layer, said layer of second semiconductor material defining a top surface that is of sufficient quality to permit microelectronic circuitry to be fabricated thereon using semiconductor fabrication processing techniques, said optical ready substrate also including an optical signal distribution circuit fabricated in the carrier substrate immediately below the insulator layer, said optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuitry to be fabricated thereon.
Specification