MRAM cell structure and method of fabrication
First Claim
1. A method of fabricating an MRAM cell structure having a plurality of MTJ elements each with an uppermost cap layer that has a certain thickness whereby the certain thickness is controlled within a range of about +/−
- 5 Angstroms, comprising;
(a) providing a plurality of MTJ elements on a substrate and depositing an insulation layer on the substrate to a level that covers the MTJ elements including a top surface of said cap layer;
(b) performing a CMP step to planarize said insulation layer wherein the planarized insulation layer has a first thickness above the top surface of said cap layer; and
(c) performing an etch back step to reduce the thickness of said insulation layer wherein the insulation layer is planarized at a second thickness below the top surface of said cap layer.
4 Assignments
0 Petitions
Accused Products
Abstract
An MRAM structure is disclosed where the distance from a bit line or word line to an underlying free layer in an MTJ is small and well controlled. As a result, the bit line or word line switching current is reduced and tightly distributed for better device performance. A key feature in the method of forming the MRAM cell structure is a two step planarization of an insulation layer deposited on the MTJ array. A CMP step flattens the insulation layer at a distance about 60 to 200 Angstroms above the cap layer in the MTJ. Then an etch back step thins the insulation layer to a level about 50 to 190 Angstroms below the top of the cap layer. Less than 5 Angstroms of the cap layer is removed. The distance variation from the free layer to an overlying bit line or word line is within +/−5 Angstroms.
149 Citations
22 Claims
-
1. A method of fabricating an MRAM cell structure having a plurality of MTJ elements each with an uppermost cap layer that has a certain thickness whereby the certain thickness is controlled within a range of about +/−
- 5 Angstroms, comprising;
(a) providing a plurality of MTJ elements on a substrate and depositing an insulation layer on the substrate to a level that covers the MTJ elements including a top surface of said cap layer; (b) performing a CMP step to planarize said insulation layer wherein the planarized insulation layer has a first thickness above the top surface of said cap layer; and (c) performing an etch back step to reduce the thickness of said insulation layer wherein the insulation layer is planarized at a second thickness below the top surface of said cap layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- 5 Angstroms, comprising;
-
10. A method for fabricating an MRAM cell structure having a plurality of MTJ elements each with an uppermost cap layer that has a certain thickness whereby the certain thickness is controlled within a range of about +/−
- 5 Angstroms, comprising;
(a) forming a first conductive layer comprised of a first line on a substrate; (b) forming a plurality of MTJ elements on said first line, each MTJ having a bottom layer, a free layer on said bottom layer, and a cap layer on said free layer; (c) depositing an insulation layer on said substrate to a level that covers the MTJ elements including a top surface of said cap layer; (d) performing a CMP step to planarize said insulation layer wherein the planarized insulation layer a first thickness above the top surface of said cap layer; (e) performing an etch back step to reduce the thickness of said insulation layer wherein the insulation layer is planarized at a second thickness below the top surface of said cap layer; and (f) forming a second conductive layer on said insulation layer and cap layer, said second conductive layer is comprised of a second line that contacts the top surface of said cap layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
- 5 Angstroms, comprising;
Specification