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Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board

  • US 7,045,901 B2
  • Filed: 02/21/2003
  • Issued: 05/16/2006
  • Est. Priority Date: 05/19/2000
  • Status: Expired due to Term
First Claim
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1. A method of forming a chip package for semiconductor chips including the steps as follows:

  • forming a printed circuit board (PCB6) with an open window hole (W) therethrough, the printed circuit board (PCB6) having a length and a width and a top surface and a bottom surface and the open window hole (W) having a greater length than width, forming semiconductor chips including a primary chip (CH5) and a secondary chip (CH6), the primary chip (CH5) and the secondary chip (CH6) each having a length greater than the width of the open window hole (W), forming bonded connections (SB) between the top surface of the printed circuit board (PCB6) and the primary chip (CH5), with the primary chip (CH5) overlying the open window hole (W) and with the primary chip (CH5) extending transversely across the width of the open window hole (W), and locating the secondary chip (CH6) suspended within the open window hole (W) and forming bonded connections (SB) between the secondary semiconductor chip (CH6) and the primary chip (CH5) in a chip-on-chip connection.

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