Integrating tool, module, and fab level control
First Claim
1. A computer-implemented method for processing wafers, said method comprising the steps of:
- (1) receiving, at a first non tool level functional unit, one or more wafer characteristics;
(2) generating, at the first non tool level functional unit, from the one or more wafer characteristics one or more tool targets for one or more tool level functional units;
(3) forwarding said one or more tool targets from said first non tool level functional unit to said one or more tool level functional units; and
(4) generating, at a tool level functional unit, from said one or more tool targets one or more tool recipes defining one or more process setpoints.
1 Assignment
0 Petitions
Accused Products
Abstract
Semiconductor wafers are processed in a fab in a manner that integrates control at multiple functional unit levels. Examples of functional units include fabs, modules, tools, and the like. Initially, a number of functional unit property targets are received at a functional unit. The functional unit property targets are utilized to generate a number of tool targets for any number of tool level functional units. From there, the tool targets are forwarded to the corresponding tool level functional units. At these tool level functional units, a number of tool recipes, each of which define a number of process setpoints, may be generated by processing the tool targets. The process setpoints define a number of parameters which must be satisfied in order to attain the corresponding tool targets. In addition, in at least some embodiments, the tool targets and tool recipes are determined utilizing feedback information including functional unit states and measurements of controlled parameters.
372 Citations
46 Claims
-
1. A computer-implemented method for processing wafers, said method comprising the steps of:
-
(1) receiving, at a first non tool level functional unit, one or more wafer characteristics; (2) generating, at the first non tool level functional unit, from the one or more wafer characteristics one or more tool targets for one or more tool level functional units; (3) forwarding said one or more tool targets from said first non tool level functional unit to said one or more tool level functional units; and (4) generating, at a tool level functional unit, from said one or more tool targets one or more tool recipes defining one or more process setpoints. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 46)
-
-
18. A system for processing wafers, said system comprising:
-
a first non tool level functional unit comprising a controller capable of receiving one or more wafer characteristics associated with said first non tool level functional unit and generating one or more tool targets for one or more tool level functional units associated with said first non tool level functional unit; said one or more tool level functional units capable of receiving said one or more tool targets from said first non tool level functional unit and generating one or more tool recipes defining one or more process setpoints, by processing said one or more tool targets, wherein said one or more tool targets may be accomplished by attaining said one or more process setpoints. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
-
-
30. A system for processing wafers, said system comprising:
-
means for receiving, at a first non tool level functional unit, one or more wafer characteristics associated with said first non tool level functional unit; means for generating, at the first non tool level functional unit, from the one or more wafer characteristics one or more tool targets for one or more tool level functional units; means for forwarding said one or more tool targets from said first non tool level functional unit to said one or more tool level functional units; and means for generating, at a tool level functional unit, from said one or more tool targets one or more tool recipes defining one or more process setpoints. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37)
-
-
38. A computer readable medium for use in processing wafers, said computer readable medium comprising:
-
computer readable instructions for receiving, at a first non tool level functional unit, one or more wafer characteristics; computer readable instructions for generating, at the first functional unit, from the one or more wafer characteristics one or more tool targets for one or more tool level functional units; computer readable instructions for forwarding said one or more tool targets from said first functional unit to said one or more tool level functional units; and computer readable instructions for generating, at a tool level functional unit, from said one or more tool targets one or more tool recipes defining one or more process setpoints. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45)
-
Specification