Miniature highly manufacturable mouse pointing device

• US 7,050,045 B2
• Filed: 01/07/2003
• Issued: 05/23/2006
• Est. Priority Date: 01/07/2003
• Status: Active Grant

• Current Assignee: Interlink Electronics Incorporated
• Original Assignee: Interlink Electronics Incorporated
• Inventors: Baker, Jeffrey R., Sanchez, Carlos S., Tickle, James D.
• Primary Examiner(s): LAO, LUN YI
• Application Number:
  US10/337,458
• Publication Number:
  US 20040130528A1
• Time in Patent Office: 1,232 Days
• Field of Search: 345156-169, 341/22, 341/34, 500/5.A, 500/5.R, 500512-517, 379/433.06, 379/433.07, 338/47, 200/5.A, 200/5.R, 463 37- 38
• US Class Current: 345/169
• CPC Class Codes: G06F 3/0338 with detection of limited linear or angular displacement of an operating part of the device from a neutral position, e.g. isotonic or isometric joysticks
• CPC Class Codes: H01H 13/785 characterised by the material of the contacts, e.g. conductive polymers
• CPC Class Codes: H01H 2201/032 Conductive polymer; Rubber
• CPC Class Codes: H01H 2203/02 Interspersed fingers
• CPC Class Codes: H01H 2221/012 Joy stick type
• CPC Class Codes: H04N 21/42213 for facilitating data entry

Abstract

A pointing device may be directly soldered to a printed circuit board. In one embodiment, a bottom substrate defines a sensing region with a plurality of interdigitated conductive trace regions. Each trace region includes interdigitated common and sense traces. At least one via passes through the bottom substrate for each trace. Each via supports a conductive path from one trace to at least one lead element. Each lead element is solderable to a printed circuit board. A flexible substrate is constructed from a heat resistant polymer. The flexible substrate has a resistive layer deposited on a bottom side. A raised pedestal is formed on the bottom substrate top face around at least a portion of the sensing region. The pedestal separates the interdigitated conductive traces from the flexible substrate resistive layer. A button on a keypad membrane may be used to depress the flexible substrate onto the trace region.

Claims

1. A pointing device for integrating into portable electronic devices comprising:

a bottom substrate having a top face and a bottom face, the top face including a sensing region comprising a plurality of interdigitated conductive trace regions, each trace region including interdigitated common and sense traces, the bottom substrate defining at least one via through the bottom substrate for each sense trace and the common trace, each via supporting a conductive path from one trace to at least one lead element, the bottom face supporting at least one lead element for each sense trace and the common trace, each lead element solderable to a printed circuit board;

a flexible substrate constructed from a heat resistant polymer, the flexible substrate having a resistive layer deposited on a bottom side;

a raised pedestal formed on the bottom substrate top face around at least a portion of the sensing region, the pedestal separating the plurality of the interdigitated conductive traces from the flexible substrate resistive layer; and

an adhesive spacer layer joining the flexible substrate to the bottom substrate such that the resistive layer is facing the bottom substrate sensing region.

2. A pointing device as in claim 1 further comprising a force transfer device having a rounded portion and a shaft portion extending from the rounded portion, the rounded portion operative to contact a top side of the flexible substrate.

3. A pointing device as in claim 1 wherein the plurality of interdigitated conductive trace regions is four trace regions.

4. A pointing device as in claim 1 further comprising:

a printed circuit board having a top face upon which is soldered the bottom substrate; and

a keypad membrane covering the top substrate, the keypad membrane including a contact portion operative to contact the flexible substrate.

5. A pointing device as in claim 4 further comprising a user interface portion on the keypad membrane, the user interface portion extending from the contact portion away from the flexible substrate.

6. A pointing device as in claim 1 further comprising a top substrate affixed to the flexible substrate, the top substrate defining an access opening through the top substrate and over the sensing region.

7. A pointing device as in claim 1 wherein at least one via runs along a side of the bottom substrate between the bottom substrate top side and the bottom substrate bottom side.

8. A pointing device as in claim 1 wherein the at least one lead element is a conductive trace around each of at least one via on the bottom substrate bottom face.

9. A portable user interface including a plurality of keys and a pointing device comprising:

a first substrate supporting a plurality of conductive traces;

a plurality of key switches affixed to the first substrate;

a second substrate soldered to the first substrate conductive traces, the second substrate having a plurality of contact regions, each contact region including a plurality of spaced apart traces, the plurality of spaced apart traces electrically connected to the first substrate conductive traces;

a flexible substrate spaced above the second substrate, the flexible substrate coated with a resistive coating on a side facing the contact regions such that, when pressure is applied to the flexible substrate, the flexible substrate deflects onto the second substrate to form a resistive connection between the spaced apart traces in at least one contact region; and

a keypad membrane covering the flexible substrate and the key switches, the membrane defining a button in a region of the membrane over each of the key switches, the membrane further defining a rounded region for contacting the flexible substrate, the rounded region deflecting portions of the flexible substrate onto at least one contact region based on pressure applied to a side of the keypad membrane opposite of the rounded region.

10. A portable user interface as in claim 9 further comprising a cover defining a plurality of openings, the cover covering the keypad membrane such that each button on the keypad membrane extends through one cover opening, the cover defining an additional opening through which pressure may be applied to the keypad membrane on the opposite side from the rounded region.

11. A portable user interface as in claim 9 wherein the keypad membrane further defines a button for deflecting the rounded region, the button formed on the keypad membrane on a side opposite from the rounded region.

12. A portable user interface as in claim 9 further comprising a third substrate between the flexible substrate and the keypad membrane, the third substrate defining an opening through which the keypad membrane rounded region contacts the flexible substrate.

13. A portable user interface as in claim 9 further comprising an adhesive joining the second substrate and the flexible substrate in a spaced apart manner.

14. A portable user interface as in claim 9 further comprising a raised pedestal formed on the second substrate, the raised pedestal separating the second substrate spaced apart traces from the flexible substrate resistive coating when pressure is not applied to the flexible substrate.

15. A portable user interface as in claim 9 wherein the dimensional resolution of the second substrate spaced apart traces is substantially finer than the dimensional resolution of the first substrate traces.

16. A portable user interface as in claim 9 wherein the second substrate defines a plurality of conducting vias through the second substrate, each via carrying electrical signals between one of the spaced apart traces and one of the first substrate conductive traces.

17. A portable user interface as in claim 16 wherein each via is at least partially surrounded by conducting material on a side of the second substrate opposite of the plurality of contact regions, the conducting material soldered to one of the first substrate conductive traces.

18. A portable user interface as in claim 9 further comprising a package encapsulating the second substrate and the flexible substrate, the package defining an opening over the contact regions.

19. A portable user interface as in claim 18 further comprising a plurality of conductive leads extending from the package, each lead solderable to one of the first substrate conductive traces, each lead electrically connected with one of the plurality of spaced apart traces.

20. A method of making a surface mountable pointing device comprising:

forming a thin bottom substrate material to have a top surface area of sufficient size to support a plurality of pointing devices;

for each pointing device supported, forming a plurality of through holes in the bottom substrate material;

for each pointing device supported, forming on the bottom substrate top surface a plurality of sets of sensing conductive traces in a sensing region, each set of sensing conductive traces including at least two electrically separate interdigitated sensing traces;

for each pointing device supported, forming at least one connecting conductive trace from each sensing conductive trace to and into at least one of the through holes;

depositing an insulative material on the bottom substrate top surface substantially around each sensing region, the insulative material forming a raised pedestal;

forming a high temperature resistant flexible substrate sized to substantially cover the bottom substrate top surface, the flexible substrate coated with a resistive material on a bottom surface;

adhering the flexible substrate bottom surface to the bottom substrate top surface such that, for each pointing device supported, resistive material is suspended above the sensing region; and

dicing the bottom substrate to separate each pointing device.

21. A method of forming a surface mountable pointing device as in claim 20 further comprising:

forming a thin top substrate material to have a bottom surface area substantially the same as the bottom substrate top surface area;

forming a sensing opening in the top substrate material for each pointing device supported;

adhering the top substrate bottom surface to the flexible substrate such that the sensing opening is above the sensing region for each pointing device supported; and

dicing the top substrate as the bottom substrate is diced.

22. A method of forming a surface mountable pointing device as in claim 20 further comprising forming at least one conductive terminal for at least one through hole, each conductive terminal facilitating soldering of the pointing device to a printed circuit board.

23. A method of forming a surface mountable pointing device as in claim 20 wherein dicing cuts through at least one through hole such that the through hole forms a via along a side of the pointing device normal to the bottom substrate top surface.

24. A method of forming a surface mountable pointing device as in claim 20 further comprising:

constructing a printed circuit board for receiving a plurality of key switches;

forming a plurality of printed circuit board traces on the printed circuit board; and

soldering the bottom substrate to the plurality of traces on the printed circuit board.

25. A method of forming a surface mountable pointing device as in claim 24 further comprising:

forming a keypad membrane having a plurality of key buttons and a pointing interface, the pointing interface having a contacting portion on a bottom side of the keypad membrane and a raised area on a top side of the keypad membrane opposite the contacting portion; and

positioning the keypad membrane over the printed circuit board such that each key button activates a key switch and such that the contacting portion of the keypad membrane is positioned above the flexible substrate.

26. A method of forming a surface mountable pointing device as in claim 24 wherein the thickness of the bottom substrate is substantially less than the thickness of the printed circuit board.

27. A method of forming a surface mountable pointing device as in claim 24 wherein the pitch of the sensing conductive traces is substantially finer than the pitch of the printed circuit board traces.

28. A method of forming a surface mountable pointing device as in claim 20 further comprising applying a high temperature adhesive to adhere the flexible substrate bottom surface to the bottom substrate top surface.

29. A method of forming a surface mountable pointing device as in claim 20 wherein the plurality of sets of sensing conductive traces is four sets of conductive traces, each set sharing a common trace.

30. A pointing device for integrating into portable electronic devices comprising:

a bottom substrate having a top face and a bottom face, the top face including a sensing region comprising a plurality of interdigitated conductive trace regions, each trace region including interdigitated common and sense traces, the top face defining at least one conductive pad electrically connected to each trace;

an electrical lead element in electrical connection with each pad;

a flexible substrate constructed from a heat resistant polymer, the flexible substrate having a resistive layer deposited on a bottom side;

a raised pedestal formed on the bottom substrate around at least a portion of the sensing region, the pedestal separating the plurality of the interdigitated conductive traces from the flexible substrate resistive layer;

an adhesive spacer layer joining the flexible substrate to the bottom substrate such that the resistive layer is facing the bottom substrate sensing region; and

a package encapsulating the bottom substrate, the flexible substrate, the raised pedestal, the adhesive spacer layer and a portion of each electrical lead element, the package defining an opening over the sensing region.