Method of measuring weak gas flows

• US 7,051,418 B2
• Filed: 08/14/2003
• Issued: 05/30/2006
• Est. Priority Date: 03/31/1999
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Trausch, Günter
• Primary Examiner(s): Kim, Paul D.
• Application Number:
  US10/641,263
• Publication Number:
  US 20040031320A1
• Time in Patent Office: 1,020 Days
• Field of Search: 295/921, 295/93, 296/021, 731/59, 732/041.1, 732/041.7, 732/042.6, 156/268, 156/344, 216/39, 216/41, 216/56, 438/455, 438/458, 438/976
• US Class Current: 29/593
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01F 1/692 Thin-film arrangements
• CPC Class Codes: Y10S 156/922 Specified electronic component delaminating in preparation for recycling
• CPC Class Codes: Y10S 438/976 Temporary protective layer
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Firstly, a supporting frame is produced, whose opening is spanned by an auxiliary layer flush on one side. Following the production of microstructures, flat parts or membranes on the common plane defined by the auxiliary layer and the supporting frame, the auxiliary layer is removed, preferably by etching. In a preferred application, the self-supporting microstructures produced in accordance with the method of the invention are used as electrically heatable resistance grids in a device for measuring weak gas flows.

Claims

1. A method of measuring a weak gas flow, which comprises:

producing an assembly of self-supporting microstructures by;

a) providing a supporting frame with at least one opening;

b) applying, on the supporting frame, an adhesive film spanning the opening in the supporting frame flatly;

c) applying an auxiliary layer on an underside of the adhesive film and adjacent regions of the supporting frame with the auxiliary layer spanning the opening in the supporting frame on one side flush with the supporting frame;

d) removing the adhesive film;

e) constructing microstructures on the common plane including the auxiliary layer and the supporting frame; and

f) removing the auxiliary layer formed in step c);

integrating the self-supporting microstructures configured as electrically heatable resistance grids in a device for measuring weak gas flows; and

exposing the resistance grids to the weak gas flow and measuring the weak gas flow.

2. The method according to claim 1, which comprises placing the resistance grids in thermal contact with the gas flow through the device, and providing a bridge circuit with the resistance grids connected therein, the bridge circuit having a first diagonal with a constant current source and a second diagonal with instruments configured to process measured values or display measured values.

3. The method according to claim 1, which comprises providing the device with a first chamber and a second chamber and a connecting tube therebetween, and disposing the resistance grids in the connecting tube between the first chamber and the second chamber and perpendicular to a flow direction at a distance from each other.

4. The method according to claim 1, which comprises forming the resistance grids with a serpentine configuration.

5. The method according to claim 1, which further comprises placing a frame-type spacer between the resistance grids and defining a distance therebetween.

6. The method according to claim 1, which further comprises disposing the resistance grids on supporting frames of glass.