Method making a cutting disk into of a substrate

• US 7,051,426 B2
• Filed: 09/12/2003
• Issued: 05/30/2006
• Est. Priority Date: 01/31/2002
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Buswell, Shen
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/661,868
• Publication Number:
  US 20040055145A1
• Time in Patent Office: 991 Days
• Field of Search: 296/11, 297/29, 298/901, 347/65, 347/62, 347/54, 347/92, 451/36, 451/38, 451/37, 451/58, 451/57
• US Class Current: 29/611
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1634 laser machining
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device

Abstract

The described embodiments relate to methods and systems of forming slots in a substrate. One exemplary embodiment forms a feature into a substrate having a first substrate surface and a second substrate surface, and moves a sand drill nozzle along the substrate to remove substrate material sufficient to form, in combination with said forming, a slot through the substrate.

Claims

1. A method comprising:

making a cut into a first surface of a substrate using a cutting disk having a generally planar surface that is oriented generally perpendicular to the first surface;

first directing abrasive particles toward a first portion of a second generally opposite surface of the substrate to remove substrate material; and

,

after said first directing, second directing abrasive particles toward a second different portion of the second generally opposite surface of the substrate to remove additional substrate material, wherein said first directing and said second directing, in combination with said making a cut, form a slot.

2. The method of claim 1, wherein said act of making and said acts of directing form the slot which is defined, at least in part, by two generally opposing endwalls each of which form an angle of at least 90 degrees measured through the substrate and relative to the second surface.

3. The method of claim 1, wherein said act of making comprises making a cut between two generally linear arrays of firing resistors positioned over the substrate.

4. The method of claim 1, further comprising after said acts of making and directing, positioning an orifice plate over the first surface.

5. A method comprising:

cutting substrate material with a circular saw positioned relative to a first surface of a substrate; and

,

removing additional substrate material from a second generally opposite surface of the substrate by moving a sand drill nozzle along the substrate while ejecting abrasive particles therefrom, wherein said acts of cutting and removing form a slot through the substrate.

6. The method of claim 5, wherein said act of moving comprises moving a sand drill nozzle having a terminal end through which the abrasive particles are ejected along a path, the terminal end having a generally square cross section taken transverse the path.

7. The method of claim 5, wherein said act of moving comprises moving a sand drill nozzle having a terminal end through which the abrasive particles are ejected along a path, the terminal end having a generally circular cross section taken transverse the path.

8. The method of claim 5, wherein said act of cutting forms a tapered elevational profile in the substrate.

9. The method of claim 5, wherein the first surface and the second surface define a thickness therebetween, and wherein said act of cutting cuts through the entire thickness of at least a portion of the substrate.

10. The method of claim 5, wherein said act of cutting comprises moving the circular saw along a vector simultaneously having a component in a first direction substantially perpendicular to the first surface and a component in a second direction substantially parallel to the first surface.

11. The method of claim 5, wherein said cutting comprises making multiple passes with the circular saw.

12. A method comprising:

cutting substrate material by moving a circular saw toward a substrate from a first direction; and

,

removing additional substrate material from the substrate by moving a sand drill nozzle along the substrate while ejecting abrasive particles from the sand drill in a second direction which is generally opposite to the first direction, wherein the cutting and removing form a desired slot through the substrate.