Light active sheet and methods for making the same
First Claim
1. A method for forming a sheet of light active material, comprising the steps of:
- Providing a first substrate having a transparent first conductive layer, the transparent first conductive layer comprising a transparent coating preformed on the first substrate;
Forming a pattern of light active semiconductor element, the light active semiconductor elements having an n-side and a p-side, each said light active semiconductor element having either of said n-side or said p-side in electrical communication with the transparent conductive layer;
Providing a second substrate having a second conductive layer;
Securing the second substrate to the first substrate, the other of said n-side or said p-side of each said light active semiconductor element in electrical communication with the second conductive layer to form a light active device.
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Accused Products
Abstract
A method for making a sheet of light active material. A first substrate is provided having a transparent first conductive layer. A pattern of light active semiconductor elements are formed. The pattern of light active semiconductor elements may be formed using an electrostatic attraction and transferring process. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate having a second conductive layer is provided. The second substrate is secured to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element in electrical communication with the second conductive layer. Thus, a solid-state sheet of light active material is formed.
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Citations
37 Claims
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1. A method for forming a sheet of light active material, comprising the steps of:
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Providing a first substrate having a transparent first conductive layer, the transparent first conductive layer comprising a transparent coating preformed on the first substrate; Forming a pattern of light active semiconductor element, the light active semiconductor elements having an n-side and a p-side, each said light active semiconductor element having either of said n-side or said p-side in electrical communication with the transparent conductive layer; Providing a second substrate having a second conductive layer; Securing the second substrate to the first substrate, the other of said n-side or said p-side of each said light active semiconductor element in electrical communication with the second conductive layer to form a light active device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for forming a light-emitting device, comprising the steps of:
- providing a first substrate;
forming a first conductive surface on the first substrate, the first conductive surface being formed as a conductive pattern comprised of at least one of a conductive coating, a conductive ink and a conductive adhesive;
forming a pattern of LED chips on the conductive pattern, each LED chip having an anode and a cathode side;
providing a second substrate;
forming a second conductive surface on the second substrate;
fixing the first substrate to the second substrate so that either of the anode and the cathode side of the LED chip is in electrical communication with the first conductive surface and the other of the anode and the cathode side of the LED chips is in electrical communication with the second conductive surface. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
- providing a first substrate;
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26. A method for forming a light-to-energy device, comprising the steps of:
- providing a first substrate;
forming a first conductive surface on the first substrate, the first conductive surface being formed as a conductive pattern comprised of at least one of a conductive coating, a conductive ink and a conductive adhesive;
forming a pattern of semiconductor elements on the conductive pattern, each semiconductor element comprising a charge donor layer side and a charge acceptor side;
providing a second substrate;
forming a second conductive surface on the second substrate;
fixing the first substrate to the second substrate so that either of the charge donor and the charge acceptor side of the semiconductor elements is in electrical communication with the first conductive surface and the other of the charge donor and the charge acceptor side of the semiconductor elements is in electrical communication with the second conductive surface. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
- providing a first substrate;
Specification