Semiconductor package using terminals formed on a conductive layer of a circuit board
First Claim
Patent Images
1. A flash EEPROM package including:
- a circuit board;
at least one integrated circuit on the circuit board; and
packaging material surrounding the at least one integrated circuit and part of the circuit board, wherein one side of the circuit board is exposed, the exposed side of the circuit board including a set of terminals connected to the remainder of the circuit board by vias.
2 Assignments
0 Petitions
Accused Products
Abstract
A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.
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Citations
17 Claims
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1. A flash EEPROM package including:
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a circuit board; at least one integrated circuit on the circuit board; and packaging material surrounding the at least one integrated circuit and part of the circuit board, wherein one side of the circuit board is exposed, the exposed side of the circuit board including a set of terminals connected to the remainder of the circuit board by vias. - View Dependent Claims (2, 3, 4, 5)
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6. A flash EEPROM package, comprising:
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a circuit board; one or more integrated circuits on a first side of the circuit board, the one or more integrated circuits including at least one flash EEPROM memory array; terminals on an opposing second side of the circuit board; packaging material overlying the first side of the circuit board and overlying the one or more integrated circuits, the packaging material conforming to surfaces of the first side of the circuit board and the one or more integrated circuits. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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14. A flash EEPROM package comprising:
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a circuit board having a first side and an opposing second side; at least one EEPROM integrated circuit on the first side of the circuit board; at least one passive device on the first side of the circuit board; packaging material surrounding the at least one integrated circuit and covering at least a portion of the first side of the circuit board; and a plurality of terminals on the second side of the circuit board. - View Dependent Claims (15, 16, 17)
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Specification