Adhesive sacrificial bonding of spatial light modulators
First Claim
1. A method of combining components to form an integrated device, comprising the following steps:
- providing at least one first component on a first surface of a sacrificial substrate,providing at least one second component on a first surface of a non-sacrificial substrate;
forming at least one support structure on at least one of said first surfaces of said sacrificial substrate, and said non-sacrificial substrate, respectively, such that said at least one support structure is extended outwardly from at least one of said first surfaces;
bonding said sacrificial substrate carrying said at least one first component, and said non-sacrificial substrate carrying said at least one second component, respectively, with an intermediate bonding material, so that said first surfaces will be facing one another with a distance essentially defined by a thickness of said support structure,removing at least a part of said sacrificial substrate;
mechanically and/or electrically interconnecting said at least one first component and said at least one second component.
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Accused Products
Abstract
A method of combining components to form an integrated device, wherein at least one first component is provided on a first surface of a sacrificial substrate, and at least one second component is provided on a first surface of a non-sacrificial substrate. At least one support structure is formed on at least one of the first surfaces of the sacrificial substrate, and the non-sacrificial substrate, respectively, such that said at least one support structure is extended outwardly from at least one of the first surfaces. The sacrificial substrate carrying the first component, and the non-sacrificial substrate carrying the second component, respectively, are bonded, so that the first and second surfaces will be facing one another with a distance defined by a thickness of the support structure. At least a part of the sacrificial substrate is removed. The first component and second components are interconnected.
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Citations
31 Claims
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1. A method of combining components to form an integrated device, comprising the following steps:
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providing at least one first component on a first surface of a sacrificial substrate, providing at least one second component on a first surface of a non-sacrificial substrate; forming at least one support structure on at least one of said first surfaces of said sacrificial substrate, and said non-sacrificial substrate, respectively, such that said at least one support structure is extended outwardly from at least one of said first surfaces; bonding said sacrificial substrate carrying said at least one first component, and said non-sacrificial substrate carrying said at least one second component, respectively, with an intermediate bonding material, so that said first surfaces will be facing one another with a distance essentially defined by a thickness of said support structure, removing at least a part of said sacrificial substrate; mechanically and/or electrically interconnecting said at least one first component and said at least one second component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A Spatial Light Modulator comprising:
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a substrate with at least one integrated circuit; a plurality of micro mirror modulating elements that are individually movable reflecting elements to which hinge elements are attached, said reflecting elements being made of single crystalline material; support members defining a spacing between said substrate and said modulating elements; and interconnecting elements that electrically interconnect said modulating elements and said substrate. - View Dependent Claims (28, 29, 30)
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31. A Spatial Light Modulator comprising:
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a substrate with at least one integrated circuit; a plurality of micro mirror modulating elements that are individually movable reflecting elements to which hinge elements are attached, said reflecting elements being made of one or more materials selected from the group consisting of high temperature annealed and high temperature deposited material; support members defining a spacing between said substrate and said modulating elements; and interconnecting elements that electrically interconnect said modulating elements and said substrate.
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Specification