Method and apparatus for assembling an array of micro-devices

• US 7,057,245 B2
• Filed: 06/12/2004
• Issued: 06/06/2006
• Est. Priority Date: 01/17/2001
• Status: Expired due to Term

• Current Assignee: Atomica Corporation (Answers.com Corporation)
• Original Assignee: Innovative Micro Technology Incorporated
• Inventors: Stocker, John W, Rubel, Paul J., Foster, John Stuart, Feierabend, Patrick Edward, Summers, Jeffery Frank, Wallis, Andrew Dexter, Martin, Richard Thomas
• Primary Examiner(s): Coleman, W. David
• Assistant Examiner(s): Tobergte, Nicholas J.
• Application Number:
  US10/866,123
• Publication Number:
  US 20050003631A1
• Time in Patent Office: 724 Days
• Field of Search: 257/414
• US Class Current: 257/414
• CPC Class Codes: B81C 3/008 Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
• CPC Class Codes: G02B 6/3512 the optical element being reflective, e.g. mirror
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/353 the optical element being a shutter, baffle, beam dump or opaque element absorbers on light guide termination G02B6/243
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/3572 Magnetic force magnetic forces controlling reflecting elements in general G02B26/085; magneto-optic devices G02F1/09
• CPC Class Codes: G02B 6/3578 Piezoelectric force piezoelectric forces controlling reflecting elements in general G02B26/0858; piezo-optic devices G02F1/0131
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/3586 Control or adjustment details, e.g. calibrating testing optical equipment G01M11/00

Abstract

The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

Claims

1. An array of lithographically fabricated MEMS devices comprising:

a plurality of individual dies including at least one MEMS device, each die having been separated from adjacent dies on an original fabrication wafer, with each die of the plurality positioned on a second wafer, and affixed mechanically to said second wafer.

2. The array of lithographically fabricated MEMS devices according to claim 1, wherein each individual die in the array is connected electrically to supporting circuiting in said second wafer.

3. The array of lithographically fabricated MEMS devices according to claim 1, wherein said second wafer comprises electronic circuitry to manipulate said at least one MEMS devices.

4. The array of lithographically fabricated MEMS devices according to claim 1, wherein each individual die has been rotated out of an original plane of fabrication.

5. The array of lithographically fabricated MEMS devices according to claim 1, wherein the dies in the array are not all alike.

6. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises a utilitarian feature affixed to a MEMS microactuator.

7. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises a fluid flow diverter affixed to a MEMS microactuator.

8. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises an electrical relay affixed to a MEMS microactuator.

9. The array of lithographically fabricated MEMS devices according to claim 6, wherein the utilitarian feature of at least one of the MEMS devices differs from the utilitarian feature of at least one other of the MEMS devices.

10. The array of lithographically fabricated MEMS devices according to claim 6, wherein the utilitarian feature is the same for each of the at least one MEMS device.

11. The array of lithographically fabricated MEMS devices according to claim 1, wherein the at least one MEMS device comprises an optical element affixed to a MEMS microactuator.

12. The array of lithographically fabricated MEMS devices according to claim 11, wherein said optical element comprises a mirror.

13. The array of lithographically fabricated MEMS devices according to claim 12, wherein the array is coupled with a block of N input optical fibers and a block of M exit optical fibers, forming an N×

M fiber optic switch.

14. The array of lithographically fabricated MEMS devices of claim 1, wherein the plurality of individual dies are detached from adjacent dies on the original fabrication wafer, before being affixed to the second wafer.

15. The array of lithographically fabricated MEMS devices according to claim 1, wherein each individual die has been rotated out of an original plane of fabrication into a rotated orientation, and affixed in the rotated orientation to the second wafer.

16. The array of lithographically fabricated MEMS devices of claim 1, wherein the plurality of individual dies includes at least one unencapsulated MEMS device.