Optical module with lens integral holder fabrication method

• US 7,059,040 B1
• Filed: 01/16/2001
• Issued: 06/13/2006
• Est. Priority Date: 01/16/2001
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Glenn, Thomas P., Hollaway, Roy Dale
• Primary Examiner(s): Eley, Timothy V.
• Application Number:
  US09/764,196
• Time in Patent Office: 1,974 Days
• Field of Search: 298/31, 298/32, 298/41, 294/11, 294/12, 294/15, 250/216, 250/239, 250/214.1, 257/80, 257 81- 84, 257432-434, 359/819
• US Class Current: 29/831
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49787 : Obtaining plural composite product pieces from preassembled workpieces

Abstract

A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.

Claims

1. A method of forming an optical module comprising:

coupling an image sensor to a base of a substrate;

coupling a lens housing to a sidewall of said substrate, wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate; and

singulating said image sensor substrate.

2. The method of claim 1 wherein said base comprises a first surface, a first surface of said image sensor being coupled to said first surface of said base.

3. The method of claim 2 wherein said image sensor comprises a second surface comprising a bond pad, said method further comprising electrically coupling said bond pad to an interior trace on said first surface of said base.

4. The method of claim 1 further comprising coupling a window to said lens housing.

5. The method of claim 1 further comprising coupling an optical element to said lens housing.

6. The method of claim 5 wherein said optical element comprises a lens.

7. The method of claim 1 further comprising coupling a lens support to said lens housing.

8. The method of claim 7 wherein said coupling a lens support comprises threading said lens support into a central aperture of said lens housing.

9. The method of claim 8 wherein an active area of said image sensor is visible through said central aperture.

10. The method of claim 9 further comprising:

directing radiation at said optical module; and

rotating said lens support to focus said radiation on said active area.

11. The method of claim 7 wherein said lens support is snap mounted into said lens housing.

12. The method of claim 1 wherein said singulating comprises snapping said image sensor substrate.

13. A method comprising:

coupling an image sensor to a base of a substrate;

coupling a mounting surface of a lens housing to a joint surface of a sidewall of said substrate, wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate; and

singulating said image sensor substrate.

14. The method of claim 13 wherein said mounting surface is coupled to said joint surface by adhesive.

15. The method of claim 13 wherein said mounting surface is coupled to said joint surface by a butt bond.

16. The method of claim 13 wherein said mounting surface comprises a locking feature.

17. The method of claim 13 wherein said joint surface comprises a locking feature.

18. The method of claim 13 wherein said singulating comprises snapping said image sensor substrate.

19. A method comprising:

coupling an image sensor to a base of a substrate;

coupling a mounting surface comprising a locking feature of a lens housing to a joint surface of a sidewall of said substrate comprising;

forming a bond between a first surface of said mounting surface and said joint surface; and

forming a bond between a second surface of said mounting surface and an interior surface of said sidewall.

20. The method of claim 19 wherein said first surface of said mounting surface is parallel to said joint surface and wherein said second surface of said mounting surface is perpendicular to said joint surface.

21. The method of claim 19 wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate.

22. A method comprising:

coupling an image sensor to a base of a substrate; and

coupling a mounting surface of a lens housing to a joint surface comprising a locking feature of a sidewall of said substrate comprising;

forming a bond between a first surface of said joint surface and said mounting surface; and

forming a bond between a second surface of said joint surface and an exterior side surface of said lens housing.

23. The method of claim 22 wherein said first surface of said joint surface is parallel to said mounting surface and wherein said second surface of said joint surface is perpendicular to said mounting surface.

24. The method of claim 22 wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate.

25. A method comprising:

coupling an image sensor to a first substrate of an image sensor substrate;

coupling a lens housing to said first substrate; and

snapping said image sensor substrate along a singulation street between a first sidewall of said first substrate and a second sidewall of a second substrate of said image sensor substrate.

26. A method of forming an optical module comprising:

coupling an image sensor to a base of a substrate;

forming a bond between a first surface of a mounting surface of a lens housing and a joint surface of a sidewall of said substrate; and

forming a bond between a second surface of said mounting surface and an interior surface of said sidewall.

27. The method of claim 26 wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate.

28. A method of forming an

coupling an image sensor to a base of a substrate;

forming a bond between a first surface of a mounting surface of a lens housing and a joint surface of a sidewall of said substrate, said first surface of said mounting surface being parallel to said joint surface; and

forming a bond between a second surface of said mounting surface and an interior surface of said sidewall, said second surface of said mounting surface being perpendicular to said joint surface.

29. The method of claim 28 wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate.

30. A method of forming an optical module comprising:

coupling an image sensor to a base of a substrate;

forming a bond between a first surface of a joint surface of a sidewall of said substrate and a mounting surface of a lens housing; and

forming a bond between a second surface of said joint surface and an exterior side surface of said lens housing.

31. The method of claim 30 wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate.

32. A method of forming an optical module comprising:

coupling an image sensor to a base of a substrate;

forming a bond between a first surface of a joint surface of a sidewall of said substrate and a mounting surface of a lens housing, said first surface of said joint surface being parallel to said mounting surface; and

forming a bond between a second surface of said joint surface and an exterior side surface of said lens housing, said second surface of said joint surface being perpendicular to said mounting surface.

33. The method of claim 32 wherein said substrate is one of a plurality of substrates coupled together in an image sensor substrate.

34. A method of forming an optical module comprising:

coupling an image sensor to a base of a first substrate of an image sensor substrate;

coupling a lens housing to said first substrate comprising;

forming a bond between a first surface of a mounting surface of said lens housing and a joint surface of a first sidewall of said first substrate; and

forming a bond between a second surface of said mounting surface and an interior surface of said first sidewall; and

snapping said image sensor substrate along a singulation street between said first sidewall of said first substrate and a second sidewall of a second substrate of said image sensor substrate.