Methods for the electronic, homogeneous assembly and fabrication of devices
First Claim
1. A method for the fabrication of microscale and nanoscale devices comprising the steps of:
- providing a target device having at least one target electrode,providing a first component device and a fluidic medium in contact with the target device,placing the first component device relative to the target electrode through action of at least electroosmotic force from the target device to the component device, andattaching the component device to the target device, wherein the attachment step includes a solder reflow step.
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Accused Products
Abstract
Methods and apparatus are provided for the fabrication of microscale, including micron and sub-micron scale, including nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the component devices may be attached to the target device using a solder reflow step.
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Citations
23 Claims
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1. A method for the fabrication of microscale and nanoscale devices comprising the steps of:
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providing a target device having at least one target electrode, providing a first component device and a fluidic medium in contact with the target device, placing the first component device relative to the target electrode through action of at least electroosmotic force from the target device to the component device, and attaching the component device to the target device, wherein the attachment step includes a solder reflow step. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for the fabrication of microscale and nanoscale devices comprising the steps of:
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providing a target device having at least one target electrode, providing a first component device and a fluidic medium in contact with the target device, placing the first component device relative to the target electrode through action of an electronic force from the target device to the component device and a fluidic force, and attaching the component device to the target device, wherein the attachment step includes a solder reflow step. - View Dependent Claims (23)
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Specification