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Methods for the electronic, homogeneous assembly and fabrication of devices

  • US 7,060,224 B2
  • Filed: 01/06/2003
  • Issued: 06/13/2006
  • Est. Priority Date: 11/08/1999
  • Status: Expired due to Term
First Claim
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1. A method for the fabrication of microscale and nanoscale devices comprising the steps of:

  • providing a target device having at least one target electrode,providing a first component device and a fluidic medium in contact with the target device,placing the first component device relative to the target electrode through action of at least electroosmotic force from the target device to the component device, andattaching the component device to the target device, wherein the attachment step includes a solder reflow step.

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