Semiconductor devices

• US 7,061,083 B1
• Filed: 12/10/1999
• Issued: 06/13/2006
• Est. Priority Date: 12/17/1998
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Sato, Akira, Saito, Takeshi, Usami, Mitsuo, Tsuji, Kazutaka, Takaragi, Kazuo, Yasunobu, Chizuko, Sameshima, Kenji
• Primary Examiner(s): Wilson, Allan R.
• Assistant Examiner(s): NGUYEN, JOSEPH H
• Application Number:
  US09/868,231
• Time in Patent Office: 2,377 Days
• Field of Search: 257/777, 257/778, 257/679, 257/773, 257/763
• US Class Current: 257/679
• CPC Class Codes: B42D 2033/46 with electrical circuitry
• CPC Class Codes: B42D 25/29 Securities; Bank notes
• CPC Class Codes: B42D 25/30 Identification or security features, e.g. for preventing forgery
• CPC Class Codes: D21H 21/48 Elements suited for physical verification, e.g. by irradiation
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07363 by preventing analysis of the circuit, e.g. dynamic or static power analysis or current analysis
• CPC Class Codes: G06K 19/07372 by detecting tampering with the circuit
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 7/0008 General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2518 : being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2224/29099 : Material
• CPC Class Codes: H01L 2224/29101 : the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/29199 : Material of the matrix
• CPC Class Codes: H01L 2224/2929 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29293 : with a principal constituent of the material being a solid not provided for in groups H01L2224/292 - H01L2224/29291, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/29298 : Fillers
• CPC Class Codes: H01L 2224/29299 : Base material
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/7565 : Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/8319 : Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 : Bonding techniques
• CPC Class Codes: H01L 23/3171 : the coating being directly applied to the semiconductor body, e.g. passivation layer H01L23/3178 takes precedence
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/576 : using active circuits
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H01Q 1/2208 : associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00

Abstract

This Application is intended to provide a method for effectively protecting paper or film-form media against forgery. This can be achieved by, for example, embedding in a paper or film-form medium a thin semiconductor chip up to 0.5 mm square, equipped with an antenna, and characterized in that the side walls of the semiconductor chip are formed using oxide films, and in that multiple such semiconductor chips are separated by etching. Limiting the size of these semiconductor chips to 0.5 mm or less enables improvement against bending and concentrated loads, and separating the semiconductor chips by etching results in semiconductor chips free from cracking and breakage. Also, the oxide films constituting the side walls of the semiconductor chips prevents short-circuiting at edges during connection to the respective antennas. Thus, simplified processes can be adopted.

Claims

1. A non-contact identification semiconductor device comprising:

a bendable paper or bendable film-form medium;

a semiconductor chip inserted into said bendable paper or bendable film-form medium, said semiconductor chip including means for receiving an inquiry to the non-contact identification semiconductor device, a memory for storing identification information of multiple bits and means for sending and said identification information of multiple bits;

an antenna coupled to said semiconductor chip to receive said identification information of multiple bits from said semiconductor chip and to transmit said identification information outside of said non-contact identification semiconductor device; and

means for reducing stress concentration on said semiconductor chip during bending of said bendable paper or bendable film-form medium, wherein said means for reducing stress concentration comprises forming said semiconductor chip to have a long side length not greater than 0.5 mm in plane dimension.

2. The non-contact identification semiconductor device according to claim 1, wherein the thickness of said bendable paper or bendable film-form device is up to 100 micrometers, and said bendable paper or bendable film-form device can be used in a bent state.