Apparatus for conditioning power and managing thermal energy in an electronic device

• US 7,061,104 B2
• Filed: 06/30/2004
• Issued: 06/13/2006
• Est. Priority Date: 02/07/2002
• Status: Expired due to Term

• Current Assignee: Vertiv Corporation (Vertiv Holdings Co.)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Santiago, Juan G., Goodson, Kenneth E., Kenny, Thomas William Jr., Everett, George Carl Jr.
• Primary Examiner(s): NGUYEN, MATTHEW VAN
• Application Number:
  US10/882,475
• Publication Number:
  US 20040252535A1
• Time in Patent Office: 713 Days
• Field of Search: 363/141, 363/147, 257/621, 257/713, 257/714, 361/676, 361/677, 361/688, 361/689, 361/699, 361/715, 361/718
• US Class Current: 257/714
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

Claims

1. A thermal management module configureable to be coupled to an integrated circuit device, the thermal management module comprising:

a. a substrate having at least a portion of a microchannel therein and configured to permit flow of a liquid therethrough, wherein the liquid provides thermal capture of heat generated by the integrated circuit device; and

b. a first plurality of interface vias within the substrate for providing electrical connection with the integrated circuit device.

2. The thermal management module according to claim 1 further comprising a power conditioning module for conditioning power applied to the integrated circuit device, wherein the power conditioning module includes a second plurality of interface vias within the substrate and configured to be in electrical communication with the first plurality of interface vias.

3. The thermal management module according to claim 2 wherein the power conditioning module further comprising a circuit for conditioning the power applied to the integrated circuit device, wherein the circuit includes at least one voltage regulator and at least one capacitor configured within the substrate.

4. The thermal management module according to claim 3 wherein the substrate further comprises a semiconductor substrate.

5. The thermal management module according to claim 4 wherein the substrate further comprises a first interface and a second interface, wherein the first interface and the second interface are positioned in a predetermined configuration with one another.

6. The thermal management module according to claim 5 further comprising a first set of pads configured on the first interface, wherein at least one pad in the first set is coupled to a corresponding one of the plurality of interface vias.

7. The thermal management module according to claim 6 further comprising a second set of pads configured on the second interface, wherein at least one pad in the second set is coupled to a corresponding one of the plurality of interface vias.

8. The thermal management module according to claim 7 further comprising

a. at least one power pad configured on an appropriate second interface;

and

b. at least one power via for providing electrical connection between the appropriate interface and the at least one voltage regulator and capacitor, wherein the power via is coupled to the at least one power pad.

9. The thermal management module according to claim 8 further comprising a power conduit for providing electrical connection between the at least one power via and the at least one voltage regulator and capacitor, the power conduit configured in the substrate and coupled to the at least one power via.

10. The thermal management module according to claim 2 further comprising at least one output power conduit for providing conditioned power to the integrated circuit device, the output power conduit configured in an appropriate interface of the substrate.

11. The thermal management module according to claim 10 wherein the at least one output power conduit is coupled to an input power pad, wherein the input power pad corresponds to an input of the integrated circuit device.

12. The thermal management module according to claim 1 further including a sensor for providing information representative of operating conditions in the integrated circuit device.

13. The thermal management module according to claim 12 wherein the sensor provides temperature information in a predetermined temperature region.

14. The thermal management module according to claim 12 further comprising a controller for controlling an operating level of the thermal management module in response to the information received from the sensor, wherein the controller is coupled to the thermal management module and the sensor.

15. An apparatus configureable to be coupled to an integrated circuit device comprising:

a. means for conditioning power applied to the integrated circuit device, the means for conditioning configured to provide electrical connection between the integrated circuit device and a circuit board; and

b. means for cooling the interface circuit device, the means for cooling coupled to the means for conditioning and configured to provide electrical connection between the integrated circuit device and the circuit board.

16. A thermal management system comprising:

a. at least one thermal management element coupled to one or more integrated circuit devices for capturing thermal energy generated by the one or more integrated circuit devices using a fluid channeled therethrough; and

b. at least one pump coupled to the at least one thermal management elements for circulating the fluid thereto;

c. at least one heat rejection element coupled to the at least one pump, wherein the at least one heat rejection element cools fluid heated by the at least one thermal management module; and

d. a device coupled to the at least one thermal management element, wherein the device is one of a group consisting of an additional thermal management element, an additional pump and an additional heat rejection element.

17. The thermal management system according to claim 16 wherein the thermal management element further comprises a substrate configured to permit flow therethrough and having a plurality of fluidic paths for channeling fluid.

18. The thermal management system according to claim 16 wherein the thermal management element further comprises at least one control module having:

a. a substrate;

b. a plurality of interface vias to provide electrical connection through the substrate; and

c. electrical circuitry disposed in the substrate and configured to condition power applied to the integrated circuit device.

19. The thermal management system according to claim 16 wherein two pumps provide fluid to the at least one thermal management element.

20. The thermal management system according to claim 16 further comprising at least one sensor coupled thereto, the at least one sensor for providing information representative of one or more operating conditions in the integrated circuit device.

21. The thermal management system according to claim 20 wherein the sensor provides temperature information regarding a predetermined temperature region.