Probe card assembly

• US 7,061,257 B2
• Filed: 07/12/2004
• Issued: 06/13/2006
• Est. Priority Date: 11/16/1993
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Eldridge, Benjamin N., Khandros, Igor Y., Sporck, A. Nicholas
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US10/889,334
• Publication Number:
  US 20050035347A1
• Time in Patent Office: 701 Days
• Field of Search: 324754-755, 324761-762, 324/765, 439/485, 257723-724, 297/05, 174/251, 174/254, 174/256, 174/260, 174/267, 361/764, 361/813
• US Class Current: 324/750.16
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07364 with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/45014 : Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0397 : Tab
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Claims

1. A probe assembly comprising:

a wiring board comprising a plurality of contact terminals;

a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrically connected to ones of said second substrate terminals;

a rigid plate, said semiconductor substrate disposed on said rigid plate; and

a plurality of electrical connectors connecting ones of said contact terminals to ones of said first substrate terminals.

2. The probe assembly of claim 1 further comprising a plurality of probes mounted to said second substrate terminals.

3. The probe assembly of claim 2, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate.

4. The probe assembly of claim 3, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate.

5. The probe assembly of claim 4, wherein said second side of said semiconductor substrate is disposed on said rigid plate.

6. The probe assembly of claim 5, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals.

7. The probe assembly of claim 2, wherein said probes are elongate and resilient.

8. The probe assembly of claim 2 further comprising means for applying a biasing force to said rigid plate, wherein said biasing force biases said semiconductor substrate away from said wiring board.

9. The probe assembly of claim 8 further comprising planarization means for selectively adjusting a planar orientation of contact ends of said probes with respect to said wiring board, said planarization means further holding said semiconductor substrate in said selected planar orientation.

10. The probe assembly of claim 2, wherein said probes are configured to contact an electronic device to be tested, and said semiconductor substrate has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of said electronic device.

11. The probe assembly of claim 2, wherein said probes are configured to contact terminals of an electronic circuit integrated into a semiconductor material having a composition substantially similar to said semiconductor substrate.

12. The probe assembly of claim 1, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate.

13. The probe assembly of claim 1, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate.

14. The probe assembly of claim 1, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals.

15. The probe assembly of claim 1, wherein said semiconductor substrate comprises silicon.

16. The probe assembly of claim 1 further comprising at least one active electronic circuit integrated into said semiconductor substrate.

17. A probe assembly comprising:

a wiring board comprising a plurality of contact terminals;

a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrically connected to ones of said second substrate terminals, said semiconductor substrate secured without adhesive to said wiring board; and

a plurality of electrical connectors connecting ones of said contact terminals to ones of said first substrate terminals.

18. The probe assembly of claim 17 further comprising a plurality of probes mounted to said second substrate terminals.

19. The probe assembly of claim 18, wherein said semiconductor substrate is secured to a rigid plate, which is secured to said wiring board, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate.

20. The probe assembly of claim 19, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate.

21. The probe assembly of claim 20, wherein said second side of said semiconductor substrate is disposed on said rigid plate.

22. The probe assembly of claim 21, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals.

23. The probe assembly of claim 19 further comprising means for applying a biasing force to said rigid plate, wherein said biasing force biases said semiconductor substrate away from said wiring board.

24. The probe assembly of claim 23 further comprising planarization means for selectively adjusting a planar orientation of contact ends of said probes with respect to said wiring board, said planarization means further holding said semiconductor substrate in said selected planar orientation.

25. The probe assembly of claim 18, wherein said probes are elongate and resilient.

26. The probe assembly of claim 18, wherein said probes are configured to contact an electronic device to be tested, and said semiconductor substrate has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of said electronic device.

27. The probe assembly of claim 18, wherein said probes are configured to contact terminals of an electronic circuit integrated into a semiconductor material having a composition substantially similar to said semiconductor substrate.

28. The probe assembly of claim 17, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate.

29. The probe assembly of claim 17, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals.

30. The probe assembly of claim 17, wherein said semiconductor substrate comprises silicon.

31. The probe assembly of claim 17 further comprising at least one active electronic circuit integrated into said semiconductor substrate.

32. A probe assembly comprising:

a wiring board comprising a plurality of contact terminals;

a semiconductor substrate comprising a plurality of first substrate terminals and a plurality of second substrate terminals, wherein ones of said first substrate terminals are electrically connected to ones of said second substrate terminals, there being a space that is at least partially unfilled by solid material between said semiconductor substrate and said wiring board; and

a plurality of electrical connectors connecting ones of said contact terminals to ones of said first substrate terminals.

33. The probe assembly of claim 32 further comprising a plurality of probes mounted to said second substrate terminals.

34. The probe assembly of claim 33, wherein said semiconductor substrate is secured to a rigid plate, which is secured to said wiring board, wherein said rigid plate is disposed between said wiring board and said semiconductor substrate.

35. The probe assembly of claim 34, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate.

36. The probe assembly of claim 35, wherein said second side of said semiconductor substrate is disposed on said rigid plate.

37. The probe assembly of claim 36, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals.

38. The probe assembly of claim 34 further comprising means for applying a biasing force to said rigid plate, wherein said biasing force biases said semiconductor substrate away from said wiring board.

39. The probe assembly of claim 38 further comprising planarization means for selectively adjusting a planar orientation of contact ends of said probes with respect to said wiring board, said planarization means further holding said semiconductor substrate in said selected planar orientation.

40. The probe assembly of claim 33, wherein said probes are elongate and resilient.

41. The probe assembly of claim 33, wherein said probes are configured to contact an electronic device to be tested, and said semiconductor substrate has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of said electronic device.

42. The probe assembly of claim 33, wherein said probes are configured to contact terminals of an electronic circuit integrated into a semiconductor material having a composition substantially similar to said semiconductor substrate.

43. The probe assembly of claim 32, wherein said semiconductor substrate comprises a first side and a second side, opposite said first side, and wherein said first substrate terminals and said second substrate terminals are disposed on said first side of said semiconductor substrate.

44. The probe assembly of claim 32, wherein said plurality of electrical connectors comprise flexible connectors directly connecting said ones of said contact terminals with said ones of said first substrate terminals.

45. The probe assembly of claim 32, wherein said semiconductor substrate comprises silicon.

46. The probe assembly of claim 32 further comprising at least one active electronic circuit integrated into said semiconductor substrate.