Electronic device

• US 7,061,765 B2
• Filed: 03/24/2003
• Issued: 06/13/2006
• Est. Priority Date: 03/25/2002
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Petricek, Martin, Rothmayer, Thomas
• Primary Examiner(s): Chérvinsky, Boris
• Application Number:
  US10/508,634
• Publication Number:
  US 20050128712A1
• Time in Patent Office: 1,177 Days
• Field of Search: 361687-690, 361695-699, 361/704, 361718-721, 257/718, 257/719, 174/16.1, 174/16.3, 174/252, 165/80.3, 165/104.33, 165/185
• US Class Current: 361/719
• CPC Class Codes: H05K 7/20472 Sheet interfaces

Abstract

An electronic device (GER) with a housing (GEH), in which at least one circuit substrate (STT) is provided with an assembly side (BES), whereby at least one electronic component (BAU) is arranged on the assembly side, whereby an essentially plate-like cooling element (KUE) made of metal is arranged on the inside of a side wall (SEI) of the housing (GEH) opposite the assembly side (BES) and running essentially parallel to the circuit substrate (STT), said cooling element being connected thermally in the assembled state to the at least one component (BAU) arranged on the assembly side (BES).

Claims

1. An electronic device, comprising:

a housing comprising a side wall with an inside surface;

at least one circuit board provided in the housing; and

at least one electronic component arranged on the circuit board, wherein

an essentially plate-like cooling element made of metal separately from the side wall is arranged on the inside surface of the side wall of the housing, opposite a side of the circuit board, on which the at least one component is arranged, running essentially parallel to the circuit board, said cooling element being in contact with the side wall in the assembled state and being connected thermally to the at least one component arranged on an assembly side, wherein

when the device is in the assembled state, the side wall is attached by attachment devices to the circuit board, and wherein

the cooling element is pressed against the back of the component to be cooled.

2. The electronic device according to claim 1, wherein a heat-conducting film is arranged between the at least one component and the cooling element.

3. The electronic device according to claim 1, wherein the cooling element is attached to the side wall.

4. The electronic device according to claim 3, wherein the attachment of the cooling element to the side wall is performed by riveting.

5. The electronic device according to claim 2, wherein the cooling element is attached to the side wall.

6. The electronic device according to claim 1, wherein the cooling element is made of copper, a copper alloy, an aluminum or an aluminum alloy.

7. The electronic device according to claim 2, wherein the cooling element is made of copper, a copper alloy, an aluminum or an aluminum alloy.

8. The electronic device according to claim 3, wherein the cooling element is made of copper, a copper alloy, an aluminum or an aluminum alloy.

9. The electronic device according to claim 4, wherein the cooling element is made of copper, a copper alloy, an aluminum or an aluminum alloy.

10. The electronic device according to claim 5, wherein the cooling element is made of copper, a copper alloy, an aluminum or an aluminum alloy.