Scrubber with sonic nozzle

• US 7,063,749 B2
• Filed: 06/09/2005
• Issued: 06/20/2006
• Est. Priority Date: 10/03/2001
• Status: Expired due to Fees

• Current Assignee: Applied Materials (Holdings) (Applied Materials Incorporated)
• Original Assignee: Applied Materials (Holdings) (Applied Materials Incorporated)
• Inventors: Sugarman, Michael
• Primary Examiner(s): Markoff, Alexander
• Application Number:
  US11/148,915
• Publication Number:
  US 20050268937A1
• Time in Patent Office: 376 Days
• Field of Search: 134/6, 134/902, 134/30, 134/33, 134/34, 134/36, 134/1, 134/1.3, 15/77, 151/02, 15/882, 15/883
• US Class Current: 134/6
• CPC Class Codes: B08B 1/32 using rotary cleaning members
• CPC Class Codes: B08B 2203/0288 Ultra or megasonic jets
• CPC Class Codes: B08B 3/02 Cleaning by the force of jets or sprays
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

An apparatus for cleaning a substrate is provided. The apparatus comprises a plurality of rollers adapted to support a substrate in a vertical orientation, a scrubber brush adapted to contact a substrate supported by the plurality of rollers, and a sonic nozzle positioned at an elevation below the elevation of the scrubber brush and adapted so as to output a sonicated fluid spray that contacts a beveled edge or a major surface of the substrate such that fluid having sufficient sonic energy to harm the scrubber brush will not contact the scrubber brush.

Claims

1. A method of cleaning a substrate, comprising:

supporting a substrate in a vertical orientation using a plurality of rollers;

contacting the substrate supported by the plurality of rollers with a scrubber brush; and

from a sonic nozzle positioned at an elevation below the elevation of the scrubber brush, outputting a sonicated fluid spray that contacts a beveled edge of the vertically oriented substrate located below the sonic nozzle such that fluid having sufficient sonic energy to harm the scrubber brush does not contact the scrubber brush;

wherein the sonic nozzle is angled so as to direct the sonicated fluid spray towards the vertically oriented substrate, away from the scrubber brush, and at an angle that does not direct sonicated fluid upwardly.

2. The method of claim 1 further comprising directing the sonicated fluid off of the substrate.

3. The method of claim 1 further comprising contacting the substrate supported by the plurality of rollers along at least a portion of a diameter of the substrate with the scrubber brush.

4. The method of claim 1 further comprising contacting the beveled edge of the substrate with the sonicated fluid spray at a position between the plurality of rollers.

5. A method of cleaning a substrate, comprising:

supporting a substrate in a vertical orientation using a plurality of rollers;

contacting the substrate supported by the plurality of rollers with a scrubber brush; and

from a sonic nozzle positioned at an elevation below the elevation of the scrubber brush, outputting a sonicated fluid spray that contacts a major surface of the vertically oriented substrate supported by the plurality of rollers at a position below the scrubber brush such that fluid having sufficient sonic energy to harm the scrubber brush does not contact the scrubber brush;

wherein the sonic nozzle is angled so as to direct the sonicated fluid spray towards the vertically oriented substrate, away from the scrubber brush, and at an angle that does not direct sonicated fluid upwardly.

6. The method of claim 5 further comprising directing the sonicated fluid off of the substrate.

7. The method of claim 5 further comprising contacting the substrate supported by the plurality of rollers along at least a portion of a diameter of the substrate with the scrubber brush.

8. A method of cleaning a substrate, comprising:

supporting a substrate in a vertical orientation using a plurality of rollers;

contacting the substrate supported by the plurality of rollers with a scrubber brush; and

from a sonic nozzle positioned at an elevation below the elevation of the scrubber brush, outputting a sonicated fluid spray that contacts a major surface of or a beveled edge of the vertically oriented substrate supported by the plurality of rollers;

wherein the sonic nozzle is angled downwardly and away from the scrubber brush so as to direct the sonicated fluid spray towards the vertically oriented substrate, away from the scrubber brush, and at an angle that does not direct sonicated fluid upwardly.

9. The method of claim 8 further comprising directing the sonicated fluid off of the substrate.

10. The method of claim 8 further comprising contacting the substrate supported by the plurality of rollers along at least a portion of a diameter of the substrate with the scrubber brush.

11. The method of claim 8 further comprising contacting the beveled edge of the substrate with the sonicated fluid spray at a position between the plurality of rollers.