Method of fabricating devices incorporating microelectromechanical systems using at least one UV curable tape

• US 7,063,993 B1
• Filed: 05/24/2000
• Issued: 06/20/2006
• Est. Priority Date: 05/24/2000
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): GOODWIN, DAVID J
• Application Number:
  US10/296,660
• Time in Patent Office: 2,218 Days
• Field of Search: None
• US Class Current: 438/21
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation

Abstract

A method of fabricating devices incorporating microelectromechanical systems (MEMS) using a UV curable tape includes providing a substrate (14) with a MEMS layer (18) arranged on one side (12) of the substrate (14). A further layer (10) is applied to the side (12) of the substrate (14). At least one operation is performed on the substrate (14) from a side (22) of the substrate (14) opposed to the side (12) having the MEMS layer (18). A holding tape (38) is applied to the side (22) of the substrate. At least one operation is then performed on the further layer (10) to define individual chips (20). Each chip (20) is composed of a part of the substrate (24), at least one part of the MEMS layer (18) and a part of the further layer (10). Individual chips (20) are then able to be released from the tape (38) by exposing the tape (38) to UV light.

Claims

1. A method of fabricating MEMS devices, the method including the steps of:

—

providing a substrate and a MEMS layer, the MEMS layer arranged on one side of the substrate;

applying a further layer arranged to protect the MEMS layer to said one side of the substrate;

separating the substrate into discrete parts by performing at least one operation including a back etching operation from a side of the substrate opposed to the side having the MEMS layer, each discrete part carrying at least one MEMS part of the MEMS layer;

subsequent to the step of separating the substrate into discrete parts, applying a holding means to said opposed side of the substrate;

defining individual chips by performing at least one operation, including an etching operation on the further layer, each of said chips being composed of one of said discrete parts of the substrate, at least one part of the MEMS layer and a part of the further layer; and

causing the individual chips to be released from the holding means for removal from the holding means.

2. The method of claim 1, wherein the step of defining individual chips is performed after the step of applying a holding means to the substrate.

3. The method of claim 1, further including the step of bonding the holding means to the substrate.

4. The method of claim 3, wherein the holding means is bonded to the substrate by means of an adhesive which is curable by exposure to ultraviolet (UV) light and in which the method further includes the step of exposing localized regions of the holding means to UV light to release one chip at a time from the holding means to enable each chip to be removed individually from the holding means.

5. The method of claim 4, further including the step of applying a handling means to the holding means, the handling means being transparent to UV light so that UV light is transmitted through the handling means to cure the adhesive of the holding means.

6. The method of claim 5, further including the step of removing each chip from the holding means by a transporting means.

7. The method of claim 6, wherein the step of removing each chip from the holding means includes reciprocating each chip individually over a source of UV light.