Light emitting diodes with improved light extraction efficiency

• US 7,064,355 B2
• Filed: 06/12/2001
• Issued: 06/20/2006
• Est. Priority Date: 09/12/2000
• Status: Expired due to Term

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds Lighting US LLC (Apollo Global Management, Inc.)
• Inventors: Krames, Michael R., Mueller-Mach, Regina B., Mueller, Gerd O., Steranka, Frank M., Camras, Michael D., Taber, Robert C., Trottier, Troy A., Hofler, Gloria E., Uebbing, John J., Lowery, Christopher H., Snyder, Wayne L., Pocius, Douglas W.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): FORDE, REMMON R
• Application Number:
  US09/880,204
• Publication Number:
  US 20020030194A1
• Time in Patent Office: 1,834 Days
• Field of Search: 257/98, 257 94- 97, 257/99, 257/81, 257/680, 257/618, 369/112
• US Class Current: 257/98
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent optical element having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent optical element (e.g., a lens or an optical concentrator) to a light emitting device comprising an active region includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the light emitting device together. A block of optical element material may be bonded to the light emitting device and then shaped into an optical element. Bonding a high refractive index optical element to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.

Claims

1. A light emitting device having a stack of layers including semiconductor layers comprising an active region, said device comprising:

a transparent optical element bonded to said stack by a bond at an interface disposed between said optical element and said stack, wherein said optical element is bonded to a surface of said stack, wherein a smallest ratio of a length of a base of said optical element to a length of said surface is greater than one.

2. The light emitting device of claim 1, wherein said optical element comprises an optical concentrator.

3. The light emitting device of claim 2, wherein said optical concentrator comprises a parabolic wall.

4. The light emitting device of claim 2, wherein said optical concentrator comprises a cone-shaped wall.

5. The light emitting device of claim 2, wherein said optical concentrator comprises a beveled side wall.

6. The light emitting device of claim 2, wherein said optical concentrator comprises a side wall coated with metallization.

7. The light emitting device of claim 2, wherein said optical concentrator comprises a side wall coated with a dielectric material.

8. The light emitting device of claim 1, wherein said optical element comprises a total internal reflector.

9. The light emitting device of claim 1, wherein said optical element is formed from a material selected from the group of optical glass, III-V semiconductors, II-VI semiconductors, group IV semiconductors and compounds, metal oxides, metal fluorides, diamond, yttrium aluminum garnet, and combinations thereof.

10. The light emitting device of claim 1, wherein said optical element is formed from a material selected from the group consisting of zirconium oxide, sapphire, GaP, ZnS, materials containing lead oxide, and SiC.

11. The light emitting device of claim 1, wherein said optical element includes one or more luminescent materials that convert light of a wavelength emitted by said active region to at least another wavelength.

12. The light emitting device of claim 1, wherein said optical element is coated with one or more luminescent materials that convert light of a wavelength emitted by said active region to at least another wavelength.

13. The light emitting device of claim 1, wherein said ratio is greater than about two.

14. The light emitting device of claim 1, wherein said stack is located in a recess of a surface of said optical element.

15. The light emitting device of claim 1, wherein a refractive index of said optical element for light emitted by said active region is greater than about 1.5.

16. The light emitting device of claim 15, wherein said refractive index is greater than about 1.8.

17. The light emitting device of claim 1, wherein a refractive index of said optical element is greater than or equal to a refractive index of said semiconductor layers for light emitted by said active region.

18. The light emitting device of claim 1, further comprising contacts electrically coupled to said semiconductor layers to apply a voltage across said active region.

19. The light emitting device of claim 18, wherein at least one of said contacts is highly reflective for light emitted by said active region and is located to reflect said light toward said optical element.

20. The light emitting device of claim 1, further comprising at least one beveled side located to reflect light emitted from said active region toward said optical element.

21. The light emitting device of claim 1, further comprising at least one layer highly reflective for light emitted by said active region located to reflect said light toward said optical element.

22. The light emitting device of claim 1, wherein said transparent optical element is directly bonded to at least one of said semiconductor layers.

23. The light emitting device of claim 1, wherein said stack comprises a transparent superstrate layer disposed above said semiconductor layers and directly bonded to said optical element.

24. The light emitting device of claim 23, wherein said superstrate layer has a refractive index for light emitted by said active region greater than about 1.8.

25. The light emitting device of claim 23, wherein said superstrate layer is formed from a material selected from the group of sapphire, SiC, GaN, and GaP.

26. The light emitting device of claim 23, wherein said optical element comprises one of ZnS, zirconium oxide, SiC, materials containing lead oxide, and sapphire, said superstrate comprises one of SiC, GaN, and sapphire, and said semiconductor layers comprise a III-Nitride semiconductor.

27. The light emitting device of claim 26, further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

said first contact and said second contact disposed on a same side of said stack.

28. The light emitting device of claim 23, wherein said optical element is formed from one of zirconium oxide, sapphire, material containing lead oxide, SiC, ZnS, and GaP, said superstrate is formed from a III-Phosphide material, and said semiconductor layers comprise one of III-Phosphide semiconductors and III-Arsenide semiconductors.

29. The light emitting device of claim 26, further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

said first contact and said second contact disposed on a same side of said stack.

30. The light emitting device of claim 1, further comprising a transparent bonding layer disposed between said optical element and a surface of said stack, said transparent bonding layer bonding said optical element to said stack.

32. The light emitting device of claim 30, wherein said transparent bonding layer includes one or more luminescent materials that convert light of a wavelength emitted by said active region to at least another wavelength.

33. The light emitting device of claim 30, wherein said bonding layer has an index of refraction greater than about 1.5 for light emitted by said active region.

34. The light emitting device of claim 33, wherein said index of refraction is greater than about 1.8.

35. The light emitting device of claim 30, wherein said bonding layer has a thickness less than about 500 Angstroms.

36. The light emitting device of claim 30, wherein said surface includes a surface of one of said semiconductor layers.

37. The light emitting device of claim 30, wherein said surface includes a surface of a transparent superstrate layer disposed above said semiconductor layers.

38. The light emitting device of claim 37, wherein said superstrate layer has a refractive index for light emitted by said active region greater than about 1.8.

39. The light emitting device of claim 37, wherein said superstrate layer is formed from a material selected from the group consisting of sapphire, SiC, GaN, and GaP.

40. The light emitting device of claim 37, wherein said optical element comprises one of ZnS, zirconium oxide, material containing lead oxide, SiC, and sapphire, and superstrate comprises one of SiC, GaN, and sapphire, and said semiconductor layers comprise a III-Nitride semiconductor.

41. The light emitting device of claim 40, further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

said first contact and said second contact disposed on a same side of said stack.

42. The light emitting device of claim 37, wherein said optical element is formed from one of zirconium oxide, sapphire, materials containing lead oxide, SiC, ZnS, and GaP, said superstrate is formed from a III-Phosphide material, and said semiconductor layers comprise one of III-Phosphide semiconductors and III-Arsenide semiconductors.

43. The light emitting device of claim 42, further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

said first contact and said second contact disposed on a same side of said stack.

44. The light emitting device of claim 30, wherein said transparent bonding layer includes a lead oxide.

45. The light emitting device of claim 30, wherein said transparent bonding layer includes a tungsten oxide.

31. A light emitting device having a stack of layers including semiconductor layers comprising an active region, said device comprising:

a transparent optical element bonded to said stack by a bond at an interface disposed between said optical element and said stack; and

a transparent bonding layer comprising a material different from a material forming the optical element, the transparent bonding layer being disposed between said optical element and a surface of said stack and bonding said optical element to said stack.

46. The light emitting device of claim 31, wherein said transparent bonding layer includes one or more luminescent material that convert light of a wavelength emitted by said active region to at least another wavelength.

47. The light emitting device of claim 31, wherein said bonding layer has an index of refraction greater than about 1.5 for light emitted by said active region.

48. The light emitting device of claim 47, wherein said index of refraction is greater than about 1.8.

49. The light emitting device of claim 31, wherein said bonding layer has a thickness less than about 500 Angstroms.

50. The light emitting device of claim 31, wherein said surface includes a surface of one of said semiconductor layers.

51. The light emitting device of claim 31, wherein said surface includes a surface of a transparent superstrate layer disposed above said semiconductor layers.

52. The light emitting device of claim 51, wherein said superstrate layer has a refractive index for light emitted by said active region greater than about 1.8.

53. The light emitting device of claim 51, wherein said superstrate layer is formed from a material selected from the group of sapphire, SiC, GaN, and GaP.

54. The light emitting device of claim 51, wherein said optical element comprises one of ZnS, zirconium oxide, materials containing lead oxide, SiC, and sapphire, said superstrate comprises one of SiC, GaN, and sapphire, and said semiconductor layers comprise a III-Nitride semiconductor.

55. The light emitting device of claim 54, further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

said first contact and said second contact disposed on a same side of said stack.

56. The light emitting device of claim 51, wherein said optical element is formed from one of zirconium oxide, sapphire, materials containing lead oxide, SiC, ZnS, and GaP, said superstrate is formed from a III-Phosphide material, and said semiconductor layers comprise one of III-Phosphide semiconductors and III-Arsenide semiconductor.

57. The light emitting device of claim 56, further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

said first contact and said second contact disposed on a same side of said stack.

58. The light emitting device of claim 31 wherein said transparent bonding layer is formed from a material selected from the group of optical glass, chalcogenide glass, III-V semiconductors, II-VI semiconductors, group IV semiconductors, metals, metal oxides, metal fluorides, yttrium aluminum garnet, phosphides, arsenides, antimonides, nitrides, and combinations thereof.

59. The light emitting device of claim 31 wherein said transparent bonding layer comprises an oxide of lead.

60. The light emitting device of claim 31 wherein said transparent bonding layer comprises an oxide of tungsten.

61. A light emitting device having a stack of layers including semiconductor layers comprising an active region, said device comprising:

an optical element bonded to said stack, the optical element comprising one of sapphire and SiC; and

a first contact and a second contact electrically coupled to apply a voltage across said active region;

wherein said stack of layers comprises at least one III-Nitride semiconductor layer and said first contact and said second contact are disposed on a same side of said stack.

62. A light emitting device having a stack of layers including semiconductor layers comprising an active region, said device comprising:

an optical element bonded to said stack;

wherein said optical element comprises one of sapphire and SiC.

63. The device of claim 62 further comprising a first contact and a second contact electrically coupled to apply a voltage across said active region;

wherein said stack of layers comprises at least one a III-Nitride semiconductor layer and said first contact and said second contact are disposed on a same side of said stack.

64. The device of claim 62 wherein the stack comprises a transparent superstrate, and optical element is bonded to a surface of the transparent substrate.