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Flip chip light emitting diode with micromesas and a conductive mesh

  • US 7,064,356 B2
  • Filed: 04/16/2004
  • Issued: 06/20/2006
  • Est. Priority Date: 04/16/2004
  • Status: Expired due to Fees
First Claim
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1. A flip chip light emitting diode including:

  • a light-transmissive substrate;

    a base semiconducting layer of a first conductivity type disposed on the light-transmissive substrate;

    a conductive mesh disposed on the base semiconducting layer and in electrically conductive contact therewith;

    light-emitting micromesas disposed in openings of the conductive mesh, each light emitting micromesa having a topmost layer of a second conductivity type that is opposite the first conductivity type;

    a first conductivity type electrode disposed on the base semiconducting layer and in electrical communication with the electrically conductive mesh;

    an insulating layer disposed over the electrically conductive mesh; and

    a second conductivity type electrode layer disposed over the insulating layer and the light-emitting micromesas, the insulating layer insulating the second conductivity type electrode layer from the electrically conductive mesh.

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