×

Integrated circuit package device

  • US 7,064,442 B1
  • Filed: 07/02/2003
  • Issued: 06/20/2006
  • Est. Priority Date: 07/02/2003
  • Status: Active Grant
First Claim
Patent Images

1. A package device having a patterned lead frame with at least two isolated patterned dies mounted thereon, the package device additionally having a planar transformer component, the planar transformer component comprising at least two planar transformers, each being individually mounted to the lead frame between the at least two patterned dies, the transformers adapted to provide for the selective coupling of energy between the two dies.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×