Method of fabricating an ink jet printhead chip with active and passive nozzle chamber structures

• US 7,067,067 B2
• Filed: 10/28/2003
• Issued: 06/27/2006
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Norton, Nadine G.
• Assistant Examiner(s): CHEN, ERIC BRICE
• Application Number:
  US10/693,977
• Publication Number:
  US 20040069743A1
• Time in Patent Office: 973 Days
• Field of Search: None
• US Class Current: 216/27
• CPC Class Codes: B41J 15/044 Cassettes or cartridges containing continuous copy material, tape, for setting into printing devices
• CPC Class Codes: B41J 2/04 generating single droplets or particles on demand
• CPC Class Codes: B41J 2/135 Nozzles
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16585 : for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/17503 : Ink cartridges
• CPC Class Codes: B41J 2/17513 : Inner structure
• CPC Class Codes: B41J 2/17596 : Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 : Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 : Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 : Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2002/14443 : Nozzle guard
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: B41J 2202/11 : characterised by specific geometrical characteristics
• CPC Class Codes: B41J 2202/13 : Heads having an integrated circuit
• CPC Class Codes: B41J 2202/21 : Line printing
• CPC Class Codes: B41J 29/02 : Framework
• CPC Class Codes: B42D 2035/08 : Alphanumerical data
• CPC Class Codes: B42D 2035/34 : Markings visible under particular conditions or containing coded information
• CPC Class Codes: B42D 2035/50 : Corresponding markings appearing in different shapes or at different places
• CPC Class Codes: B42D 25/00 : Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof printing processes to produce identification or security features B41M3/14
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: G03B 17/02 : Bodies
• CPC Class Codes: G03B 27/02 : Exposure apparatus for contact printing
• CPC Class Codes: G06F 1/1626 : with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 12/0866 : for peripheral storage systems, e.g. disk cache
• CPC Class Codes: G06F 21/79 : in semiconductor storage media, e.g. directly-addressable memories
• CPC Class Codes: G06F 21/86 : Secure or tamper-resistant housings
• CPC Class Codes: G06F 2212/2022 : Flash memory
• CPC Class Codes: G06F 2221/2129 : Authenticate client device independently of the user
• CPC Class Codes: G06K 1/121 : by printing code marks applying code marks to labels B65C9/46; marking or coding completed packages B65B61/26
• CPC Class Codes: G06K 19/06037 : multi-dimensional coding
• CPC Class Codes: G06K 19/073 : Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 7/10722 : Photodetector array or CCD scanning
• CPC Class Codes: G06K 7/14 : using light without selection of wavelength, e.g. sensing reflected white light G06K7/10831 - G06K7/1097 take precedence
• CPC Class Codes: G06K 7/1417 : 2D bar codes
• CPC Class Codes: G06T 1/20 : Processor architectures; Processor configuration, e.g. pipelining
• CPC Class Codes: G06T 3/02 : Affine transformations for image registration G06T3/147; for image mosaicing G06T3/4038
• CPC Class Codes: G07F 7/08 : by coded identity card or credit card or other personal identification means without personal verification means G07F7/02
• CPC Class Codes: G07F 7/086 : by passive credit-cards adapted therefor, e.g. constructive particularities to avoid counterfeiting, e.g. by inclusion of a physical or chemical security-layer for security documents G07D7/00; for the reading of record-carriers in general G06K7/00; for the design of coded credit-cards G06K19/10
• CPC Class Codes: G07F 7/12 : Card verification
• CPC Class Codes: G09G 2310/0281 : Arrangement of scan or data electrode driver circuits at the periphery of a panel not inherent to a split matrix structure
• CPC Class Codes: G11C 11/56 : using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
• CPC Class Codes: G11C 16/22 : Safety or protection circuits preventing unauthorised or accidental access to memory cells
• CPC Class Codes: H01L 23/576 : using active circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 1/00127 : Connection or combination of a still picture apparatus with another apparatus, e.g. for storage, processing or transmission of still picture signals or of information associated with a still picture
• CPC Class Codes: H04N 1/00278 : with a printing apparatus, e.g. a laser beam printer
• CPC Class Codes: H04N 1/00326 : with a data reading, recognizing or recording apparatus, e.g. with a bar-code apparatus arrangements for the associated working of recording or reproducing apparatus with related apparatus G11B31/00
• CPC Class Codes: H04N 1/00355 : Mark-sheet input sensing record carriers G06K7/00; character recognition G06V30/10; document-oriented image-based pattern recognition G06V30/40
• CPC Class Codes: H04N 1/0044 : for image preview or review, e.g. to help the user position a sheet
• CPC Class Codes: H04N 1/00965 : using a plug-in memory module, e.g. memory card, memory stick
• CPC Class Codes: H04N 1/00968 : by scanning marks on a sheet mark-sheet input means H04N1/00355; sensing record carriers G06K7/00
• CPC Class Codes: H04N 1/2112 : using still video cameras
• CPC Class Codes: H04N 1/2154 : the still video camera incorporating a hardcopy reproducing device, e.g. a printer
• CPC Class Codes: H04N 1/2307 : Circuits or arrangements for the control thereof, e.g. using a programmed control device, according to a measured quantity H04N1/27, H04N1/29 take precedence
• CPC Class Codes: H04N 1/32122 : in a separate device, e.g. in a memory or on a display separate from image data
• CPC Class Codes: H04N 1/32133 : on the same paper sheet, e.g. a facsimile page header
• CPC Class Codes: H04N 2101/00 : Still video cameras
• CPC Class Codes: H04N 2201/0008 : Connection or combination of a still picture apparatus with another apparatus
• CPC Class Codes: H04N 2201/0084 : Digital still camera
• CPC Class Codes: H04N 2201/3222 : of processing required or performed, e.g. forwarding, urgent or confidential handling
• CPC Class Codes: H04N 2201/3242 : of processing required or performed, e.g. for reproduction or before recording H04N2201/3256 and subgroups take precedence
• CPC Class Codes: H04N 2201/3261 : of multimedia information, e.g. a sound signal
• CPC Class Codes: H04N 2201/3264 : of sound signals
• CPC Class Codes: H04N 2201/3269 : of machine readable codes or marks, e.g. bar codes or glyphs
• CPC Class Codes: H04N 2201/3276 : of a customised additional information profile, e.g. a profile specific to a user ID
• CPC Class Codes: H04N 2201/328 : Processing of the additional information
• CPC Class Codes: H04N 23/00 : Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 25/00 : Circuitry of solid-state image sensors [SSIS]; Control thereof
• CPC Class Codes: H04N 5/2628 : Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation
• CPC Class Codes: H05K 1/14 : Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A method of fabricating an inkjet printhead chip for an inkjet printhead includes the step of depositing a first layer of a sacrificial material on a wafer substrate that incorporates drive circuitry. A deposition zone for a passive beam and a passive structure is formed with the first layer of sacrificial material. A metal layer is deposited on the first layer of sacrificial material. The metal layer is etched to define the passive beam and the passive structure. A second layer of a sacrificial material is deposited on the metal layer. A deposition zone for an active beam is formed on the second layer of sacrificial material. A metal layer is deposited on the second layer of sacrificial material. The metal layer is etched to define the active beam. The deposition zone is formed so that the metal layer makes electrical contact with the drive circuitry. A third layer of sacrificial material is deposited on the metal layer. A deposition zone for a dynamic structure is formed on the third layer of sacrificial material. A structural layer is deposited on the third layer of sacrificial material. The structural layer is etched to define the dynamic structure. The sacrificial material is etched away.

Claims

1. A method of fabricating an inkjet printhead chip for an inkjet printhead, the inkjet printhead chip having a wafer substrate that incorporates drive circuitry and defines a plurality of ink inlet channels and nozzle arrangements that each have a passive nozzle chamber structure that extends from the wafer substrate and bounds a respective ink inlet channel, a dynamic nozzle chamber structure that, together with the passive structure, defines a nozzle chamber, and has a roof that defines the ink ejection port, the dynamic structure being displaceable towards the wafer substrate into an actuated position and away from the wafer substrate into a rest position such that a drop of ink can be ejected from the ink ejection port, and an elongate micro-electromechanical actuator connected between the wafer substrate and the dynamic structure, the actuator including a beam assembly that has an active beam of a conductive material, capable of thermal expansion, that defines a heating circuit and is connected to the drive circuitry and a passive beam that is interposed between the active beam and the wafer substrate such that, when the active beam receives an electrical signal from the drive circuitry, the active beam expands relative to the passive beam driving the dynamic structure into the actuated position to generate the drop of ink and when the signal is cut off subsequent cooling of the active beam causes the dynamic structure to move back to the rest position, facilitating a separation of the drop of ink, the method comprising the steps of:

depositing a first layer of a sacrificial material on the wafer substrate;

forming a deposition zone for the passive beam and the passive structure with the first layer of sacrificial material;

depositing a metal layer on the first layer of sacrificial material;

etching the metal layer to define the passive beam and the passive structure;

depositing a second layer of a sacrificial material on the metal layer;

forming a deposition zone for the active beam on the second layer of sacrificial material;

depositing a metal layer on the second layer of sacrificial material;

etching the metal layer to define the active beam, the deposition zone being formed so that the metal layer makes electrical contact with the drive circuitry;

depositing a third layer of sacrificial material on the metal layer;

forming a deposition zone for the dynamic structure on the third layer of sacrificial material;

depositing a structural layer on the third layer of sacrificial material;

etching the structural layer to define the dynamic structure; and

etching away the sacrificial material.

2. A method as claimed in claim 1, in which the steps of depositing the metal layers each comprise the step of depositing titanium nitride.

3. A method as claimed in claim 1, in which the step of forming a deposition zone for the dynamic structure includes the step of forming a deposition zone for an arm that interconnects the dynamic structure and the beam assembly.

4. A method as claimed in claim 3, in which the step of depositing the structural layer includes the step of depositing a layer of a dielectric material that is adhesive to metal, such that the structural layer adheres to the passive and active beams.

5. A method as claimed in claim 1, in which the step of depositing the first layer of sacrificial material includes the step of depositing the first layer of sacrificial material to a depth of between five and twelve microns.

6. A method as claimed in claim 1, which includes the step of applying a release tape to the structural layer to permit retention of the printhead chip in a suitable position and etching the inlet channels through the wafer substrate and into each nozzle chamber, prior to etching away the sacrificial material.