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Package having bond-sealed underbump

  • US 7,067,355 B2
  • Filed: 05/26/2004
  • Issued: 06/27/2006
  • Est. Priority Date: 05/26/2004
  • Status: Active Grant
First Claim
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1. A method for fabricating an electronic device package structure comprising the steps of:

  • establishing an underbump on a first substrate wafer, the underbump composed of a localized bond region and standoff material having a face distal to the first substrate wafer, the localized bond region deposited on the distal face of the standoff material;

    preparing at least one breach cut in the underbump; and

    then adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein;

    wherein the breach cut extends from an exterior surface of the underbump to the chamber.

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