Package having bond-sealed underbump
First Claim
Patent Images
1. A method for fabricating an electronic device package structure comprising the steps of:
- establishing an underbump on a first substrate wafer, the underbump composed of a localized bond region and standoff material having a face distal to the first substrate wafer, the localized bond region deposited on the distal face of the standoff material;
preparing at least one breach cut in the underbump; and
then adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein;
wherein the breach cut extends from an exterior surface of the underbump to the chamber.
2 Assignments
0 Petitions
Accused Products
Abstract
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
-
Citations
13 Claims
-
1. A method for fabricating an electronic device package structure comprising the steps of:
-
establishing an underbump on a first substrate wafer, the underbump composed of a localized bond region and standoff material having a face distal to the first substrate wafer, the localized bond region deposited on the distal face of the standoff material; preparing at least one breach cut in the underbump; and then adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein; wherein the breach cut extends from an exterior surface of the underbump to the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method for fabricating an electronic device package structure comprising the steps of:
-
establishing a standoff material on a first substrate wafer; establishing an adhesion layer over the standoff material, wherein the adhesion layer is selected from tantalum, a tantalum-containing compound, and combinations thereof; then depositing at least one bond material lever over the adhesion layer, thereby forming a stack, wherein the at least one bond material layer includes at least one layer containing tin and at least one layer containing gold; configuring the stack into an underbump by; masking the stack with at least one resist material; sequentially etching the adhesion layer and the at least one bond material layer into an underbump pattern; masking the standoff material after the at least one bond material layer has been etched; and etching the standoff material into the underbump pattern; and adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein.
-
-
12. A method for fabricating an electronic device package structure comprising the steps of:
-
establishing a standoff material on a first substrate wafer; depositing at least one bond material layer over the standoff material, thereby forming a stack; configuring the stack into an underbump by; masking the stack with at least one resist material; etching the at least one bond material layer into an underbump pattern; masking the standoff material after the at least one bond material layer has been etched; and etching the standoff material into the underbump pattern; and adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein.
-
-
13. A method for fabricating an electronic device package structure comprising the steps of:
-
establishing an underbump on a first substrate wafer, the underbump composed of a localized bond region deposited in overlying relationship to a standoff material; adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein; depositing a protective layer on the first substrate wafer, the protective layer positioned on a face of the first substrate wafer opposed to the underbump, the protective layer deposited prior to establishing the underbump; removing the protective layer subsequent to establishing the underbump; and depositing an anti-reflective coating an the face of the first substrate wafer after removing the protective layer.
-
Specification