Method of growing electrical conductors
First Claim
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1. A method of producing a conductive thin film, comprising:
- depositing a metal oxide thin film on a substrate by an atomic layer deposition (ALD) process; and
at least partially reducing the metal oxide thin film by exposing the metal oxide thin film to hydrogen radicals, thereby forming a metal layer, wherein the hydrogen radicals are generated in an atmosphere comprising between about 3 and about 10% flowing hydrogen.
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Abstract
A method for forming a conductive thin film includes depositing a metal oxide thin film on a substrate by an atomic layer deposition (ALD) process. The method further includes at least partially reducing the metal oxide thin film by exposing the metal oxide thin film to a gaseous inorganic reducing agent, thereby forming a metal layer. In preferred arrangements, the reducing agent comprises of thermal hydrogen (H2), hydrogen radicals (H*) and/or carbon monoxide (CO).
175 Citations
34 Claims
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1. A method of producing a conductive thin film, comprising:
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depositing a metal oxide thin film on a substrate by an atomic layer deposition (ALD) process; and at least partially reducing the metal oxide thin film by exposing the metal oxide thin film to hydrogen radicals, thereby forming a metal layer, wherein the hydrogen radicals are generated in an atmosphere comprising between about 3 and about 10% flowing hydrogen. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of producing a conductive thin film comprising the steps of:
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A. placing a substrate in a chamber; B. exposing the substrate to a vapor phase first reactant, wherein the first reactant adsorbs no more than a molecular monolayer of metal species on the substrate; C. removing excess first reactant and gaseous reaction byproducts from the chamber; D. exposing the substrate to a second vapor phase reactant comprising a compound that is capable of oxidizing the adsorbed metal species on the substrate into metal oxide; E. removing excess second reactant and gaseous reaction byproducts from the chamber; F. repeating the above steps B through E at least three times to form a metal oxide film; and G. following step F, exposing the substrate to hydrogen radicals to reduce the metal oxide film to metal, wherein the hydrogen radicals are generated in an atmosphere comprising between about 3 and about 10% flowing hydrogen. - View Dependent Claims (24)
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25. A method of producing an electrically conductive thin film, comprising:
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depositing a metal oxide thin film on a partially fabricated integrated circuit by an atomic layer deposition (ALD) process, the metal oxide thin film having a thickness of at least 0.6 nm; and at least partially reducing the metal oxide thin film to elemental metal by exposing the metal oxide thin film to hydrogen radicals, wherein the hydrogen radicals are generated in an atmosphere comprising between about 3 and about 10% flowing hydrogen. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification