Test structure embedded in a shipping and handling cover for integrated circuit sockets and method for testing integrated circuit sockets and circuit assemblies utilizing same

• US 7,068,039 B2
• Filed: 04/28/2004
• Issued: 06/27/2006
• Est. Priority Date: 04/28/2004
• Status: Expired due to Fees

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Parker, Kenneth P.
• Primary Examiner(s): Nguyen, Vincent Q.
• Application Number:
  US10/834,449
• Publication Number:
  US 20050242823A1
• Time in Patent Office: 790 Days
• Field of Search: 324/530, 324/537, 324/756, 324/73.1, 324761-765, 324/158.1, 324/755, 257/701, 361/220, 361/212
• US Class Current: 324/519
• CPC Class Codes: G01R 31/312 by capacitive methods
• CPC Class Codes: G01R 31/70 Testing of connections between components and printed circuit boards G01R31/68 takes precedence

Abstract

A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a test facilitating shipping and handling cover for a socket of the circuit assembly. The test facilitating shipping and handling cover may have a conductive layer for capacitively coupling to an array of pins in the socket during testing. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, contacts of a socket on the circuit assembly are capacitively coupled with a conductive layer of a shipping and handling cover mated with the socket, and an electrical characteristic is measured by a tester coupled to the shipping and handling cover to determine continuity of electrical paths through the circuit assembly.

Claims

1. A device for testing continuity of electrical paths through an integrated circuit socket of a circuit assembly, comprising:

a shipping and handling cover, having a top side and a bottom side, configured to removably mate with the integrated circuit socket of the circuit assembly; and

a conductive layer on the bottom side of the shipping and handling cover, wherein the shipping and handling cover is configured to capacitively couple with electrical paths through the integrated circuit socket of a circuit assembly.

2. A device for testing continuity of electrical paths through an integrated circuit socket of a circuit assembly, comprising:

a shipping and handling cover, having a top side and a bottom side, configured to removably mate with the integrated circuit socket of the circuit assembly; and

a conductive layer on the bottom side of the shipping and handling cover, wherein the shipping and handling cover is configured to capacitively couple with a capacitive sense plate of a tester.

3. An apparatus for testing continuity of electrical paths through an integrated circuit socket of a circuit assembly, comprising:

a test facilitating shipping and handling cover configured to removably mate within the socket and capacitively couple to electrical paths through socket;

a capacitive sense plate configured to capacitively couple with the test facilitating shipping and handling cover; and

a tester configured to stimulate nodes on the circuit assembly coupled to the electrical paths through the integrated circuit socket of the circuit assembly and measure electrical characteristics of the integrated circuit socket sensed by the capacitive sense plate.

4. An apparatus in accordance with claim 3, wherein the tester is further configured to compare the measured electrical characteristic to at least one threshold to assess continuities of electrical paths through the integrated circuit socket of a circuit assembly.

5. A method for testing continuity of electrical paths through an integrated circuit socket while a removably matable shipping and handling cover is removably inserted within the socket, comprising:

capacitively coupling contacts of the socket to a conductive layer of a shipping and handling cover;

coupling a capacitive sense plate to the removably matable shipping and handling cover;

stimulating one or more nodes of the socket;

measuring an electrical characteristic; and

comparing the measured electrical characteristic to at least one threshold to assess continuities of electrical paths through the socket.

6. The method of claim 5, wherein the measured electrical characteristic is capacitance.