Low-current pogo probe card

• US 7,068,057 B2
• Filed: 01/05/2005
• Issued: 06/27/2006
• Est. Priority Date: 06/10/1997
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Cowan, Clarence E., Tervo, Paul A.
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US11/029,745
• Publication Number:
  US 20050146345A1
• Time in Patent Office: 538 Days
• Field of Search: 324754-762, 324/72.5, 439/482, 439/824, 439 66- 70, 333246-248
• US Class Current: 324/756.03
• CPC Class Codes: G01R 1/067 Measuring probes
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A low-current pogo probe card for measuring currents down to the femtoamp region includes a laminate board having a layer of conductive traces interposed between two dielectric layers. A plurality of probing devices, such as ceramic blades, are edge-mounted about a central opening so that the probing needles or needles included therein terminate below the opening in a pattern suitable for probing a test subject workpiece. A plurality of pogo pin receiving pad sets, each including a guard pad, occupy the periphery of the board. Each guard pad is electrically connected to a trace from the layer of conductive traces. The pad sets may be connected to the probing devices by low noise cables or traces. Air trenches separate the pad sets for reducing cross talk and signal settling times.

Claims

1. A probe card for probing a test device comprising:

(a) a laminate board including a top dielectric layer, a bottom dielectric layer and a set of auxiliary guard traces interposed between said top dielectric layer and said bottom dielectric layer, said board forming an opening and having a top major surface and bottom major surface;

(b) a plurality of probing devices for probing a plurality of probing sites on a test device, each probing device including an elongate probing needle and an electrical connection point electrically connected to said probing needle, said probing devices being mounted to said top major surface in radial arrangement about said opening and extending below said opening, so that said probing needles terminate in a pattern suitable for probing said sites;

(c) a plurality of pogo pin receptive pad sets;

(d) a set of first conductors for electrically connecting each pad set to a said auxiliary guard trace; and

(e) a second conductor for electrically connecting a said electrical connection point to said pad set.

2. The probe card of claim 1 wherein said second conductor is in the form of traces on the first surface of said laminate board.

3. The probe card of claim 1 wherein said second conductor is in the form of a coaxial cable center conductor.

4. The probe card of claim 3 wherein each said pad set includes a signal pad and a guard pad and said coaxial cable center conductor connects said signal pad to said electrical connection point and is encircled by a peripheral conductor that is electrically connected to a said guard line pad.

5. The probe card of claim 1 wherein said first conductors are in the form of plated vias.

6. The probe card of claim 1 wherein said first conductors are in the form of plated channels.

7. The probe card of claim 1 wherein a trench is formed between each neighboring pair of said pogo pin receptive pad sets.

8. The probe card of claim 1 wherein said second dielectric layer has a first and a second major surface and wherein said first major surface is joined to said conductive layer and said probe card further includes a chuck guard conductive layer substantially convering said second major surface of said second dielectric layer.

9. A method for custom assembling a probe card for testing a predetermined set of probing sights resident on a predetermined integrated circuit type, to fully utilize the number of pogo pin receptive pad sets available, comprising:

determining the number, location and relative sensitivity providing a probe card workpiece, including;

(a) a laminate board including a first dielectric layer, a second dielectric layer and a conductive layer interposed between said first dielectric layer and said second dielectric layer, said board forming an opening and having a first and a second major surface;

(b) a plurality of probing devices for probing a plurality of probing sites on a test device, each probing device including an elongate probing needle and an electrical connection arm electrically connected to the probing needle, said probing devices being mounted to the first major surface in radial arrangement about said opening, extend into said opening and traverse a plane defined by the second major surface, so that said probing needles terminate in a pattern suitable for probing said sites;

(c) a plurality of pogo pin receptive pad sets each pad set including a force line pad, a sense line pad and a guard line pad that surrounds both said sense line pad and said force line pad; and

(d) a set of first conductors for electrically connecting each guard line pad to said conductive layer; and

electrically connecting both the sense line pad and the force line pad of a first pogo pin receptive pad set to a first electrical connection arm;

electrically connecting only the force line pad of a first pogo pin receptive pad set to an electrical connection arm adapted to the connected to a first test site; and

electrically connecting only the sense line pad of a second pogo pin receptive pad set to an electrical connection arm that is adapted to be connected to the first test site.

10. The method of claim 9 wherein both said sense line pad and said first pogo pin receptive pad and said force line pad of said second pogo pin receptive area are electrically connected to the same electrical connection arm.

11. The method of claim 9 wherein said sense line of said first pogo pin receptive pad is electrically connected to a second electrical connection arm, which is adapted to be connected to the first site and said force line pad of said second pogo pin receptive pad is electrically connected to a third said electrical connection arm, which is adapted to be connected to the first site.