Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit

• US 7,068,072 B2
• Filed: 06/30/2003
• Issued: 06/27/2006
• Est. Priority Date: 06/30/2003
• Status: Active Grant

• Current Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Original Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Inventors: Young, Edel M., New, Bernard J., Young, Steven P., Conn, Robert O.
• Primary Examiner(s): Tan, Vibol
• Application Number:
  US10/610,207
• Publication Number:
  US 20040268286A1
• Time in Patent Office: 1,093 Days
• Field of Search: 326/47, 326/101, 257/685, 257/686
• US Class Current: 326/47
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/13021 the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16111 the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16147 the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81141 Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06565 the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06593 Mounting aids permanently on device; arrangements for alignment use of temporary supports H01L21/6835
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H03K 19/17736 : Structural details of routing resources
• CPC Class Codes: H03K 19/1778 : Structural details for adapting physical parameters
• CPC Class Codes: H03K 19/17796 : for physical disposition of blocks

Abstract

A general purpose interface tile of a first integrated circuit includes a plurality of micropads. A second integrated circuit may be stacked on the first integrated circuit such that signals from the second integrated circuit are communicated through the micropads and the interface tile to other circuitry on the first integrated circuit. Similarly, signals from the first integrated circuit are communicated through the interface tile and the micropads to the second integrated circuit. In the event that the first integrated circuit is a programmable logic device having a programmable interconnect structure, the interface tile is part of and hooks into the programmable interconnect structure and provides a general purpose mechanism for coupling signals from the second integrated circuit to the programmable interconnect structure and/or for coupling signals from the programmable interconnect structure to the second integrated circuit.

Claims

1. An integrated circuit die comprising an array of tiles, the tiles arranged in rows and columns, wherein one of the tiles is a routing tile having four edges, the routing tile having other tiles adjacent each of its four edges, the routing tile comprising:

a first routing conductor that extends to a first of the four edges of the tile; and

a micropad that has an exposed and conductive upper surface, the micropad being couplable to the first routing conductor such that a signal received onto the micropad from a source external to the integrated circuit die can be communicated from the micropad to the first routing conductor and to the first of the four edges of the tile;

wherein the first routing conductor is a conductor segment that extends to the first edge of the tile, and

wherein the first edge of the tile abuts a second tile, the second tile having a conductor segment that meets the first routing conductor end-to-end at the first edge to form a conductor that extends from a point inside the tile to a point inside the second tile.

2. The integrated circuit of claim 1, wherein the integrated circuit die is a field programmable gate array containing programmable logic, and wherein each of the other tiles adjacent the one tile contains at least some of said programmable logic.

3. The integrated circuit die of claim 1, wherein the tile further comprises:

a second routing conductor that extends to a second one of the four edges;

a third routing conductor that extends to a third one of the four edges;

a fourth routing conductor that extends to a fourth one of the four edges, and wherein the micropad is selectively couplable to any one of the first, second, third and fourth routing conductors such that the signal received onto the micropad from the source external to the integrated circuit die can be communicated from the micropad to a selectable one of the four edges of the tile.

4. The integrated circuit die of claim 1, further comprising a ring of input/output blocks (IOBs) that substantially surrounds the array of tiles, and wherein each of the IOBs has a bonding pad, each of the bonding pads being substantially larger than the micropad of the tile.

5. The integrated circuit die of claim 1, wherein the integrated circuit die is bonded to a second integrated circuit die in a stacked relation.

6. The integrated circuit die of claim 3, wherein the second integrated circuit die is disposed over and covers the tile.

7. The integrated circuit die of claim 1, wherein the integrated circuit die has a face side surface, the micropad being a protruding micropad that protrudes beyond the face side surface.

8. The integrated circuit die of claim 1, wherein the integrated circuit die has a face side surface, the micropad being a recessed micropad that is recessed below the face side surface.

9. The integrated circuit die of claim 1, wherein multiple ones of the tiles of the array are substantially identical to the tile having the micropad.

10. The integrated circuit die of claim 1, wherein the tile further comprises a second micropad that has an exposed and conductive upper surface.

11. The integrated circuit die of claim 1, wherein the tile and the second tile are substantially identical.

12. The integrated circuit die of claim 1, wherein the integrated circuit die is a field programmable gate array (FPGA) having a programmable interconnect structure, the integrated circuit being bonded to a second integrated circuit die in a stacked relation, the tile being usable to couple a signal from the second integrated circuit die into the programmable interconnect structure of the FPGA.

13. The integrated circuit of claim 1, wherein the micropad is permanently coupled to the first routing conductor.

14. A method, comprising:

providing an interface tile on a first integrated circuit device, the interface tile having four edges, each of the four edges being adjacent another tile of the first integrated circuit device, the interface tile having a micropad that is couplable to a routing conductor of the first integrated circuit device such that a signal received onto the micropad can be communicated from the micropad and onto the routing conductors;

wherein the routing conductor is a first conductor segment that extends to a first edge of the four edges of the tile and

wherein one of the tiles adjacent to the interface tile includes a second conductor segment that meets the first routing conductor end-to-end at the first edge to form a conductor that extends from a point inside the interface tile to a point inside the one of the tiles adjacent to the interface tile.

15. The method of claim 14, further comprising:

coupling a second integrated circuit device to the first integrated circuit device in a stacked relation such that a signal can be transmitted from the second integrated circuit device and to the micropad of the first integrated circuit device.

16. The method of claim 14, wherein the micropad is a protruding micropad that extends outward from a face side surface of the first integrated circuit device.

17. The method of claim 14, wherein the micropad is a recessed micropad that is recessed with respect to a face side surface of the first integrated circuit device.

18. The method of claim 14, wherein the interface tile comprises a multiplexer structure having a data input lead and a data output lead, the data input lead receiving the signal from the micropad, the data output lead outputting the signal to the routing conductor.

19. The method of claim 15, wherein the first integrated circuit device is a programmable logic device, and wherein the second integrated circuit device is a memory device.

20. The method of claim 15, wherein the first integrated circuit device is a programmable logic device, and wherein the second integrated circuit device is an input (I/O) device.

21. The method of claim 15, wherein the first integrated circuit device is a programmable logic device, and wherein the second integrated circuit device is a microprocessor.

22. The method of claim 15, wherein the first integrated circuit device is a programmable logic device, and wherein the second integrated circuit device is an analog integrated circuit device.

23. The method of claim 14, wherein the first integrated circuit has a plurality of identical interface tiles, each of the interface tiles having a plurality of micropads, the micropads of the plurality of interface tiles forming a first pattern, the method further comprising:

providing a second integrated circuit that has a plurality of micropads disposed in a second pattern, the second pattern substantially matching the first pattern of micropads on the first integrated circuit device; and

providing a third integrated circuit that has a plurality of micropads disposed in a third pattern, the third pattern substantially matching the first pattern of micropads on the first integrated circuit device, wherein the second integrated circuit and the third integrated circuit are not identical.

24. The method of claim 23, wherein the first integrated circuit further comprises additional micropads that do not have corresponding micropads on the second integrated circuit device.

25. The method of claim 23, wherein the second integrated circuit further comprises additional micropads that do not have corresponding micropads on the first integrated circuit device.

26. The method of claim 23, wherein the second integrated circuit is a memory device and wherein the third integrated circuit device is not a memory device.

27. An integrated circuit die comprising

a first array of tiles arranged in rows and columns;

a second array of tiles arranged in rows and columns;

a column of interconnect tiles positioned between the first and second arrays of tiles;

a plurality of routing conductors that connect the first and second arrays of tiles to the interconnect tiles;

a plurality of micropads positioned on an upper surface of the integrated circuit die; and

a plurality of interconnect conductors connecting each of the interconnect tiles to a corresponding one of the micropads, whereby a signal applied to a micropad can be communicated between the micropad and a respective one of the routing conductors;

wherein the column of interconnect tiles comprises a plurality of columns of interconnect tiles.

28. The integrated circuit die of claim 27, wherein the micropads are sized to have length and width dimensions larger than a width of the routing conductors.

29. The integrated circuit die of claim 27 wherein CLB tiles occupy a plurality of columns near the column of interconnect tiles.

30. The integrated circuit die of claim 27 wherein the integrated circuit die is a first integrated circuit die and further comprising a second integrated circuit die having micropads connected to the micropads of the first integrated circuit die.

31. The integrated circuit die of claim 30 wherein the second integrated circuit die is a RAM.

32. The integrated circuit die of claim 30 wherein the second integrated circuit die is a microprocessor.

33. The integrated circuit die of claim 30 wherein the second integrated circuit die is an optical interface.

34. The integrated circuit die of claim 30 wherein the second integrated circuit die is an input/output device.

35. The integrated circuit die of claim 30 wherein the second integrated circuit die is a bus interface unit.

36. The integrated circuit die of claim 30 wherein the second integrated circuit die is a digital signal processor.

37. The integrated circuit die of claim 30 wherein the first integrated circuit die is an FPGA.

38. The integrated circuit die of claim 37 wherein the second integrated circuit die is a PLD.

39. An integrated circuit structure, comprising:

a programmable interconnect structure; and

interface tile means for coupling a second integrated circuit structure to the programmable interconnect structure of the integrated circuit structure when the second integrated circuit structure and the integrated circuit structure are in a stacked relation, the tile means comprising a micropad for communicating a signal between the integrated circuit structure and the second integrated circuit structure;

wherein the interface tile means further comprises four edges and a routing conductor couplable to the micropad such that a signal received onto the micropad can be communicated from the micropad and onto the routing conductor;

wherein the routing conductor is a first conductor segment that extends to a first edge of the four edges of the interface tile means and

wherein a first edge of the four edges of the interface tile means abuts a second tile means, the second tile means having a second conductor segment that meets the first conductor segment end-to-end at the first edge to form a conductor that extends from a point inside the interface tile means to a point inside the second tile means.

40. The integrated circuit of claim 39, wherein the integrated circuit is a programmable logic device.

41. The integrated circuit of claim 40, wherein the second integrated circuit includes a second micropad, the second micropad contacting the micropad of the tile means when the integrated circuit and the second integrated circuit are in said stacked relation.