Method of manufacturing a multi-layered piezoelectric actuator

• US 7,070,674 B2
• Filed: 12/20/2002
• Issued: 07/04/2006
• Est. Priority Date: 12/20/2002
• Status: Expired due to Fees

• Current Assignee: Caterpillar Incorporated
• Original Assignee: Caterpillar Incorporated
• Inventors: Maushard, Jerry P., Waterfield, L. Glenn, Kelley, Kurtis C.
• Primary Examiner(s): Aftergut, Jeff H.
• Assistant Examiner(s): SCHATZ, CHRISTOPHER T
• Application Number:
  US10/327,719
• Publication Number:
  US 20040117960A1
• Time in Patent Office: 1,292 Days
• Field of Search: 156/307, 156/160, 156/311, 156/286, 156/312, 156/322, 156/307.7, 29/253.5, 294/46
• US Class Current: 156/307.7
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/2048 having non-planar shape
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

Method of manufacturing a piezoelectric actuator. The method includes a pre-cure step in which the adhesive is heated to a temperature below the melting point of the adhesive. A stack is formed having a piezoelectric layer and at least one supporting layer with the pre-cured adhesive therebetween. The stack is then cured to form a bonded laminate. The temperature at which the pre-cure occurs allows for the pre-stress in the piezoelectric layer to be modified without changing the material of the supporting layer.

Claims

1. A method for manufacturing a piezoelectric actuator, comprising:

applying a first adhesive to at least one of a first surface of a piezoelectric layer and a first surface of a first supporting layer, the piezoelectric layer and the first supporting layer each having at least first and second surfaces;

heating the at least one layer having the applied adhesive to a first temperature to modify an activation temperature of the applied adhesive, cooling the at least one layer having the applied adhesive to a first ambient temperature, assembling the piezoelectric and first supporting layers into a stack, the applied adhesive being disposed between the piezoelectric layer and the first supporting layer;

heating the stack to a second temperature lower than an unmodified activation temperature of the adhesive to activate the adhesive; and

cooling the stack to a second ambient temperature.

2. The method, as set forth in claim 1, wherein the first temperature is less than the second temperature.

3. The method, as set forth in claim 1, wherein the first temperature is less than the unmodified activation temperature of the first adhesive and the second temperature is greater than the modified activation temperature of the first adhesive.

4. The method, as set forth in claim 1, wherein the applying step includes:

applying a second adhesive to at least one of a first surface of a second supporting layer and the second surface of the piezoelectric layer, the second supporting layer having first and second surfaces;

wherein the first heating step includes heating the second supporting layer to the first temperature;

wherein the first cooling step includes cooling the second supporting layer to the first ambient temperature; and

wherein the assembling step includes;

assembling the piezoelectric layer, the first supporting layer, and the second supporting layer into a stack, the piezoelectric layer disposed between the first and second supporting layers, and the second adhesive being disposed between the piezoelectric layer and the second supporting layer.

5. The method, as set forth in claim 1, wherein the piezoelectric layer and the first supporting layer each have an aperture and wherein a pin is disposed within the apertures of the piezoelectric layer and the first supporting layer.

6. The method, as set forth in claim 1, wherein the applying step includes:

applying the first adhesive to the first surface of the piezoelectric layer and the first surface of the first supporting layer, and

wherein the assembling step includes;

positioning the first surface of the piezoelectric layer adjacent to the first surface of the first supporting layer.

15. The method, as set forth in claim 1l, wherein the pre-heating step includes:

positioning the first surface of the piezoelectric layer adjacent to the first surface of the first adhesive layer;

heating the piezoelectric layer and the first adhesive layer to a first temperature; and

cooling the piezoelectric layer and the first adhesive layer to a first ambient temperature.

7. A method for manufacturing a piezoelectric actuator, comprising:

pre-heating an adhesive to modify an activation temperature of the adhesive;

assembling a stack comprised of a piezoelectric layer and a first supporting layer, the adhesive disposed there between;

heating the stack above the modified activation temperature of the adhesive, but below an unmodified activation temperature of the adhesive; and

cooling the stack to a final ambient temperature.

8. The method, as set forth in claim 7, wherein the pre-heating step includes:

heating the adhesive to a temperature below the unmodified activation temperature of the adhesive; and

cooling the adhesive to a first ambient temperature.

9. The method, as set forth in claim 8, wherein the assembling step includes:

assembling the stack comprised of the piezoelectric layer, the first supporting layer, and a second supporting layer, the piezoelectric layer disposed between the first and second supporting layers, and the adhesive being disposed between both the piezoelectric layer and the second supporting layer and the piezoelectric layer and the first supporting layer.

10. The method, as set forth in claim 8, wherein the piezoelectric layer and the first supporting layer each have an aperture and wherein a pin is disposed within the apertures of the piezoelectric layer and the first supporting layer.

11. A method for manufacturing a piezoelectric actuator, comprising selecting a first adhesive layer, a piezoelectric layer, and a first supporting layer;

pre-heating the adhesive layer to modify an activation temperature of the adhesive layer;

assembling a stack comprised of the piezoelectric layer and the first supporting layer with the first adhesive layer disposed there between; and

curing the stack to form a bonded laminate, wherein curing occurs at at least the modified activation temperature but below an unmodified activation temperature.

12. The method, as set forth in claim 11, wherein the piezoelectric layer, the first supporting layer, and the first adhesive layer each has first and second surfaces;

and

wherein the assembling step includes disposing the first surface of the piezoelectric layer adjacent to the first surface of the first adhesive layer and disposing the second surface of the first adhesive layer adjacent to the first surface of the first supporting layer.

13. The method, as set forth in claim 11, wherein the per-heating step includes:

heating the first adhesive layer to a first temperature; and

cooling the first adhesive layer to a first ambient temperature;

wherein the curing step includes;

heating the stack to a second temperature; and

cooling the stack to a second ambient temperature; and

wherein the first temperature is less than the second temperature.

14. The method, as set forth in claim 13, wherein the first temperature is below the unmodified activation temperature of the first adhesive layer, and wherein the second temperature is above the modified activation temperature of the first adhesive layer.

16. The method, as set forth in claim 11, wherein the selecting step includes:

selecting a second supporting layer and a second adhesive layer;

wherein the pre-heating step includes;

pre-heating the second adhesive layer;

wherein the assembling step includes;

assembling the stack comprised of the piezoelectric layer, the first supporting layer, and the second supporting layer, with the first adhesive layer disposed between the piezoelectric layer and the first supporting layer and the second adhesive layer disposed between the piezoelectric layer and the second supporting layer.

17. The method, as set forth in claim 16, wherein the piezoelectric layer, the first supporting layer, the second supporting layer, the first adhesive layer, and the second adhesive layer each has first and second surfaces;

and

wherein the assembling step includes disposing the first surface of the piezoelectric layer adjacent to the first surface of the first adhesive layer, disposing the second surface of the first adhesive layer adjacent to the first surface of the first supporting layer, disposing the second surface of the piezoelectric layer adjacent to the first surface of the second adhesive layer, and disposing the second surface of the second adhesive layer adjacent to the first surface of the second supporting layer.