Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

• US 7,071,078 B2
• Filed: 09/02/2004
• Issued: 07/04/2006
• Est. Priority Date: 05/19/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Jiang, Tongbi, Reeder, W. Jeff
• Primary Examiner(s): Nhu, David
• Application Number:
  US10/933,889
• Publication Number:
  US 20050032270A1
• Time in Patent Office: 670 Days
• Field of Search: 438/455, 438/106, 438/48, 438/51, 438/55, 438/64, 438/112, 438/118, 438/123, 438/458, 438/611, 438/612, 438/617
• US Class Current: 438/455
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/83856 Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3737 : Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4951 : Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49513 : having bonding material between chip and die pad
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01R 4/04 : using electrically conductive adhesives
• CPC Class Codes: H05K 2203/0278 : Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/0058 : Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the curable component of the hybrid adhesive material may be cured to more permanently secure the semiconductor device components to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200° C. and as low as about 120° C. or less.

Claims

1. A method for securing at least two semiconductor device components to one another, comprising:

applying an adhesive material comprising a pressure sensitive component and a curable component to at least a portion of a surface of a first semiconductor device component;

placing a surface of a second semiconductor device component in contact with the adhesive material to temporarily secure the second semiconductor device component to the first semiconductor device component; and

curing the curable component of the adhesive material.

2. The method of claim 1, wherein placing comprises pressing the surface of the second semiconductor device component against the adhesive material.

3. The method of claim 1, wherein, in placing the surface of the second semiconductor device component in contact with the adhesive material, the pressure sensitive component of the adhesive material temporarily secures the second semiconductor device component to the first semiconductor device component.

4. The method of claim 1, wherein applying comprises applying the adhesive material to a carrier.

5. The method of claim 4, wherein applying comprises applying the adhesive material to at least a portion of a surface of at least one of a lead frame, a circuit board, an interposer, and at least one semiconductor die.

6. The method of claim 1, wherein placing comprises placing at least one semiconductor die in contact with the adhesive material.

7. The method of claim 1, wherein placing comprises placing a heat sink in contact with the adhesive material.

8. The method of claim 1, wherein applying comprises at least one of spraying the adhesive material, spreading the adhesive material, metered-dispensing of the adhesive material, extruding the adhesive material, contact applying the adhesive material, and positioning a structure coated with the adhesive material.

9. The method of claim 8, wherein spraying comprises atomizing the adhesive material.

10. The method of claim 1, wherein applying comprises spreading the adhesive material over only a portion of the surface of the first semiconductor device component.

11. The method of claim 1, wherein applying comprises applying a film including the adhesive material on at least portions of opposite surfaces thereof to at least the surface of the first semiconductor device component.

12. The method of claim 1, wherein curing the curable component of the adhesive material comprises heating at least the adhesive material.

13. The method of claim 12, wherein heating comprises heating at least the adhesive material to a temperature of less than about 200°

C.

14. The method of claim 12, wherein heating comprises heating at least the adhesive material to a temperature of about 120°

C.

15. The method of claim 1, further comprising:

repositioning the first and second semiconductor device components relative to one another before curing the curable component of the adhesive material.

16. A method for securing at least two semiconductor device components to one another, comprising:

applying an adhesive material comprising a pressure sensitive component and a curable component to at least one of the at least two semiconductor device components;

positioning the at least two semiconductor device components adjacent to one another with adhesive material positioned therebetween to at least temporarily secure the at least two semiconductor device components to one another; and

altering a state of the curable component of the adhesive material to permanently secure the at least two semiconductor device components to one another.

17. The method of claim 16, wherein, during positioning, the pressure sensitive component of the adhesive material temporarily secures the at least two semiconductor device components to one another.

18. The method of claim 16, wherein, during altering, the curable component of the adhesive material permanently secures the at least two semiconductor device components to one another.

19. The method of claim 16, wherein positioning comprises pressing at least one of the at least two semiconductor device components toward the other of the at least two semiconductor device components.

20. The method of claim 16, wherein applying comprises applying the adhesive material to a semiconductor device component that comprises a carrier.

21. The method of claim 20, wherein applying the adhesive material to a semiconductor device component that comprises a carrier includes applying the adhesive material to one of a lead frame, a circuit board, an interposer, and at least one semiconductor die.

22. The method of claim 16, wherein positioning comprises positioning a carrier adjacent to another semiconductor device component.

23. The method of claim 16, wherein positioning comprises positioning a heat sink adjacent to another semiconductor device component.

24. The method of claim 16, wherein applying comprises at least one of spraying the adhesive material, spreading the adhesive material, metered-dispensing of the adhesive material, extruding the adhesive material, contact applying the adhesive material, and positioning a structure coated with the adhesive material.

25. The method of claim 24, wherein spraying comprises atomizing the adhesive material.

26. The method of claim 16, wherein applying comprises applying a film including the adhesive material on at least portions of opposite surfaces thereof to at least a portion of a surface of at least one of the at least two semiconductor device components.

27. The method of claim 16, wherein altering comprises heating at least the curable component of the adhesive material.

28. The method of claim 27, wherein heating comprises heating at least the curable component to a temperature of less than about 200°

C.

29. The method of claim 27, wherein heating comprises heating at least the thermoset component of the adhesive material to a temperature of about 120°

C.

30. The method of claim 16, further comprising:

repositioning the at least two semiconductor device components relative to one another before altering the state of the curable component.