×

Method for fabricating bulbous-shaped vias

  • US 7,071,088 B2
  • Filed: 08/23/2002
  • Issued: 07/04/2006
  • Est. Priority Date: 08/23/2002
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method for fabricating vias on a substrate having a surface, comprising:

  • disposing, adjacent to said substrate, a polymerizable fluid composition;

    contacting said polymerizable fluid composition with a mold having a relief structure, with said polymerizable fluid composition conforming to a profile of said mold;

    subjecting said polymerizable fluid composition to conditions to polymerize said polymerizable fluid composition, forming a polymerized layer having a bi-level indentation including a nadir and shoulders spaced-apart from said nadir;

    forming a relief pattern adjacent to said substrate having an opening extending toward said surface by selectively removing material adjacent to said substrate, with said material including a sub-section of said polymerized layer located proximate to said bi-level indentation; and

    depositing a conductive layer to cover said relief pattern, thereby forming a contact having a shape defined by said relief pattern.

View all claims
  • 15 Assignments
Timeline View
Assignment View
    ×
    ×