Process for producing microelectromechanical components and a housed microelectromechanical component

• US 7,071,521 B2
• Filed: 11/22/2004
• Issued: 07/04/2006
• Est. Priority Date: 08/24/2001
• Status: Expired due to Fees

• Current Assignee: Wafer-Level Packaging Portfolio LLC
• Original Assignee: Schott AG (Carl-Zeiss-Stiftung)
• Inventors: Leib, Jürgen, Bieck, Florian
• Primary Examiner(s): LEE, HSIEN MING
• Application Number:
  US10/994,659
• Publication Number:
  US 20050064644A1
• Time in Patent Office: 589 Days
• Field of Search: 438/22, 438/32, 438/48, 438/55, 257/414, 257/432, 257/444
• US Class Current: 257/414
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias

Abstract

A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

Claims

1. A process for producing microelectromechanical components from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the step of providing at least one electrically conductive passage into the substrate, connecting the first side to the second side, and the step of securing at least one support to the first side of the substrate, wherein the at least one electrically conductive passage is uncovered by thinning the substrate material with the mechanical stability being ensured by means of the support.

2. The process according to claim 1, wherein the step of securing comprises at least one of the steps of securing the support and of introducing at least one electrically conductive passage that takes place while the components are still joined to the wafer.

3. The process according to claim 1, wherein the step of providing the at least one electrically conductive passage comprises the step of producing a recess by removing substrate material.

4. The process according to claim 3, wherein the step of removing the substrate material is selected from a group consisting of dry-etching, wet-etching, grinding and ultrasonic lapping.

5. The process according to claim 3, further comprising the step of filling the recess with a conductive material.

6. The process according to claim 5, wherein the conductive material comprises a conductive epoxy.

7. The process according to claim 1, wherein the step of providing the at least one electrically conductive passage comprises the step of at least one of doping and ion implantation.

8. The process according to claim 1, further comprising the step of producing at least one electrical contact surface.

9. The process according to claim 8, comprising the step of producing a contact surface on the first side of the substrate.

10. The process according to claim 1, in which the substrate is selected from a group consisting of a semiconductor material, a glass, a metal, a ceramic material, a piezo-electric material, a plastic and a composite material.

11. The process according to claim 1, further comprising a structuring step in which the structuring step comprises the step of introducing at least one structure which forms at least one of a cavity and a through-opening.

12. The process according to claim 1, further comprising a step of structuring the support in which the step of structuring the support comprises the step of producing at least one trench, the trench extending in a direction along a surface of the support.

13. The process according to claim 1, further comprising a step of structuring the support in which the step of structuring the support comprises the step of producing a mechanical fit.

14. The process according to claim 13, in which the mechanical fit is suitable for receiving an optical element.

15. The process according to claim 13, in which the mechanical fit is suitable for receiving at least one of a waveguide and an optical lens and a prism.

16. The process according to claim 1, further comprising a step of structuring the support in which the step of structuring the support comprises a step of producing a support which includes optical components.

17. The process according to claim 16, in which the step of producing a support which includes optical components comprises the step of producing at least one of optical lenses and gratings.

18. The process according to claim 1, further comprising a step of structuring the support in which the step of structuring the support comprises the step of producing a spacer.

19. The process according to claim 1, further comprising a step of producing a structural support, in which the step of producing a support comprises the step of producing a receiving part.

20. The process according to claim 1, further comprising the step of introducing at least one of a light-conducting, fluid-conducting and heat-conducting passage into the substrate.

21. The process according to claim 1, wherein the at least one electrically conductive passage is introduced from the first side of the substrate, and wherein the support is secured after the at least one conductive passage has been introduced.

22. The process according to claim 1, wherein the at least one conductive passage is introduced from the second side of the substrate.

23. The process according to claim 1, further comprising a step of applying a soldering bead to the at least one conductive passage.

24. The process according to claim 1, comprising the step of securing at least one further substrate to the substrate.

25. The process according to claim 1, further comprising a step of structuring the support, in which the step of structuring the support comprises the step of producing at least one V-groove, the V-groove extending in a direction along a surface of the support.

26. The process according to claim 1, further comprising a step of structuring the support, in which the step of structuring the support comprises the step of producing a spacer for at least one of an optical element and a further support.

27. The process according to claim 1, further comprising a step of producing a support, in which the step of producing a support comprises the step of producing a receiving part for at least one of fluids, optical elements, piezo-electric elements, micromechanical elements and electronic components.

28. The process according to claim 1, comprising the step of securing at least one further substrate to the substrate, which comprises at least one of integrated semiconductor circuit arrangements and MEMS elements.

29. A microelectromechanical component comprising a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side comprising at least one microelectromechanical element and at least one support which is connected to the first side of the substrate, wherein the substrate has at least one electrically conductive passage, connecting the first side to the second side and wherein the substrate is thinned, the mechanical stability of the thinned substrate being ensured by means of the support.

30. The component according to claim 29, wherein the support has at least one optical element.

31. The component according to claim 29, wherein the support has at least one of a cavity and a through-opening.

32. The component according to claim 29, wherein the support has at least one fit.

33. The component according to claim 32, wherein the fit is suitable for receiving an optical element.

34. The component according to claim 32, wherein the fit is suitable for receiving an optical element selected from a group at least consisting of a lens 5), a waveguide, a grating and a prism.

35. The component according to claim 29, in which the support has a receiving part.

36. The component according to claim 35, in which the receiving part is adapted to receive at least one of a circuit arrangement, a piezo-electric component and an active or passive electronic element.

37. The component according to claim 29, wherein the support is adhesively bonded to the substrate.

38. The component according to claim 29, wherein the support has a plurality of layers.

39. The component according to claim 29, comprising at least one further substrate, the substrate and the at least one further substrate being arranged above one another.

40. The component according to claim 39, wherein the at least one further substrate has at least one connection contact, and the conductive passage is in electrical contact with the connection contact.

41. The component according to claim 29, wherein the support has at least one optical element selected from a group consisting of a prism, a grating, a lens and an optical filter.

42. The component according to claim 29, wherein the support is adhesively bonded to the substrate by an epoxy resin.