Process for producing microelectromechanical components and a housed microelectromechanical component
First Claim
1. A process for producing microelectromechanical components from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the step of providing at least one electrically conductive passage into the substrate, connecting the first side to the second side, and the step of securing at least one support to the first side of the substrate, wherein the at least one electrically conductive passage is uncovered by thinning the substrate material with the mechanical stability being ensured by means of the support.
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Accused Products
Abstract
A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.
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Citations
42 Claims
- 1. A process for producing microelectromechanical components from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the step of providing at least one electrically conductive passage into the substrate, connecting the first side to the second side, and the step of securing at least one support to the first side of the substrate, wherein the at least one electrically conductive passage is uncovered by thinning the substrate material with the mechanical stability being ensured by means of the support.
- 29. A microelectromechanical component comprising a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side comprising at least one microelectromechanical element and at least one support which is connected to the first side of the substrate, wherein the substrate has at least one electrically conductive passage, connecting the first side to the second side and wherein the substrate is thinned, the mechanical stability of the thinned substrate being ensured by means of the support.
Specification