Temperature compensation for silicon MEMS resonator

• US 7,071,793 B2
• Filed: 02/23/2005
• Issued: 07/04/2006
• Est. Priority Date: 04/16/2003
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Partridge, Aaron, Lutz, Markus
• Primary Examiner(s): Summons, Barbara
• Application Number:
  US11/063,794
• Publication Number:
  US 20050162239A1
• Time in Patent Office: 496 Days
• Field of Search: 333/186, 333/197, 333/200
• US Class Current: 333/186
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: H03H 2009/02496 Horizontal, i.e. parallel to the substrate plane
• CPC Class Codes: H03H 2009/02511 Vertical, i.e. perpendicular to the substrate plane
• CPC Class Codes: H03H 9/02259 Driving or detection means
• CPC Class Codes: H03H 9/02338 Suspension means
• CPC Class Codes: H03H 9/02417 involving adjustment of the transducing gap
• CPC Class Codes: H03H 9/02448 of temperature influence
• CPC Class Codes: H03H 9/2457 Clamped-free beam resonators
• CPC Class Codes: H03H 9/2463 Clamped-clamped beam resonators

Abstract

Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.

Claims

1. A micromechanical resonator, comprising:

a substrate formed from a first material having a first thermal expansion coefficient;

a beam suspended above the substrate and formed from a plurality of materials which, in combination, provide a second thermal expansion coefficient; and

an anchor structure, coupled to the beam, to suspend the beam above the substrate, wherein the anchor structure is formed from a plurality of materials which, in combination, provide a third thermal expansion coefficient and wherein the third thermal expansion coefficient is different from the second thermal expansion coefficient.

2. The resonator of claim 1 wherein the beam is formed from second and third materials.

3. The resonator of claim 2 wherein the second material is an inner-core of the beam and the third material is disposed as an outer-layer around the second material.

4. The resonator of claim 2 wherein the second material is silicon and the third material is silicon dioxide or silicon nitride.

5. The resonator of claim 2 wherein the anchor structure is formed in part from the second material.

6. The resonator of claim 5 wherein the anchor structure is formed in part from the third material.

7. The resonator of claim 2 wherein the anchor structure is formed in part from a fourth material.

8. The resonator of claim 1 further including first and second lever arms coupled to the beam and laterally disposed one from the other in relation to the beam.

9. The resonator of claim 8 further including a compressive/expansion bar connected between the first and second lever arms to responsively exert a tensile or compressive force on the beam.

10. A micromechanical resonator, comprising:

a substrate formed from a first material having a first thermal expansion coefficient;

a beam formed from a second and third materials which, in combination, provide a second thermal expansion coefficient which is different from the first thermal expansion coefficient, wherein the beam is suspended above the substrate by at least one anchor structure;

wherein the at least one anchor structure is formed from a plurality of materials which, in combination, provide a third thermal expansion coefficient which is different from the second thermal expansion coefficient.

11. The resonator of claim 10 wherein the beam is formed from a material other than the second and third materials.

12. The resonator of claim 10 wherein the at least one anchor is formed in part from a material other than the second material and the third material.

13. The resonator of claim 10 wherein the at least one anchor structure is formed in part from the second material or the third material.

14. The resonator of claim 10 wherein the at least one anchor structure is formed in part from a fourth material.

15. A micromechanical resonator, comprising:

a substrate formed from a first material having a first thermal expansion coefficient;

an oscillating beam formed from an active layer deposited over the substrate, wherein the active layer is formed from;

(1) a second material having a second thermal expansion coefficient which is different from the first thermal expansion coefficient and (2) a third material having a third thermal expansion coefficient which is different from the second thermal expansion coefficient;

a first anchor structure which is formed, at least in part, from a fourth material having a fourth thermal expansion coefficient, and wherein the fourth thermal expansion coefficient is different from the second and third thermal expansion coefficients; and

wherein the first anchor structure is disposed on the substrate to, at least in part, support the oscillating beam above the substrate.

16. The resonator of claim 15, wherein the first anchor structure is formed from the active layer.

17. The resonator of claim 15, wherein the first anchor structure is formed, at least in part, from the active layer.

18. The resonator of claim 17, further including a second anchor structure, disposed on the substrate, to support the oscillating beam above the substrate, wherein the second anchor structure is formed, at least in part, from the fourth material.

19. The resonator of claim 15, wherein the oscillating beam is formed in part from a material other than the second material and the third material.