Fanless computer with integrated display
First Claim
1. A fanless computer comprising:
- a front component assembly comprising a front bezel and a touch screen;
a rear component assembly comprising a rear bezel, an EMI box, and a PCB assembly, said rear bezel comprising vents for dissipating heat; and
a heat sink comprising an indentation to accommodate a processor on said PCB assembly, a plurality of attachment points for directly attaching said PCB assembly to said heat sink, and a plurality of channels for dissipating heat, said heat sink for dissipating through said channels and through said vents of said rear bezel heat caused by heat sources in said front and rear component assemblies and for supporting said PCB assembly.
1 Assignment
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Accused Products
Abstract
The present invention is a fanless computer with an integrated display. Passive cooling design features, including a heat sink, are incorporated into the device so that it is fanless. The heat sink supports the entire computer enclosure and causes heat in the device to dissipate through vents. The PCB assembly may be attached directly to the heat sink to facilitate thermal transfer characteristics so that components are cooled without the need for a fan. A pressure plate may be attached to the back of the PCB provides a tight coupling between the processor and heat sink. The computer is fanless, silent, and compact and therefore, suitable for many applications, including for use in locations where the availability of space is a concern. For example, the computer may be mounted on a retail store shelf to provide product information to consumers shopping at the retail establishment.
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Citations
18 Claims
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1. A fanless computer comprising:
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a front component assembly comprising a front bezel and a touch screen; a rear component assembly comprising a rear bezel, an EMI box, and a PCB assembly, said rear bezel comprising vents for dissipating heat; and a heat sink comprising an indentation to accommodate a processor on said PCB assembly, a plurality of attachment points for directly attaching said PCB assembly to said heat sink, and a plurality of channels for dissipating heat, said heat sink for dissipating through said channels and through said vents of said rear bezel heat caused by heat sources in said front and rear component assemblies and for supporting said PCB assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A heat sink for use in a computer with an integrated display, said heat sink comprising:
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a plurality of channels formed by a series of parallel partitions; an indentation for accommodating a processor on a PCB assembly, said processor and a plurality of components arranged on said PCB assembly in a manner that allows said PCB assembly to be tightly coupled to said heat sink; and a plurality of holes for accommodating standoffs to attach said heat sink directly to said PCB assembly in said computer, wherein said heat sink transfers heat from said PCB assembly through said plurality of channels to vents on a rear bezel and supports said PCB assembly. - View Dependent Claims (11, 12, 13)
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14. A method for constructing a fanless computer comprising:
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constructing a front component assembly comprising a front bezel and a touch screen; constructing rear component assembly comprising a rear bezel, an EMI box, and a PCB assembly, said rear bezel comprising vents for dissipating heat; and attaching a heat sink with an indentation to accommodate said PCB assembly, said heat sink attached said PCB assembly using attachment points on said heat sink to dissipate heat from PCB assembly through said vents in said rear bezel; and connecting said front component assembly and said rear component assembly. - View Dependent Claims (15, 16, 17, 18)
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Specification