Method for maintaining operability of a flexible, self conforming, workpiece support system

• US 7,073,252 B1
• Filed: 02/24/2004
• Issued: 07/11/2006
• Est. Priority Date: 10/13/1998
• Status: Expired due to Fees

• Current Assignee: Allen David Hertz, Eric Lee Hertz
• Original Assignee: Allen David Hertz, Eric Lee Hertz
• Inventors: Hertz, Eric Lee, Hertz, Allen David
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US10/785,371
• Time in Patent Office: 868 Days
• Field of Search: 297/29, 29739-740, 269266-269, 269/25, 269/309, 269/296, 269/20
• US Class Current: 29/829
• CPC Class Codes: B23Q 1/035 with an array of longitudinally movable rods defining a reconfigurable support surface
• CPC Class Codes: B25B 1/2421 the parts having a linear movement
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

A method is disclosed for maintaining a reliable operation of a flexible, self-conforming support system. The self-conforming support system utilizes a plurality of pins that move vertically within a series of apertures. The motion of the pins can be hindered with unwarranted material becoming lodged between the pins and the respective aperture. One scenario where this is highly probable is when using the self-conforming support system for supporting Printed Circuit Boards during a solder paste application process. The present invention utilizes a protective collar to deflect any excess solder paste from becoming lodged between any of the pins and the respective aperture. The collar is essentially an umbrella, and can be of a molded material, a pliant material, or machined into the pins. The collar can further include a pliant top which also protects the Printed Circuit Board from the pins.

Claims

1. A method for maintaining reliability of a printed circuit board support apparatus, the method comprising the steps:

utilizing elongated support members to support a printed circuit board during a solder paste application process used to apply solder paste onto said printed circuit board,

wherein said elongated support members are positioned in an array layout to support said printed circuit board, wherein each of the elongated support members are configured and held within apertures of a base member,

profiling said elongated support members by adjusting a vertical position of said elongated support members within said apertures in a manner to match a profile of said printed circuit board, and

deflecting said solder paste from impinging upon an interface between said elongated support member and said aperture of said base member using a protective collar.

2. The method of claim 1 wherein said protective collar is of a pliant material.

3. The method of claim 1 further comprising the step of protecting said printed circuit board by utilizing a compliant material positioned on said elongated support members proximate a location where said elongated support members contact said printed circuit board.

4. The method of claim 1 further comprising the step of protecting said printed circuit board by using said protective collar fabricated of a compliant material, and designing said protective collar to additionally comprise an area which covers a point of contact between said elongated support members and said printed circuit board.

5. The method of claim 1 wherein said step of deflecting said solder paste from said interface between said elongated support member and said aperture of said base member using a protective collar, wherein said protective collar is fabricated as a feature of said elongated support member.

6. The method for maintaining reliability of a printed circuit board support apparatus of claim 1, further comprising a step of:

applying a holding force to said elongated support members in said profiled position.

7. The method for maintaining reliability of a printed circuit board support apparatus of claim 3, further comprising a step of:

applying a holding force to said elongated support members in said profiled position.