Thin electronic chip card and method of making same

• US 7,073,723 B2
• Filed: 01/28/2004
• Issued: 07/11/2006
• Est. Priority Date: 01/31/2003
• Status: Active Grant

• Current Assignee: VARTA Microbattery GmbH (VARTA AG)
• Original Assignee: VARTA Microbattery GmbH (VARTA AG)
• Inventors: Moser, Michael, Stelzig, Heinrich, Bosch, Ulrich, Rathmann, Claudia, Birke-Salam, Fatima, Fürst, Stefan, Woehrle, Thomas, Ilic, Dejan
• Primary Examiner(s): Le, Thien M.
• Assistant Examiner(s): Nguyen, Kimberly D.
• Application Number:
  US10/766,367
• Publication Number:
  US 20040182939A1
• Time in Patent Office: 895 Days
• Field of Search: 235/492, 235/488, 439/500, 439/68
• US Class Current: 235/492
• CPC Class Codes: G06K 19/0702 the arrangement including a battery
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A thin electronic chip card with an IC chip and a galvanic element as an energy store, which has at least one lithium-intercalating electrode and has a thin, flexible housing comprising two metal foils, which bear directly against the electrodes and are connected to each other in a sealed manner with an adhesive or sealing layer, the element is arranged in a recess in the chip card and the chip card and the element are covered on both sides by an overlay plastic film, which is firmly bonded to the chip card and the element with an elastic stress-compensating adhesive, which adheres simultaneously on metals and plastics.

Claims

1. A thin electronic chip card comprising:

an IC chip in a core film;

a galvanic element as an energy store, which has at least one lithium-intercalating electrode and a thin, flexible housing comprising two metal foils, which bear directly against the electrodes and are connected to each other in a sealed manner with an adhesive or sealing layer, arranged in a recess in the core film;

an elastic stress-compensating adhesive layer which adheres to metals and plastics coated over both sides of the core film and the element; and

an overlay plastic film applied to each of the adhesive layers to firmly bond the core film and the element.

2. The thin electronic chip card according to claim 1, produced by cold lamination of the overlay films to the core film, surfaces of the metallic housing to the overlay films and the metallic housing to the core film.

3. The thin electronic chip card according to claim 1, wherein the adhesive has a glass transition temperature between about 35°

C. and about 70°

C. and an elongation at break of about 40–

about 52%.

4. The thin electronic chip card according to claim 1, wherein the adhesive is light-curable.

5. The thin electronic chip card according to claim 1, wherein the adhesive is an epoxy resin.

6. The thin electronic chip card according to claim 1, wherein the adhesive is a thermoplastic polyurethane-based material.

7. The thin electronic chip card according claim 1, wherein the overlay plastic film is PVC.

8. A thin electronic chip card comprising:

a core film having opposed sides and a recess;

an IC chip in the core film;

a galvanic element located in the recess;

an adhesive layer having a glass transition temperature between about 35°

C. and about 70°

C. and an elongation at break of about 40–

about 52% applied to both sides of the core film and the galvanic element; and

a plastic overlay film applied to the adhesive layers.

9. The thin electronic chip card according to claim 8, produced by cold lamination of the overlay films to the core film, surfaces of the metallic housing to the overlay films and the metallic housing to the core film.

10. The thin electronic chip card according to claim 8, wherein the adhesive is light-curable.

11. The thin electronic chip card according to claim 8, wherein the adhesive is an epoxy resin.

12. The thin electronic chip card according to claim 8, wherein the adhesive is a thermoplastic polyurethane-based material.

13. The thin electronic chip card according claim 8, wherein the overlay plastic film is PVC.

14. A method of producing a thin electronic chip card comprising:

forming a core film with an IC chip;

forming a recess in the core film;

placing a galvanic element in the recess;

applying an adhesive layer having a glass transition temperature between about 35°

C. and about 70°

C. and an elongation at break of about 40–

about 52% onto both sides of the core film and the galvanic element;

applying a plastic overlay film onto the adhesive layers; and

causing the adhesive layers to cure.

15. The thin electronic chip card according to claim 14, wherein the adhesive is light-curable.

16. The thin electronic chip card according to claim 14, wherein the adhesive is an epoxy resin.

17. The thin electronic chip card according to claim 14, wherein the adhesive is a thermoplastic polyurethane-based material.

18. The thin electronic chip card according claim 14, wherein the overlay plastic film is PVC.