Hermetically sealed endoscope image pick-up device

• US 7,074,181 B2
• Filed: 03/02/2004
• Issued: 07/11/2006
• Est. Priority Date: 03/06/2003
• Status: Active Grant

• Current Assignee: Olympus Corporation
• Original Assignee: Olympus Corporation
• Inventors: Futatsugi, Yasuyuki
• Primary Examiner(s): Leubecker, John
• Assistant Examiner(s): SMITH, PHILIP ROBERT
• Application Number:
  US10/791,455
• Publication Number:
  US 20040176661A1
• Time in Patent Office: 861 Days
• Field of Search: 600/109, 600/110, 600/129, 600/133, 348 75- 76
• US Class Current: 600/129
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: G02B 23/2484 Arrangements in relation to a camera or imaging device processing or control of video signals generated by an endoscope H04N23/60, H04N23/70
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

The present invention provides an image pick-up device and an endoscope in which a lens member and a solid-state image pick-up device are prevented from exposure to water vapor during autoclave sterilization, and in which the diameter of an insertion portion is narrow, a rigid tip end portion is short, and assembly is performed easily. The image pick-up device of the present invention comprises an image pick-up unit for capturing an optical image obtained from incident light entering an internal cavity of a frame, and outputting an image signal of the optical image, wiring extending from the image pick-up unit in an opposite direction to the direction in which the incident light enters, this wiring being capable of transmitting the image signal, and a substrate which is disposed in the internal cavity of a frame, has holes for engaging with the wiring, one surface of which is substantially orthogonal to the axial direction of the frame, and which is formed of a member having a light-transmitting property.

Claims

1. An image pick-up device comprising:

an image pick-up unit for capturing an optical image obtained from incident light entering an internal cavity formed by a frame having an inner surface and an outer surface, and outputting an image signal of the optical image;

wiring extending from the image pick-up unit in an opposite direction to the direction in which the incident light enters, the wiring being capable of transmitting the image signal; and

a substrate disposed in a predetermined position within the internal cavity of the frame so as to hermetically seal one of a first opening and a second opening formed on the frame, the substrate having engaging portions for engaging with the wiring, one surface of the substrate being substantially orthogonal to the axial direction of the frame, and formed of a member having a light-transmitting property.

2. The image pick-up device according to claim 1, wherein the engaging portions are holes into which the wiring can be inserted.

3. The image pick-up device according to claim 1, wherein wiring patterns are provided on the surface of the substrate on a proximal face for electrically connecting the engaging portions to the wiring.

4. The image pick-up device according to claim 1, wherein the substrate is joined hermetically to the inner surface of the frame by soldering.

5. An image pick-up device comprising:

image pick-up means for capturing an optical image obtained from incident light entering an internal cavity formed by a frame, and outputting an image signal of the optical image;

wiring means extending from the image pick-up means in an opposite direction to the direction in which the incident light enters, which are capable of transmitting the image signal; and

a substrate disposed in a predetermined position within the internal cavity of the frame so as to hermetically seal one of a first opening and a second opening formed on the frame, the substrate having engaging portions for engaging with the wiring means, one surface of the substrate being substantially orthogonal to the axial direction of the frame, and formed of a member having a light-transmitting property.

6. An endoscope having an insertion portion which can be inserted into a body to be examined, comprising:

an image pick-up unit for capturing an optical image obtained from incident light entering an internal cavity formed by a frame provided on a front end portion of the insertion portion, and outputting an image signal of the optical image;

wiring extending from the image pick-up unit in an opposite direction to the direction in which the incident light enters, which is capable of transmitting the image signal; and

a substrate disposed in a predetermined position within the internal cavity of the frame so as to hermetically seal one of a first opening and a second opening formed on the frame, the substrate having engaging portions for engaging with the wiring, one surface of the substrate being substantially orthogonal to the axial direction, of the frame, and formed of a member having a light-transmitting property.

7. The endoscope according to claim 6, wherein the engaging portions are holes into which the wiring can be inserted.

8. The endoscope according to claim 6, wherein wiring patterns are provided on the surface of the substrate on a proximal face for electrically connecting the engaging portions to the wiring.

9. The endoscope according to claim 6, wherein the substrate is joined hermetically to an inner surface of the frame by soldering.

10. An endoscope having an insertion portion which can be inserted into a body to be examined, comprising:

image pick-up means for capturing an optical image obtained from incident light entering an internal cavity formed by a frame provided on a front end portion of the insertion portion, and outputting an image signal of the optical image;

wiring means extending from the image pick-up means in an opposite direction to the direction in which the incident light enters, the wiring means being capable of transmitting the image signal; and

a substrate disposed in a predetermined position within the internal cavity of the frame so as to hermetically seal one of a first opening and a second opening formed on the frame, the substrate having engaging portions for engaging with the wiring means, one surface of the substrate being substantially orthogonal to the axial direction of the frame, and formed of a member having a light-transmitting property.

11. An assembly method for an image pick-up device comprising an image pick-up unit for capturing an optical image obtained from incident light and outputting an image signal of the optical image, comprising the steps of:

disposing a substrate formed of a transparent member on the rear end of an internal cavity of a substrate frame such that one surface thereof is substantially orthogonal to an axial direction of the substrate frame, and hermetically joining an inner peripheral surface of the substrate frame and an outer peripheral surface of the substrate;

engaging wiring of a solid-state image pick-up device provided in the image pick-up unit, which extends in an opposite direction to the direction in which the incident light enters, with a plurality of first engaging portions provided in the substrate while performing position alignment visually;

joining the engaging portions and wiring hermetically;

joining the inner surface of the substrate frame and an outer surface of a lens holder of the image pick-up unit hermetically;

engaging cable signal lines inserted into the cable holder with a plurality of second engaging portions in the substrate from an opposite direction to the direction in which the plurality of first engaging portions are engaged with the substrate; and

joining the plurality of second engaging portions and the cable signal lines hermetically.

12. The assembly method for an image pick-up device according to claim 11, wherein the plurality of first engaging portions and plurality of second engaging portions are holes into which the wiring and the cable signal lines can be respectively inserted.

13. The assembly method for an image pick-up device according to claim 11, wherein the substrate comprises wiring patterns for electrically connecting the plurality of first engaging portions and the plurality of second engaging portions on the surface of the substrate on a side at which the cable signal lines are engaged with the substrate.

14. The assembly method for an image pick-up device according to claim 11, wherein the substrate is hermetically joined to an inner surface of the substrate frame by brazing.

15. The assembly method for an image pick-up device according to claim 11, wherein wiring is hermetically joined to the plurality of first engaging portions and the cable signal lines are hermetically joined to the plurality of second engaging portions by brazing.

16. An assembly method for an image pick-up device comprising an image pick-up unit for capturing an optical image obtained from incident light and outputting an image signal of the optical image, comprising the steps of:

engaging cable signal lines inserted into a cable holder with a plurality of first engaging portions provided on a substrate formed of a transparent member;

joining the engaging portions and cable signal lines hermetically;

disposing the substrate on a rear end of a substrate frame such that one surface thereof is substantially orthogonal to an axial direction of the substrate frame, and hermetically joining an inner surface of the substrate frame and an outer surface of the substrate;

engaging wiring of a solid-state image pick-up device provided in the image pick-up unit, which extends in an opposite direction to the direction in which the incident light enters, with a plurality of second engaging portions provided in the substrate while performing position alignment visually;

joining the plurality of second engaging portions and wiring hermetically; and

joining the inner peripheral surface of the substrate frame and an outer surface of a lens holder of the image pick-up unit hermetically.

17. The assembly method for an image pick-up device according to claim 16, wherein the plurality of first engaging portions and plurality of second engaging portions are holes into which the wiring and the cable signal lines can be respectively inserted.

18. The assembly method for an image pick-up device according to claim 16, wherein the substrate comprises wiring patterns for electrically connecting the plurality of first engaging portions and plurality of second engaging portions on the surface of the substrate on the side at which the cable signal lines are engaged with the substrate.

19. The assembly method for an image pick-up device according to claim 16, wherein the substrate is hermetically joined to the inner surface of the substrate frame by brazing.

20. The assembly method for an image pick-up device according to claim 16, wherein wiring is hermetically joined to the plurality of first engaging portions and the cable signal lines are hermetically joined to the plurality of second engaging portions by brazing.