Thin-film photoelectric conversion device and a method of manufacturing the same
First Claim
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1. A method of manufacturing a semiconductor device comprising:
- providing a semiconductor film on an insulating surface;
providing said semiconductor film with a catalyst metal-containing material;
crystallizing said semiconductor film by heating in a way that causes said catalyst metal to diffuse through the semiconductor film and function to promote the crystallization of the semiconductor film;
forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; and
heating said semiconductor film and said gettering layer in order to getter the catalyst metal in said semiconductor film using said gettering layer.
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Abstract
A method of manufacturing a thin-film solar cell, comprising the steps of: forming an amorphous silicon film on a substrate; placing a metal element that accelerates the crystallization of silicon in contact with the surface of the amorphous silicon film; subjecting the amorphous silicon film to a heat treatment to obtain a crystalline silicon film; depositing a silicon film to which phosphorus has been added in contact with the crystalline silicon film; and subjecting the crystalline silicon film and the silicon film to which phosphorus has been added to a heat treatment to getter the metal element from the crystalline film.
97 Citations
67 Claims
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1. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film on an insulating surface; providing said semiconductor film with a catalyst metal-containing material; crystallizing said semiconductor film by heating in a way that causes said catalyst metal to diffuse through the semiconductor film and function to promote the crystallization of the semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; and heating said semiconductor film and said gettering layer in order to getter the catalyst metal in said semiconductor film using said gettering layer. - View Dependent Claims (2, 3, 4, 5, 6, 54, 55, 56, 57, 58, 63, 66)
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7. A method of manufacturing a semiconductor device comprising:
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providing a substantially intrinsic semiconductor film on an insulating surface; providing said semiconductor film with a catalyst metal-containing material; crystallizing said semiconductor film by heating in a way that causes said catalyst metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; and heating said semiconductor film and said gettering layer in order to getter the catalyst metal in said semiconductor film by said gettering layer. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film on an insulating surface; providing a catalyst metal-containing material on said semiconductor film; crystallizing said semiconductor film by heating in a way that causes said catalyst metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; and heating said semiconductor film and said gettering layer in a nitrogen atmosphere in order to getter the catalyst metal contained in said semiconductor film by said gettering layer. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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22. A method of manufacturing a semiconductor device having a junction, said method comprising:
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providing a semiconductor film comprising amorphous silicon on an insulating surface; providing a catalyst metal-containing material on said semiconductor film; crystallizing said semiconductor film by heating in a way that causes said metal to diffuse through the semiconductor film and to promote the crystallization thereof; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; heating said semiconductor film and said gettering layer at a temperature from 500°
C. to 800°
C. in order to getter the metal included in said semiconductor film by said gettering layer; andforming a doped semiconductor film on said semiconductor film to form a junction. - View Dependent Claims (23, 24, 25, 26, 27)
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28. A method of manufacturing a semiconductor device having a junction, said method comprising:
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providing a substantially intrinsic semiconductor film on an insulating surface; providing a catalyst metal on said semiconductor film; crystallizing said semiconductor film by heating to cause said catalyst metal to diffuse through the semiconductor film and to promote the crystallization of said semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization thereof; heating said semiconductor film and said gettering layer in order to getter the catalyst metal in said semiconductor film by said gettering layer; and forming a junction using said intrinsic semiconductor film. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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35. A method of manufacturing a semiconductor device having a junction, said method comprising:
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providing a semiconductor film comprising amorphous silicon formed on an insulating surface; providing a catalyst metal-containing material on said semiconductor film; crystallizing said semiconductor film by heating in a way that causes said catalyst metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; and heating said semiconductor film and said gettering layer in a nitrogen atmosphere in order to getter the catalyst metal contained in said semiconductor film by said gettering layer; and forming a junction on said semiconductor film. - View Dependent Claims (36, 37, 38, 39, 40, 41)
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42. A method of manufacturing a semiconductor device, comprising:
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providing a semiconductor film on an insulating surface; forming a catalyst metal-containing material on said semiconductor film, said catalyst being a material which facilitates crystallization of said semiconductor film, but which when present in a final product of the semiconductor device degrades operation of the semiconductor device; crystallizing said semiconductor film by heating in a way that causes said catalyst metal-containing material to diffuse into at least a part of the semiconductor film, said catalyst metal-containing material when so diffused functioning to facilitate said crystallization; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after said crystallization; and processing said semiconductor film and said gettering layer to reduce the concentration of said catalyst metal in said semiconductor film. - View Dependent Claims (43, 44)
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45. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film on an insulating surface; providing said semiconductor film with a metal-containing material; crystallizing said semiconductor film by heating in a way that causes said metal to diffuse through the semiconductor film and function to promote the crystallization of the semiconductor film; introducing a gettering material into a surface of said crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;heating said semiconductor film after introducing said gettering material in order to getter the metal in said semiconductor film; and removing at least said surface after gettering the metal in said semiconductor film. - View Dependent Claims (60, 61, 62, 64, 65, 67)
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46. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film doped with boron at a concentration of 0.001–
0.1 atm % on an insulating surface;providing said semiconductor film with a metal-containing material; crystallizing said semiconductor film by heating in a way that causes said metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization; and heating said semiconductor film and said gettering layer in order to getter the metal in said semiconductor film by said gettering layer. - View Dependent Claims (59)
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47. A method of manufacturing a semiconductor device comprising:
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providing a substantially intrinsic semiconductor film on an insulating surface; providing said semiconductor film with a metal-containing material; crystallizing said semiconductor film by heating in a way that causes said metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; introducing a gettering material into a surface of the crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;heating said semiconductor film after introducing said gettering material in order to getter the metal in said semiconductor film; and removing at least said surface after gettering the metal in said semiconductor film.
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48. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film doped with boron at a concentration of 0.001–
0.1 atm % on an insulating surface;providing said semiconductor film with a metal-containing material; crystallizing said semiconductor film by heating in a way that causes said metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; introducing a gettering material into a surface of the crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;heating said semiconductor film after introducing said gettering material in order to getter the metal in said semiconductor film; and removing at least said surface after gettering the metal in said semiconductor film.
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49. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film on an insulating surface; providing a metal-containing material on said semiconductor film; crystallizing said semiconductor film by heating in a way that causes said metal to diffuse through the semiconductor film and function to promote the crystallization of said semiconductor film; introducing a gettering material into a surface of the crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;heating said semiconductor film in a nitrogen atmosphere after introducing said gettering material in order to getter the metal contained in said semiconductor film; and removing at least said surface after gettering the metal in said semiconductor film.
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50. A method of manufacturing a semiconductor device having a junction, said method comprising:
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providing a semiconductor film doped with boron at a concentration of 0.001–
0.1 atm % on an insulating surface;providing a metal on said semiconductor film; crystallizing said semiconductor film by heating to cause said metal to diffuse through the semiconductor film and to promote the crystallization of said semiconductor film; forming a gettering layer comprising phosphorus silicate glass over an entire surface of said semiconductor film after the crystallization thereof, heating said semiconductor film and said gettering layer in order to getter the metal in said semiconductor film by said gettering layer; and forming a junction using an intrinsic semiconductor film.
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51. A method of manufacturing a semiconductor device having a junction, said method comprising:
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providing a substantially intrinsic semiconductor film on an insulating surface; providing a metal on said semiconductor film; crystallizing said semiconductor film by heating to cause said metal to diffuse through the semiconductor film and to promote the crystallization of said semiconductor film; introducing a gettering material into a surface of the crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;heating said semiconductor film after introducing said gettering material in order to getter the metal in said semiconductor film by said phosphorus; removing at least said surface after gettering the metal in said semiconductor film; and forming a junction using a doped semiconductor film.
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52. A method of manufacturing a semiconductor device having a junction, said method comprising:
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providing a semiconductor film doped with boron at a concentration of 0.001–
0.1 atm % on an insulating surface;providing a metal on said semiconductor film; crystallizing said semiconductor film by heating to cause said metal to diffuse through the semiconductor film and to promote the crystallization of said semiconductor film; introducing a gettering material into a surface of the crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;heating said semiconductor film and said gettering material in order to getter the metal in said semiconductor film; removing at least said surface after gettering the metal in said semiconductor film; and forming a junction using an intrinsic semiconductor film.
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53. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor film on an insulating surface; forming a metal-containing material on said semiconductor film, said metal being a material which facilitates crystallization of said semiconductor film, but which when present in a final product of the semiconductor device degrades operation of the semiconductor device; crystallizing said semiconductor film by heating in a way that causes said metal-containing material to diffuse into at least a part of the semiconductor film, said metal-containing material when so diffused functioning to facilitate said crystallization; introducing a gettering material into a surface of the crystallized semiconductor film within a region of 0.1 to 0.2 μ
m in depth from the surface of the crystallized semiconductor film;processing said semiconductor film after introducing said gettering material to reduce the concentration of said metal in said semiconductor film; and removing at least said surface of the crystallized semiconductor film after gettering the metal in said semiconductor film.
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Specification