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Systems and methods for providing a dynamically modular processing unit

  • US 7,075,784 B2
  • Filed: 10/22/2003
  • Issued: 07/11/2006
  • Est. Priority Date: 10/22/2002
  • Status: Active Grant
First Claim
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1. A dynamically modular processing unit comprising:

  • a first non-peripheral based encasement;

    a first processor coupled to a first optimized circuit board that includes a first bus system, wherein the first optimized circuit board is a tri-board electrical printed circuit board configuration removably secured within the first non-peripheral based encasement; and

    a first interchangeable back plane coupled to the first non-peripheral based encasement, wherein the first interchangeable back plane provides flexibility and support to peripherals and applications, and wherein the dynamically modular processing unit is configured to provide processing versatility through selective coupling to one or more other dynamically modular processing units in an enterprise, wherein all of the dynamically modular processing units are interconnected at the system bus level.

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