Cooling device for diode pumped laser

• US 7,075,959 B1
• Filed: 11/14/2003
• Issued: 07/11/2006
• Est. Priority Date: 11/14/2003
• Status: Active Grant

• Current Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Lindsay-Jones, Eric Michael, Downing, Robert Scott
• Primary Examiner(s): Harvey, Minsun
• Assistant Examiner(s): Nguyen, Tuan N.
• Application Number:
  US10/713,470
• Time in Patent Office: 970 Days
• Field of Search: 372/35, 372/34, 165/80.4, 165/104.33, 165/167, 429/35
• US Class Current: 372/35
• CPC Class Codes: F28F 3/086 having one or more openings therein forming tubular heat-exchange passages
• CPC Class Codes: H01S 3/0407 Liquid cooling, e.g. by water
• CPC Class Codes: H01S 3/042 for solid state lasers H01S3/0401 takes precedence
• CPC Class Codes: H01S 3/0604 in the form of a plate or disc

Abstract

A cooling device for a diode pumped laser slab includes a plurality of stacked sapphire layers that partially absorb stray fluorescent light that is emitted from the laser slab. The layers include a plurality of fluid orifices and fluid channels that define a fluid pathway for a coolant medium. The coolant medium and sapphire layers cooperate to maintain the temperature of the laser slab below a predetermined temperature level.

Claims

1. A cooling device comprising:

a heat producing source that emits fluorescent energy;

at least one layer of fluorescent energy absorbing material positioned adjacent to said heat producing source and comprising a plurality of stacked layers of fluorescent energy absorbing material with each layer including a plurality of fluid orifices and fluid channels that cooperate with each other to define a fluid flow pathway for said coolant medium through said stacked layers to form an impingement cooling device, wherein said at least one layer of fluorescent energy absorbing material includes at least one storage channel having a thermal energy storage material disposed therein; and

a coolant medium in fluid contact with said at least one layer of fluorescent energy absorbing material wherein said at least one layer of fluorescent energy absorbing material and said coolant medium cooperate to maintain a temperature level of said heat producing source below a predetermined level.

2. The cooling device as recited in claim 1, wherein said at least one layer of fluorescent energy absorbing material comprises sapphire.

3. The cooling device as recited in claim 1, wherein said at least one layer of fluorescent energy absorbing material includes at least one textured surface for diffusing fluorescent light.

4. The cooling device as recited in claim 1, wherein said at least one layer of fluorescent energy absorbing material comprises a coating for diffusing fluorescent light.

5. The cooling device as recited in claim 1, wherein said heat producing source comprises a diode pumped laser slab.

6. The cooling device recited in claim 1, wherein said thermal energy storage material comprises at least one of a phase change material and a room temperature vulcanizing elastomer, said room temperature vulcanizing elastomer including a filler, and wherein said filler includes at least one of beryllium oxide and aluminum oxide.

7. The cooling device recited in claim 1, wherein said at least one storage channel comprises at least a first and second storage channels with each of said first and second storage channels having a thermal energy storage material disposed therein, wherein said first and second storage channels are non-colinear.

8. The cooling device recited in claim 7, wherein said first and second storage channels are formed in different layers of said plurality of stacked layers and are offset from each other relative to said heat producing source.

9. The cooling device recited in claim 7, wherein said first and second storage channels are formed in the same layer of said plurality of stacked layers.

10. A method for cooling a heat producing source comprising the steps of:

(a) positioning at least one layer of fluorescent energy absorbing material adjacent to a heat producing source, forming an impingement cooling device by positioning a plurality of stacked layers of fluorescent energy absorbing material adjacent to the heat producing source, and forming a plurality of fluid orifices and fluid channels in each layer that cooperate to define a fluid pathway for a coolant medium;

(b) absorbing emitted fluorescent energy from the heat producing source with the at least one layer of fluorescent energy absorbing material;

(c) cooling the fluorescent energy absorbing material with the coolant medium; and

(d) forming at least one storage channel in the at least one layer of fluorescent energy absorbing material and depositing a thermal energy storage material within the storage channel.

11. The method for cooling a heat producing source as recited in claim 10, wherein the fluorescent energy absorbing material comprises sapphire.

12. The method for cooling a heat producing source as recited in claim 10, including the steps of forming at least one textured surface on the at least one layer of fluorescent energy absorbing material, and diffusing fluorescent light with the at least one textured surface.

13. The method for cooling a heat producing source as recited in claim 10, including the steps of depositing a coating on the at least one layer of fluorescent energy absorbing material, and diffusing fluorescent light with the coating.

14. The method for cooling a heat producing source as recited in claim 10, wherein the heat producing source comprises a diode pumped laser slab.

15. The method for cooling a heat producing source as recited in claim 10, wherein the thermal energy storage material comprises a room temperature vulcanizing elastomer including a filler that includes at least one of beryllium oxide and aluminum oxide.

16. The method for cooling a heat producing source as recited in claim 10, including the steps of forming non-colinear first and second storage channels in the plurality of stacked layers and depositing a thermal energy storage material within the first and second storage channels.

17. The cooling device recited in claim 16, including the step of forming the first and second storage channels in the same layer.

18. The cooling device recited in claim 16, including the steps of forming the first and second storage channels in different layers and offsetting the first and second storage channels relative to the heat producing source.