Semiconductor laser apparatus and production method thereof

• US 7,075,960 B2
• Filed: 01/09/2004
• Issued: 07/11/2006
• Est. Priority Date: 01/10/2003
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Kohara, Naoki, Iwamoto, Nobuyuki, Takamori, Akira, Matsuda, Toshio
• Primary Examiner(s): Rodriguez, Armando
• Assistant Examiner(s): Nguyen, Dung (Michael) T.
• Application Number:
  US10/753,953
• Publication Number:
  US 20040161002A1
• Time in Patent Office: 914 Days
• Field of Search: 372/36
• US Class Current: 372/36
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01S 5/005 Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/0071 for beam steering, e.g. using a mirror outside the cavity to change the beam direction
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
• CPC Class Codes: H01S 5/02476 Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Abstract

A semiconductor blue-light-laser apparatus for emitting laser beams with high positional accuracy, which is achieved by mounting a semiconductor laser element on a semiconductor substrate with high accuracy and reliability, and a production method of the apparatus. A recess in a surface of the substrate has a p-type layer 100, which is coated with the SiN layer 105, Ti layers 110a and 110b, Au layers 111a and 111b, heat sink layer 113, and solder layer 114. Semiconductor laser element 10 is placed and fixed on Au layer 111b. Heat sink layer 113 is inserted between Au layer 111a and Ti layer 110b and is approximately 20 μm thick. Reflection unit 50 for reflecting laser beams LB includes at the surface thereof Al layer 116 and dielectric layer 117 as a reflection layer that provides a high refractive index for blue light laser beams.

Claims

1. A semiconductor laser apparatus comprising:

a semiconductor substrate whose main surface has a recess, a side wall of the recess having an optical reflector that receives a laser beam and reflects the received laser beam outward in a substrate-thickness direction;

a semiconductor laser element that is deposited in the recess and emits the laser beam toward the optical reflector in a direction substantially parallel to the main surface of the semiconductor substrate;

a heat sink layer that is formed in a bottom face of the recess so as to adjust a position of the semiconductor laser element in the substrate-thickness direction and to let heat, which is generated as the semiconductor laser element operates, escape toward the semiconductor substrate;

a bonding layer formed in contact with a surface, which faces the bottom face of the recess, of the semiconductor laser element; and

a diffusion preventing layer that is embedded between the heat sink layer and the bonding layer, possesses electrical conductivity, and prevents a diffusion from occurring between the heat sink layer and the bonding layer.

2. The semiconductor laser apparatus of claim 1, wherein

the diffusion preventing layer is composed of one or more elements that do not form an alloy phase by reacting with the heat sink layer or the bonding layer, and have an ohmic characteristic electrically.

3. The semiconductor laser apparatus of claim 2, wherein

the bonding layer is composed of solder,

the heat sink layer is composed of Au, and

the diffusion preventing layer is composed of Ti or TiW and is thinner than the heat sink layer.

4. The semiconductor laser apparatus of claim 3, wherein

a metal thin layer composed of Au or Pt is inserted between the bonding layer and the diffusion preventing layer.

5. The semiconductor laser apparatus of claim 3, wherein

a layer composed of Ti or TiW and a metal thin layer composed of Au or Pt are inserted between the bottom face of the recess and the heat sink layer.

6. The semiconductor laser apparatus of claim 5, wherein

the metal thin layer is thinner than the heat sink layer.

7. The semiconductor laser apparatus of claim 3, wherein

the optical reflector is surfaced with a metal thin layer composed of Au or Pt and has a slant of substantially 45 degrees with respect to the main surface of the semiconductor substrate.

8. The semiconductor laser apparatus of claim 7, wherein

the metal thin layer in the surface of the optical reflector is grounded.

9. The semiconductor laser apparatus of claim 3, wherein

the optical reflector is a stack of layers including a metal thin layer as a bottom layer composed of Au or Pt, a layer composed of Al, and a dielectric layer as a top layer, a surface of the dielectric layer having a slant of substantially 45 degrees with respect to the main surface of the semiconductor substrate.

10. The semiconductor laser apparatus of claim 9, wherein

the metal thin layer in the surface of the optical reflector is grounded.

11. The semiconductor laser apparatus of claim 3, wherein

the semiconductor substrate has, at areas near the recess, a photodetector element unit for receiving laser beams, a signal processing circuit unit for processing an electric signal generated by the photodetector element unit, and a bonding pad unit via which signals are input or output from or to outside the semiconductor laser apparatus, and

an outermost surface of the semiconductor substrate at an area in which the signal processing circuit unit and the bonding pad unit are formed is covered with a metal thin layer composed of Au or Pt.

12. The semiconductor laser apparatus of claim 11, wherein

the metal thin layer covering the area in which the signal processing circuit unit and the bonding pad unit are formed is connected to an external terminal so that a given voltage can be applied via the external terminal from outside the semiconductor laser apparatus.

13. An optical pickup apparatus having the semiconductor laser apparatus of claim 1.