Pad assembly for electrochemical mechanical processing

• US 7,077,721 B2
• Filed: 12/03/2003
• Issued: 07/18/2006
• Est. Priority Date: 02/17/2000
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Chen, Liang-Yuh, Tsai, Stan D., Wang, Yan, Liu, Feng Q., Hu, Yongqi, Chang, Shou-Sung
• Primary Examiner(s): Thomas, David B.
• Application Number:
  US10/727,724
• Publication Number:
  US 20040121708A1
• Time in Patent Office: 958 Days
• Field of Search: 451/5, 451526-539, 204/224.M, 205/103, 205/663
• US Class Current: 451/5
• CPC Class Codes: B23H 5/06 Electrochemical machining combined with mechanical working, e.g. grinding or honing
• CPC Class Codes: B23H 5/08 Electrolytic grinding
• CPC Class Codes: B23H 5/10 Electrodes specially adapted therefor or their manufacture B23H1/04, B23H3/04 take precedence
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 37/046 using electric current
• CPC Class Codes: B24B 37/22 characterised by a multi-layered structure
• CPC Class Codes: B24B 37/24 characterised by the composition or properties of the pad materials
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: C25D 17/14 for pad-plating
• CPC Class Codes: H01L 21/32125 by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing, e.g. ECMP

Abstract

Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.

Claims

1. A processing pad assembly, comprising:

an upper layer having a central aperture and a processing surface; and

an electrode having a top side coupled to the upper layer and a bottom side opposite the top side, wherein a first set of holes is formed through the upper layer for exposing the electrode to the processing surface.

2. The processing pad assembly of claim 1, wherein the electrode is fabricated from a corrosion resistant conductive metal.

3. The processing pad assembly of claim 2, wherein the corrosion resistant conductive metal is Sn, Ni, Ti, or Au.

4. The processing pad assembly of claim 1, wherein the electrode is fabricated from a conductive metal coated with a corrosion resistant conductive metal.

5. The processing pad assembly of claim 4, wherein the corrosion resistant conductive metal is Sn, Ni, Ti, or Au.

6. The processing pad assembly of claim 1, wherein the electrode is fabricated from a corrosion-resistant conductive alloy.

7. The processing pad assembly of claim 6, wherein the corrosion-resistant conductive alloy is bronze, brass, stainless steel, or a palladium-tin alloy.

8. The processing pad assembly of claim 1, wherein the electrode is fabricated from a metal-coated fabric.

9. The processing pad assembly of claim 1, wherein the electrode is fabricated from a polymer matrix with a conductive filler.

10. The processing pad assembly of claim 2, wherein the electrode is a solid sheet.

11. The processing pad assembly of claim 2, wherein the electrode is a metal screen.

12. The processing pad assembly of claim 2, wherein the electrode is a perforated sheet.

13. The processing pad assembly of claim 2, wherein the electrode is primed with an adhesion promoter on a side facing the upper layer.

14. The processing pad assembly of claim 13, wherein the adhesion promoter is conductive.

15. The processing pad assembly of claim 1, wherein the electrode is permeable.

16. The processing pad assembly of claim 15, wherein a polymer layer is applied to the bottom side of the electrode.

17. The processing pad assembly of claim 16, wherein the polymer layer penetrates through the electrode and is at least partially exposed on the top side of the electrode.

18. The processing pad assembly of claim 16, wherein the polymer layer has a strong interaction with an adhesive used to couple the top side of the electrode to the upper layer.

19. The processing pad assembly of claim 1, wherein the electrode is coupled to the upper layer by an adhesive.

20. The processing pad assembly of claim 19, wherein the adhesive is chemically resistant to the electrolyte.

21. The processing pad assembly of claim 1, wherein the upper layer is conductive.

22. The processing pad assembly of claim 1, wherein the upper layer is nonconductive.

23. The processing pad assembly of claim 22, wherein the upper layer is fabricated from polyurethane.

24. The processing pad assembly of claim 1, wherein the electrode further comprises a plurality of independently biasable electrical zones.

25. The processing pad assembly of claim 24, wherein the electrical zones further comprises concentric rings.

26. The processing pad assembly of claim 1, further comprising a subpad disposed between the electrode and the upper layer.

27. The processing pad assembly of claim 1, wherein the electrode further comprises:

a first conductive zone; and

at least a second conductive zone.

28. The processing pad assembly of claim 27, wherein the electrode further comprises:

a first conductive element comprising the first conductive zone;

a second conductive element circumscribing the first conductive element comprising a second conductive zone; and

a third conductive element circumscribing the second conductive element comprising a third conductive zone.

29. The processing pad assembly of claim 1, wherein the central aperture extends through the electrode.

30. A processing pad assembly, comprising:

a conductive upper layer having a processing surface; and

a corrosion resistant conductive metallic lower layer having a top side coupled to the conductive upper layer and a bottom side opposite the top side, the lower layer having a plurality of laterally separated, independently electrically biasable zones, wherein a first set of holes is formed through the conductive upper layer for exposing the electrode to the processing surface.

31. The processing pad assembly of claim 30, wherein the conductive upper layer and the lower layer includes at least one aperture formed therethrough.