Pad assembly for electrochemical mechanical processing
First Claim
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1. A processing pad assembly, comprising:
- an upper layer having a central aperture and a processing surface; and
an electrode having a top side coupled to the upper layer and a bottom side opposite the top side, wherein a first set of holes is formed through the upper layer for exposing the electrode to the processing surface.
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Abstract
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
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Citations
31 Claims
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1. A processing pad assembly, comprising:
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an upper layer having a central aperture and a processing surface; and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side, wherein a first set of holes is formed through the upper layer for exposing the electrode to the processing surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A processing pad assembly, comprising:
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a conductive upper layer having a processing surface; and a corrosion resistant conductive metallic lower layer having a top side coupled to the conductive upper layer and a bottom side opposite the top side, the lower layer having a plurality of laterally separated, independently electrically biasable zones, wherein a first set of holes is formed through the conductive upper layer for exposing the electrode to the processing surface. - View Dependent Claims (31)
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Specification