×

Pad assembly for electrochemical mechanical processing

  • US 7,077,721 B2
  • Filed: 12/03/2003
  • Issued: 07/18/2006
  • Est. Priority Date: 02/17/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A processing pad assembly, comprising:

  • an upper layer having a central aperture and a processing surface; and

    an electrode having a top side coupled to the upper layer and a bottom side opposite the top side, wherein a first set of holes is formed through the upper layer for exposing the electrode to the processing surface.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×