×

Miniature microdevice package and process for making thereof

  • US 7,077,969 B2
  • Filed: 11/25/2002
  • Issued: 07/18/2006
  • Est. Priority Date: 06/28/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. A process for making a miniature microdevice package, comprising steps of:

  • (a) shaping a spacer in a miniature frame substrate made of a material selected from the group consisting of;

    ceramic, metal and a combination of ceramic and metal;

    (b) providing a semiconductor microdevice die having a microdevice substrate, a semiconductor microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice; and

    (c) mounting the microdevice die on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×