Miniature microdevice package and process for making thereof

• US 7,077,969 B2
• Filed: 11/25/2002
• Issued: 07/18/2006
• Est. Priority Date: 06/28/2000
• Status: Expired due to Term

• Current Assignee: Institut national d'optique
• Original Assignee: Institut national d'optique
• Inventors: Jerominek, Hubert, Alain, Christine
• Primary Examiner(s): Norton, Nadine G.
• Assistant Examiner(s): Tran, Binh X.
• Application Number:
  US10/304,172
• Publication Number:
  US 20030111441A1
• Time in Patent Office: 1,331 Days
• Field of Search: 216/13, 216/17, 216/20, 257/680, 257/703, 257/704, 438/107
• US Class Current: 216/17
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

Claims

1. A process for making a miniature microdevice package, comprising steps of:

(a) shaping a spacer in a miniature frame substrate made of a material selected from the group consisting of;

ceramic, metal and a combination of ceramic and metal;

(b) providing a semiconductor microdevice die having a microdevice substrate, a semiconductor microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice; and

(c) mounting the microdevice die on the spacer to form a chamber, the microdevice being located within the chamber, the bonding pads being located outside of the chamber.

2. A process according to claim 1, further comprising steps of:

(d) shaping the miniature frame substrate to form a channel for pumping air out of the chamber;

(e) pumping air out of the chamber through the channel to produce a vacuum within the chamber; and

(f) after step (e), hermetically sealing the channel.

3. A process according to claim 2, wherein the shaping of step (d) is performed during step (a).

4. A process according to claim 2, wherein the shaping of step (a) further comprises a step of shaping a recess in the miniature frame substrate for receiving the microdevice die.

5. A process according to claim 2, wherein the shaping of step (a) further comprises a step of shaping an opening for the chamber through the miniature frame substrate, the process further comprises, before step (e), a step of soldering a window on the miniature frame substrate for blocking the opening and allowing radiation inside the chamber.

6. A process according to claim 5, wherein the shaping of step (a) further comprises a step of shaping a recess in the miniature frame substrate for receiving the window.

7. A process for making miniature microdevice package;

comprising steps of;

(a) shaping spacers in a miniature frame substrate made of a material selected from the group consisting of;

ceramic, metal and a combination of ceramic and metal;

(b) providing semiconductor microdevice dies each having a microdevice substrate, a semiconductor microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice;

(c) mounting the microdevice dies respectively on the spacers to form chambers, the microdevices being respectively located within the chambers, the bonding pads being located outside of the chambers; and

(d) sawing the miniature frame substrate to obtain the miniature microdevice packages.

8. A process according to claim 7, further comprising steps of:

(e) shaping the miniature frame substrate to form channels for pumping air out of the chambers;

(f) pumping air out of the chambers through the channels to produce a vacuum within the chambers; and

(g) after step (f), hermetically sealing the channels.

9. A process for making miniature microdevice packages, comprising steps of:

(a) shaping spacers in a miniature frame substrate made of a material selected from the group consisting of;

ceramic, metal and a combination of ceramic and metal;

(b) providing semiconductor microdevice dies having a common microdevice substrate, each of the microdevice dies having a semiconductor microdevice integrated on the common microdevice substrate, bonding pads integrated on the common microdevice substrate, and electrical conductors integrated in the common microdevice substrate for electrically connecting the bonding pads with the microdevice;

(c) mounting the common microdevice substrate with the microdevice dies respectively on the spacers to form chambers, the microdevices being respectively located within the chambers, the bonding pads being located outside of the chambers; and

(d) sawing the miniature frame substrate with the mounted common microdevice substrate to obtain the miniature microdevice packages.

10. A process according to claim 9, further comprising steps of:

(e) shaping the miniature frame substrate to form channels for pumping air out of the chambers;

(f) pumping air out of the chambers through the channels to produce a vacuum within the chambers; and

(g) after step (f), hermetically sealing the channels.