Stacked semiconductor die
First Claim
1. A semiconductor die comprising:
- a first semiconductor die, the first semiconductor die having an upper surface, the upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die; and
at least one adhesive flow control dam positioned between the at least one region for mounting a second semiconductor die and the at least one electrical contact, the at least one adhesive flow control dam for preventing adhesive applied in the at least one region of the first semiconductor die from contacting the at least one electrical contact during the mounting of second semiconductor die onto the at least one region, the at least one adhesive flow control dam comprising at least one of a decoupling capacitor coupon and an adhesive flow control dam configured to deform upon contact.
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Accused Products
Abstract
The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The methods and apparatus include providing a first semiconductor device with an adhesive flow control dam located on an upper surface thereof. The dam is positioned between electrical contacts and a substrate attach site on the upper surface of the first semiconductor device. The dam is rendered of a sufficient height and shape to block applied adhesive from flowing over the electrical contacts of the first semiconductor device when a second substrate is mounted onto the upper surface of the first semiconductor device. The semiconductor device package may be encapsulated with the dam in place or with the dam removed. The adhesive flow control dam thus protects the electrical contacts of the first semiconductor device from contamination by excess adhesive, which can result in unusable electrical contacts.
77 Citations
18 Claims
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1. A semiconductor die comprising:
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a first semiconductor die, the first semiconductor die having an upper surface, the upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die; and at least one adhesive flow control dam positioned between the at least one region for mounting a second semiconductor die and the at least one electrical contact, the at least one adhesive flow control dam for preventing adhesive applied in the at least one region of the first semiconductor die from contacting the at least one electrical contact during the mounting of second semiconductor die onto the at least one region, the at least one adhesive flow control dam comprising at least one of a decoupling capacitor coupon and an adhesive flow control dam configured to deform upon contact. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor die structure in a stacked semiconductor die assembly comprising:
a first semiconductor die having an upper surface including at least one electrical contact, at least one region for mounting a second semiconductor die, and at least one adhesive flow control dam located between the at least one region for mounting a second semiconductor die and the at least one electrical contact, the at least one adhesive flow control dam for preventing adhesive applied in the at least one region of the first semiconductor die from contacting the at least one electrical contact during the mounting of the second semiconductor die onto the at least one region, the at least one adhesive flow control dam comprising at least one of a decoupling capacitor coupon and an adhesive flow control dam is configured to deform upon contact. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A semiconductor die for a stacked semiconductor die assembly comprising:
a first semiconductor die having an upper surface including at least one electrical contact, at least one region for mounting a second semiconductor die, and at least one adhesive flow control dam positioned between the at least one region for mounting a second semiconductor die and the at least one electrical contact, the at least one adhesive flow control dam for preventing adhesive applied in the at least one region of the first semiconductor die from contacting the at least one electrical contact during the mounting of the second semiconductor die onto the at least one region, the at least one adhesive flow control dam comprising at least one of a decoupling capacitor coupon and a deformable dam. - View Dependent Claims (14, 15, 16, 17, 18)
Specification