Method for producing an electrical circuit

• US 7,078,304 B2
• Filed: 04/04/2005
• Issued: 07/18/2006
• Est. Priority Date: 04/26/2002
• Status: Expired due to Fees

• Current Assignee: Celis Semiconductor Corp.
• Original Assignee: Celis Semiconductor Corp.
• Inventors: DeVilbiss, Alan D., Derbenwick, Gary F.
• Primary Examiner(s): THAI, LUAN C
• Application Number:
  US11/098,738
• Publication Number:
  US 20050181537A1
• Time in Patent Office: 470 Days
• Field of Search: None
• US Class Current: 438/329
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/055 Folded back on itself

Abstract

An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at least a portion of one of conductive layers, mounting an integrated circuit (IC) between the substrates, coupling the IC to the conductive layers, and affixing the substrates together with the conductive layers between the substrates. These are either separate substrates or a unitary substrate. The IC is mounted either to a substrate, a conductive layer, or a dielectric layer. The IC is coupled to the conductive layers either directly or through openings formed in the dielectric layer. An interior conductive layer may be used to couple the IC to the conductive layers.

Claims

1. A method for forming an electrical circuit, the method comprising:

(a) forming and patterning a first conductive layer on a first substrate, wherein the pattern of the conductive layer is selected from the group consisting of an inductor coil having inner and outer terminals, a dipole antenna, and a fractal antenna;

(b) forming and patterning a second conductive layer on a second substrate;

(c) depositing a dielectric layer on at least a portion of one of the first conductive layer and the second conductive layer;

(d) mounting at least one integrated circuit (IC) between the first and second substrates;

(e) coupling each IC to at least one of the first and second conductive layers; and

(f) affixing the first and second substrates together with the first and second conductive layers between the first and second substrates.

2. The method of claim 1 wherein forming the conductive layer is selected from the group consisting of printing conductive ink on the substrate, depositing on the substrate and chemically etching a conductive layer, and stamping metal and adhering the stamped metal to the substrate.

3. The method of claim 1 wherein the first and second substrates are joined and comprise a unitary substrate.

4. The method of claim 1 wherein the first and second conductive layers comprise a unitary conductive layer.

5. The method of claim 1 wherein the first and second dielectric layers comprise a unitary dielectric layer.

6. The method of claim 1 wherein mounting each IC between the first and second substrates includes mounting each IC to at least one of the first and second dielectric layers.

7. The method of claim 1 wherein mounting each IC between the first and second substrates includes mounting each IC to at least one of the first and second conductive layers.

8. The method of claim 1 wherein mounting each IC between the first and second substrates includes mounting each IC to at least one of the first and second substrates.

9. The method of claim 1 wherein coupling each IC to at least one of the first and second conductive layers includes:

(a) forming at least one opening in at least one of the first and second dielectric layers, and

(b) coupling each IC, through the openings, to at least one of the first and second conductive layers.

10. The method of claim 1 wherein coupling each IC to at least one of the first and second conductive layers includes mounting each IC to at least one of the first and second conductive layers.

11. The method of claim 1 further including:

(a) forming an interior conductive layer, and

(b) coupling the interior conductive layer to at least one IC and at least one of the first and second conductive layers.

12. The method of claim 1 further including:

(a) forming an interior conductive layer, and

(b) coupling the interior conductive layer to the first and second conductive layers.

13. A method for forming an electrical circuit, the method comprising:

(a) a substrate having at least one fold formed therein;

(b) a conductive layer formed and patterned on a substrate, wherein the pattern of the conductive layer is selected from the group consisting of an inductor coil having inner and outer terminals, a dipole antenna, and a fractal antenna;

(c) a dielectric layer formed on at least a portion of the conductive layer;

(d) mounting at least one integrated circuit (IC) on the substrate;

(e) folding the substrate about the IC; and

(f) coupling each IC to the conductive layer.

14. The method of claim 13 wherein mounting at least one IC on the substrate includes mounting each IC to the dielectric layer.

15. The method of claim 13 wherein mounting at least one IC on the substrate includes mounting each IC to the conductive layer.

16. The method of claim 13 wherein mounting at least one IC on the substrate includes mounting each IC to the substrate.

17. The method of claim 13 wherein coupling each IC to the conductive layer includes:

(a) forming at least one opening in the dielectric layers, and

(b) coupling each IC, through the openings, to the conductive layers.

18. The method of claim 13 wherein coupling each IC to the conductive layer includes mounting each IC to the conductive layer.

19. The method of claim 13 further including:

(a) forming an interior conductive layer, and

(b) coupling the interior conductive layer to at least one IC and the conductive layer.

20. The method of claim 13 further including:

(a) forming an interior conductive layer, and

(b) coupling the interior conductive layer to the conductive layer.