Light-radiating semiconductor component with a luminescence conversion element

• US 7,078,732 B1
• Filed: 12/28/1998
• Issued: 07/18/2006
• Est. Priority Date: 06/26/1996
• Status: Expired due to Fees

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Schlotter, Peter, Schmidt, Ralf, Waitl, Günter, Schneider, Jürgen, Höhn, Klaus, Reeh, Ulrike, Stath, Norbert
• Primary Examiner(s): JACKSON JR, JEROME
• Application Number:
  US09/221,789
• Time in Patent Office: 2,759 Days
• Field of Search: 257/89, 257/98
• US Class Current: 257/98
• CPC Class Codes: C09K 11/7718 with alkaline earth metals
• CPC Class Codes: C09K 11/7746 with alkaline earth metals
• CPC Class Codes: C09K 11/7767 Chalcogenides
• CPC Class Codes: C09K 11/7769 Oxides C09K11/7768 takes precedence
• CPC Class Codes: C09K 11/7774 Aluminates
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2933/0091 : Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/501 : characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: Y02B 20/00 : Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Abstract

The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Claims

1. A white light emitting semiconductor component, comprising:

a semiconductor body having a layer sequence suitable for emitting electromagnetic radiation of a first wavelength range comprising at least blue light during an operation of the semiconductor component;

a luminescence conversion layer being disposed directly on said semiconductor body and having a substantially constant thickness and containing at least one luminescent conversion material, said luminescence conversion material being suitable for absorbing a radiation originating from the first wavelength range and emitting light in at least a portion of a second wavelength range consisting of green, yellow, and red,

a part of the blue light passing through the luminescent conversion layer from one side to another, such that the semiconductor component emits white light comprising the part of the blue light passing through the luminescent conversion layer and the light emitted in at least the portion of the second wavelength range.

2. The semiconductor component according to claim 1, wherein the radiation emitted by said semiconductor body has a luminescence intensity maximum in a blue spectral region at a wavelength between 420 nm and 460 nm.

3. The semiconductor component according to claim 1, wherein said luminescence conversion layer comprises a plurality of layers with mutually different wavelength conversion properties.

4. The semiconductor component according to claim 1, wherein said luminescence conversion layer includes organic dye molecules in a plastic matrix.

5. The semiconductor component according to claim 4, wherein said plastic matrix is formed from a plastic material selected from the group consisting of silicone, thermoplastic material, and thermosetting plastic material.

6. The semiconductor component according to claim 4, wherein said luminescence conversion element has organic dye molecules in a matrix selected from the group consisting of an epoxy resin matrix and a polymethyl methacrylate matrix.

7. The semiconductor component according to claim 1, wherein said luminescence conversion layer has at least one inorganic luminescence material selected from the phosphor group.

8. The semiconductor component according to claim 7, wherein the inorganic luminescent material is selected from the group of Ce-doped garnets.

9. The semiconductor component according to claim 8, wherein the inorganic luminescent material is YAG:

Ce.

10. The semiconductor component according to claim 7, wherein the inorganic luminescent material is embedded in an epoxy resin matrix.

11. The semiconductor component according to claim 10, wherein the inorganic luminescent material is embedded in a matrix formed of inorganic glass with a relatively low melting point.

12. The semiconductor component according to claim 10, wherein the inorganic luminescent material has a mean particle size of approximately 10 μ

m.

13. The semiconductor component according to claim 1, wherein said luminescence conversion layer is provided with a plurality of mutually different materials selected from the group consisting of organic and inorganic luminescent materials.

14. The semiconductor component according to claim 1, wherein said luminescence conversion layer includes dye molecules selected from the group consisting of organic and inorganic dye molecules partly with and partly without a wavelength conversion effect.

15. The semiconductor component according to claim 1, wherein said luminescence conversion element includes light-diffusing particles.

16. The semiconductor component according to claim 1, which comprises a transparent encapsulation with light-diffusing particles.

17. The semiconductor component according to claim 1, wherein said luminescence conversion layer comprises at least one luminescent 4f-organometallic compound.

18. The semiconductor component according to claim 1, wherein said luminescence conversion layer includes a luminescent material that is luminescent in a blue region.

19. The semiconductor component according to claim 1, which comprises a transparent encapsulation with a luminescent material that is luminescent in a blue region.

20. A full-color LED display device, comprising a plurality of the light-radiating semiconductor components of claim 1, arranged in a full-color LED display.

21. In an interior lighting of an aircraft cabin, a plurality of the light-radiating semiconductor components according to claim 1.

22. In combination with a display device, a plurality of the semiconductor components according to claim 1, disposed to illuminate a display of the display device.

23. The combination according to claim 22, wherein said display device includes a liquid crystal display.

24. The semiconductor component according to claim 1 further comprising transparent resin above said luminescense conversion layer.

25. The semiconductor component according to claim 7, wherein the inorganic luminescent material is selected from the group of Ce-doped garnets.

26. The semiconductor component according to claim 7, wherein the inorganic luminescent material is YAG:

Ce.

27. The semiconductor component according to claim 1, wherein said luminescence conversion layer has at least one inorganic luminescence material selected from the phosphor group, and wherein the inorganic luminescent material is embedded in an epoxy resin matrix.

28. The semiconductor component according to claim 1, wherein said luminescence conversion layer has at least one inorganic luminescence material selected from the phosphor group, and wherein the inorganic luminescent material is embedded in a matrix formed of inorganic glass with a relatively low melting point.

29. The semiconductor component according to claim 1, wherein said luminescence conversion layer has at least one inorganic luminescence material selected from the phosphor group, and wherein the inorganic luminescent material is embedded in an epoxy resin matrix, and wherein the inorganic luminescent material has a mean particle size of approximately 10 μ

m.

30. The semiconductor component according to claim 1, wherein the radiation emitted by said semiconductor body has a luminescence intensity maximum at a wavelength below 520 nm.

31. The semiconductor component according to claim 1, wherein said semiconductor body is adapted to emit ultraviolet radiation during operation of the semiconductor component, and said luminescence conversion layer converts at least a portion of the ultraviolet radiation into the second wavelength range.

32. The semiconductor component according to claim 1, wherein the luminescence conversion material is suitable for absorbing the radiation originating in the first wavelength and emitting yellow light, and wherein during operation the semiconductor component emits white light comprising the part of the blue light passing through the luminescent conversion layer and the yellow light.

33. The semiconductor component according to claim 1, wherein the luminescence conversion material is suitable for absorbing the radiation originating in the first wavelength and emitting green light and red light, and wherein during operation the semiconductor component emits white light comprising the part of the blue light passing through the luminescent conversion layer, the green light, and the red light.