Integrated photonic circuits with vertical connections
First Claim
1. An integrated photonic device comprising:
- a substrate;
a photonic circuit etched onto said substrate;
a cladding layer positioned on said substrate, said cladding layer having a refractive index different from said circuit; and
an angled implantation disposed in said cladding layer, said angled implantation optically connecting said photonic circuit with an outer surface of said cladding layer, wherein said angled implantation forms an angle of about 50 degrees or less with said substrate.
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Abstract
An integrated photonic device having a vertical optical connection between vertically oriented waveguides and a process for making the same is disclosed. A first waveguide is patterned and etched onto an underlying substrate. A cladding layer is placed over the waveguide and substrate. The cladding layer is coated with a photoresist, and then patterned with holes that are slightly offset from the underlying waveguide. The holes are implanted with nitrogen doses at an angle. The nitrogen doses form an angled implantation of SiON. The material change and accompanying index of refraction change due to the angled implantation optically couples the underlying waveguide with an outside surface of the cladding layer. A second waveguide or circuit can then be patterned on the outer surface of the cladding and connected to the angled implantation and underlying waveguide. Multiple layers of waveguides or circuitry can be connected to each other in this manner.
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Citations
16 Claims
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1. An integrated photonic device comprising:
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a substrate; a photonic circuit etched onto said substrate; a cladding layer positioned on said substrate, said cladding layer having a refractive index different from said circuit; and an angled implantation disposed in said cladding layer, said angled implantation optically connecting said photonic circuit with an outer surface of said cladding layer, wherein said angled implantation forms an angle of about 50 degrees or less with said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An integrated photonic circuit comprising:
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a substrate; a photonic waveguide etched onto said substrate; a cladding layer vertically disposed on said waveguide and substrate, said cladding layer having a refractive index different from said waveguide; and means to optically connect said photonic waveguide with an outer surface of said cladding layer, wherein said means to connect said photonic waveguide with said outer surface forms an angle of about 50 degrees or less with said substrate. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification