×

Integrated photonic circuits with vertical connections

  • US 7,079,716 B2
  • Filed: 06/26/2003
  • Issued: 07/18/2006
  • Est. Priority Date: 06/26/2003
  • Status: Active Grant
First Claim
Patent Images

1. An integrated photonic device comprising:

  • a substrate;

    a photonic circuit etched onto said substrate;

    a cladding layer positioned on said substrate, said cladding layer having a refractive index different from said circuit; and

    an angled implantation disposed in said cladding layer, said angled implantation optically connecting said photonic circuit with an outer surface of said cladding layer, wherein said angled implantation forms an angle of about 50 degrees or less with said substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×