Wiring board and method of fabricating tape-like wiring substrate
First Claim
Patent Images
1. A wiring board comprising:
- a substrate;
a plurality of interconnecting patterns arranged in matrix on the substrate; and
a plurality of positioning marks formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns, each of the positioning marks has a V-shape which is symmetrical with respect to the straight line,a plating lead electrically connected to the interconnecting patterns, wherein, the plating lead includes sections intersecting the straight line; and
part of the sections of the plating lead intersecting the straight line form the positioning marks.
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Accused Products
Abstract
A substrate supporting a plurality of interconnecting patterns arranged in matrix is cut at a position at least between adjacent columns of the interconnecting patterns. A plurality of positioning marks are formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns. Cutting of the substrate is performed by using the positioning marks as reference.
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Citations
8 Claims
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1. A wiring board comprising:
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a substrate; a plurality of interconnecting patterns arranged in matrix on the substrate; and a plurality of positioning marks formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns, each of the positioning marks has a V-shape which is symmetrical with respect to the straight line, a plating lead electrically connected to the interconnecting patterns, wherein, the plating lead includes sections intersecting the straight line; and
part of the sections of the plating lead intersecting the straight line form the positioning marks. - View Dependent Claims (2, 3, 4)
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5. A wiring board comprising:
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a substrate; a plurality of interconnecting patterns arranged in matrix on the substrate and a plating lead electrically connected to the interconnecting patterns, the plating lead including first portions to form a plurality of positioning marks, the positioning marks formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns, the plating lead including second portions extending contiguously from the positioning marks in a width direction of the substrate, wherein no lead extends contiguously from the positioning marks in a length direction of the substrate, wherein, each of the positioning marks has a V-shape which is symmetrical with respect to the straight line. - View Dependent Claims (6, 7, 8)
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Specification