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Wiring board and method of fabricating tape-like wiring substrate

  • US 7,081,590 B2
  • Filed: 02/19/2003
  • Issued: 07/25/2006
  • Est. Priority Date: 02/27/2002
  • Status: Expired due to Fees
First Claim
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1. A wiring board comprising:

  • a substrate;

    a plurality of interconnecting patterns arranged in matrix on the substrate; and

    a plurality of positioning marks formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns, each of the positioning marks has a V-shape which is symmetrical with respect to the straight line,a plating lead electrically connected to the interconnecting patterns, wherein, the plating lead includes sections intersecting the straight line; and

    part of the sections of the plating lead intersecting the straight line form the positioning marks.

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