High-frequency module and method for manufacturing the same

• US 7,081,661 B2
• Filed: 03/13/2002
• Issued: 07/25/2006
• Est. Priority Date: 03/16/2001
• Status: Expired due to Term

• Current Assignee: Panasonic Semiconductor Solutions Co., Ltd. (Winbond Electronics Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Takehara, Hideki, Kanazawa, Kunihiko, Yoshikawa, Noriyuki
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): Im, Junghwa
• Application Number:
  US10/098,895
• Publication Number:
  US 20020153582A1
• Time in Patent Office: 1,595 Days
• Field of Search: 257/434, 257/690, 257/698, 257/787, 257/693, 257/730, 257/728, 257/664, 257/666, 257/659, 257/703, 257/678, 257/790, 257/675, 257/684, 257/708, 257/699, 257/172.8, 257/443, 257/701, 257/704, 257/707, 257/729
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15159 : Side view
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/09918 : Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence

Abstract

In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.

Claims

1. A high-frequency module comprising:

a substrate;

a high-frequency circuit that is mounted on a surface of the substrate and comprises a high-frequency semiconductor element, the high-frequency circuit comprising a wiring pattern connected to a ground potential;

an insulating resin formed so as to seal at least the high-frequency semiconductor element and to have a rectangular surface, the insulating resin comprising an aperture exposing the wiring pattern; and

a metal thin film formed on an upper surface of the insulating resin,

wherein the wiring pattern is electrically connected to the metal thin film at the aperture.

2. The high-frequency module according to claim 1,

wherein the aperture has a minimum width of at least 0.2 mm and at most 5 mm.

3. The high-frequency module according to claim 1, wherein a film thickness of the metal thin film is at least 1 μ

m or more and at most 300 μ

m.

4. The high-frequency module according to claim 1, wherein the metal thin film is multilayered.

5. The high-frequency module according to claim 1, wherein the aperture in the insulating resin is provided at a periphery of the surface of the substrate.

6. The high-frequency module according to claim 1, wherein the aperture is a cut-out formed on a side face of the insulating resin.

7. The high-frequency module according to claim 1, wherein at least one inner side face of the aperture in the insulating resin is tapered such that the inner side face defines an acute angle with the substrate surface on the insulating resin side.

8. The high-frequency module according to claim 6, wherein at least one side face of the cut-out of the insulating resin is tapered such that the side face defines an acute angle with the substrate surface on the insulating resin side.

9. The high-frequency module according to claim 1, wherein the substrate is a resin substrate or a ceramic substrate.